Abstract: A method for manufacturing a circuit board includes the following steps. First, a core layer is provided, wherein the core layer includes a first dielectric layer, and first and second metallic layers. A through hole is formed in the core layer. The core layer is disposed on a supporting plate, and an embedded component is disposed in the through hole, wherein the second metallic layer contacts the supporting plate, and the embedded component has at least one electrode contacting the supporting plate. The embedded component is mounted in the through hole. The supporting plate is removed. The first and second metallic layers are removed, and the thickness of the electrode of the embedded component is decreased. Third and fourth metallic layers are formed respectively, wherein the fourth metallic layer is electrically connected to the electrode of the embedded component. Finally, the third and fourth metallic layers are patterned so as to respectively form first and second patterned circuit layers.

Abstract: In a roll-to-roll step, an adhesive solution is applied to a release film 1 including a polyethylene terephthalate film and this film 1 is passed through a drying oven 500 regulated to 60 to 150° C. to thereby form an adhesive layer 2. Subsequently, an insulating film 3 including a polyimide film is laminated on the adhesive layer 2 at room temperature (about 25° C.) to thereby produce a layered product 6 including the release film 1, adhesive layer 2 and insulating film 3. Next, the release film 1 is stripped from the layered product 6 and a conductor film 4 including a copper foil is laminated to the adhesive layer 2 to thereby produce a conductor-clad laminate 8.

Abstract: The invention relates to a device (11) for handling an article (13) such as a coil spring, and to an installation for handling an article. The device (11) comprises a body (10) having an internal housing (12) suitable for containing said article (13), said housing (12) presenting at least one open end (10A, 10B) and a constriction zone (14) that is suitable in a stable state, in which said constriction zone (14) presents a reduce dimensions (D14X) that is reduced in a first direction (X), for retaining said article (13) inside the body (10), and for being deformed to adopt a deformed configuration enabling said article (13) to be inserted into the housing (12) or enabling said article (13) to be extracted from the housing (12). The installation includes force-application means for acting on the device to change it between its stable state and its deformed configuration.

Abstract: The invention is a modular assembly of modular objects for autonomously executing a variety of tasks. The modular assembly consists of a modular object called a platform, one or more modular objects called modules which are mounted to the platform in accordance with a modular assembly system, and a modular bus system for distributing electrical power and electrical signals among the modular objects in the modular assembly. The modular assembly system utilizes modular object fasteners (MOFs) and MOF-accommodating features of modular objects for facilitating the attachment of a plurality of modular objects to one another thereby creating a modular assembly in any one of a variety of configurations, an MOF being activatable when object attachment surfaces associated with two modular objects are superimposed and two object attachment points on the object attachment surfaces coincide.

Abstract: First, a unilayer wiring board is fabricated, which has wiring layers formed in desired shapes on both sides of an insulating base member; and a metal bump formed on the wiring layer on one side of the insulating base member. Then, a desired number of unilayer boards are prepared and stacked up. On that case, the board disposed in the uppermost layer is prepared without having a metal bump. The boards are positioned and stacked up in such a manner that a metal bump of one of adjacent boards is connected to a corresponding wiring layer of the other board. Thereafter, resin is filled into gaps between the stacked boards, and insulating layers are formed on both sides of a multilayer board obtained through the above steps, in such a manner as to cover the entire surface except pad areas defined at predetermined positions on the wiring layers.

Abstract: The invention relates to a device (10) for operating in a water chamber (7) of a heat exchanger (1) comprising a wall (6) of substantially hemispherical shape and, at its upper portion, a tube plate (5) traversed by a plurality of vertical holes (4). The device comprises at least one rail (11) furnished with members for attachment on the bottom face of the tube plate (5) and supporting at least one trolley (15) that can be moved along the said rail (11) and fitted with a pendular lifting means (19) and a robotic arm (20) comprising an attachment base (30) furnished with members for coupling on the bottom face of the tube plate (5) and a drive means interacting with the lifting means (19) to draw the attachment base (30) against the tube plate (5). The invention applies more particularly to the steam generator of a pressurized water nuclear reactor.

Abstract: A manufacturing method for manufacturing a liquid ejection element including a liquid flow path which is open at an ejection outlet for ejecting liquid, and an energy generating member for generating energy usable for ejecting the liquid from liquid flow path through the ejection outlet, the manufacturing method, includes a step of forming the energy generating member on a front side of a substrate; a step of forming a top plate member on the side having the energy generating member formed by the energy generating member forming step, wherein the top plate member is a member in which the liquid flow path and the ejection outlet are formed; and a step of thinning the substrate, having the top plate member formed thereon by the top plate member forming step, from a back side thereof.

Abstract: A mirror for a piezoelectric resonator consisting of alternately arranged layers of high and low acoustic impedance is manufactured by at first producing a first layer on which a second layer is produced, so that the second layer partially covers the first layer. Then, a planarization layer is applied on the first layer and on the second layer. Subsequently, a portion of the second layer is exposed by structuring the planarization layer, wherein the portion is associated with an active region of the piezoelectric resonator. Finally, the resulting structure is planarized by removing the portions of the planarization layer remaining outside the portion.

Abstract: A unique tubular work piece is disclosed along with a novel method and apparatus for manufacturing tubular work pieces from sheet metal stock lighter and stronger structures with less waste and less cost than prior methods.

Abstract: Provided is a bending rigid printed wiring board which facilitate the mounting of electric parts (realization of a high producibility and high assemblability substrate circuit) and enables spaces to be saved and which can be easily manufactured. That is, provided is a bending rigid printed wiring board, which is characterized in that a heat resistant resin layer is laminated on a front surface of a hard core material provided so as to contain a gap portion and also on a top surface of the gap portion, in that a heat resistant resin layer is laminated on a rear surface of the core material except the gap portion, in that a conductor layer is laminated and firmly fixed via the heat resistant resin layers and in that the conductor layer is etched, whereby a circuit is formed.

Abstract: A method for coupling a battery within an embedded system is described. The method includes creating a hole extending through a printed circuit board (PCB), inserting a portion of the battery into the hole, and electrically coupling the battery to at least one contact.

Abstract: A contact element for producing an electric contact has a laser cut conducting plate, with the contour of the laser cut conducting plate including at least two tips, which are embodied as contact tips for a contact pad of a part, connected to each other by a separating area, such that a one-piece semi-finished part is embodied.

Abstract: In a method of fabricating an exhaust gas handling device, particularly an automotive emission control device, an insert, for example comprising a substrate and a support matting, is sensed as to its specific elasticity before it is clamped in place in an outer housing. For sensing, the insert is pressurized from without in a sensing station. Via the applied pressure and the displacement of the sensing tool the displacement of the insert at which it is to be clamped in place in the outer housing is determined. Then, the insert is fitted in an outer housing the inner dimensions of which correspond to the previously sensed wanted outer dimensions of the insert in the wanted compression.

Abstract: A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture is bifurcated into a first board carrying common circuit components in a surface mount configuration suitable for high volume production, and a second board carrying application specific circuit components in a wave soldered stick mount configuration.

Abstract: A method of supplying ink to ink ejection nozzles on a printhead for an inkjet printer with a print engine controller for controlling the printhead operation involving the provision a printhead IC having an array of the ink ejection nozzles formed on a substrate, the provision of circuitry for electrical connection to the print engine controller, the provision of a support member for supporting the printhead integrated circuit and the circuitry within the printer, the provision of a thermoplastic polymer sealing film, and securing the polymer film to a mounting surface of the support member by applying heat and pressure for a predetermined time, mounting the printhead integrated circuit and the circuitry to the support member via the polymer film and, electrically connecting the circuitry to the printhead integrated circuit. The mounting surface has ink feed channels formed in it and the polymer film is attached to the mounting surface between the ink feed channels and the printhead integrated circuits.

Abstract: A method of producing a coil which comprises steps of bending each of straight coil wires into a rectangular wave shape including in-slot portions to be disposed in slots of a stator core and turned portions connecting between the in-slot portions, turning a coil bend-forming portion that is one of the in-slot portions of each coil wire which becomes a folded bend of a phase winding by 180° around an axis thereof, twisting the turned portions of the coil wires together to weave the coil wires into a wire bundle, and folding the wire bundle at the coil bend-forming portions of the coil wires to place sides of the wire bundle to overlap each other to make the coil, thereby eliminating the 180° twisting of the coil bend-forming portions to produce the coil without any undesirable deformation of the phase windings.

Abstract: An apparatus for securely connecting mating ends of two power cords to prevent the mating ends of the two power cords from inadvertently or accidentally detaching from each other. The apparatus includes a flexible connector having a center segment, a first end and a second end. A preferred form of the flexible connector can readily accommodate varying configurations of mating ends of power cords. Preferably, the flexible connector is substantially symmetrical to facilitate installation. The first end has a first opening and the second end has a second opening. The center segment, the first end and the second end are manipulable to form a first retaining member and a second retaining member for securing a first end of a first power cord to a first end of a second power cord. Preferably, the flexible connector is configured such that it may not be inadvertently or accidentally dislodged from the first power cord or the second power cord.

Abstract: A method for forming a loop winding having a plurality of meandering parts and disposed in a stator of a motor which includes: disposing the loop winding between a first die unit having a plurality of first dies and a second die unit having a plurality of second dies; and press forming the loop winding between the first dies and the second dies by relatively moving the first die unit and the second die unit toward each other, wherein the press forming step is so performed as to provide the loop winding with a plurality of meandering parts and, simultaneously, to reduce the loop winding in the radial direction.

Abstract: Xerographic micro-assembler systems and methods are disclosed. The systems and methods involve manipulating charge-encoded micro-objects. The charge encoding identifies each micro-object and specifies its orientation for sorting. The micro-objects are sorted in a sorting unit so that they have defined positions and orientations. The sorting unit has the capability of electrostatically and magnetically manipulating the micro-objects based on their select charge encoding. The sorted micro-objects are provided to an image transfer unit. The image transfer unit is adapted to receive the sorted micro-objects, maintain them in their sorted order and orientation, and deliver them to a substrate. Maintaining the sorted order as the micro-objects are delivered to the substrate may be accomplished through the use of an electrostatic image, as is done in xerography.

Abstract: Methods of lapping rows of recording heads are described after an air bearing surface (ABS) damascene process is performed. The ABS damascene process uses a selective etching process to form voids in the row of recording heads where conductive material forms a feature in the recording head, such as a wrap around shield. The conductive material is then deposited on the ABS of the row to fill the voids, and the row is lapped. According to methods provided herein, the resistance of one or more lapping guides in the row of recording heads is monitored to determine when the conductive material is removed by the lapping process. When the monitored resistance indicates that the conductive material is removed, the lapping process is stopped. The resistance across one or more lapping guides may also be used to control the lapping process to uniformly lap the conductive material from the ABS.