Abstract: An apparatus 30 for coupling a first member 15 and a second member 17 by a clip and a screw is constituted by member moving means 131L, 131R for moving the second member 17 relative to the first member 15, reaction force detecting means 132L, 132R provided to the member moving means 131L, 131R for detecting a press reaction force generated when the second member 17 is matched to the first member 15, clip fitting determining means 135L, 135R for determining whether the clip is correctly fitted to a clip hole by reading the reaction force detected by the reaction force detecting means 132L, 132R, and screw fastening means 149 for fastening the screw when acceptable information is provided by the clip fitting determining means 135L, 135R.

Abstract: A method of manufacturing a deflectable electrophysiological catheter includes constructing a shaft having a distal end and at least one lumen. The method further includes inserting a component into the lumen, and processing at least a portion of the distal end to reduce the cross-sectional profile of the lumen to capture/confine the component. A catheter manufactured using this method includes a shaft having at least one lumen. The lumen comprises a longitudinally-extending trough defined by a longitudinally-extending recess, within which a component is disposed, and a longitudinally extending open edge. The lumen further comprises a longitudinally-extending channel defined by a longitudinally-extending cavity and by the open edge of the trough. A planarity wire is disposed within the cavity and is configured to close the open edge of the trough to within a pre-defined tolerance that is less than the size of the component to retain the component in the recess.

Abstract: A weaving machine for an rotary electric machine coil assembly is disclosed including a rotating and driving section having timing belts causing rotary pulleys to rotate about their axes under the same attitudes while causing the rotary pulleys to rotate about an axis of a stationary pulley, movable members placed on the rotary pulleys to be movable in X- and Y-directions, coil feed magazines inclined such that coil wire segments have one ends slidably supported on the movable members and axes of the coil wire segments cross on a rotating axis of the rotary table, an orbit specifying member for specifying an orbit, in which the coil feed magazines are caused to rotate, in a rectangular shape, a rotating and driving member for permitting the coil feed magazines to perform synchronized rotating movements, and a coil transfer device operative to grip the coil wire segment for transfer.

Abstract: A component mounting method of a multilayer printed wiring board includes a plurality of solder bumps to mount electronic components formed on both of or either of the front and back thereof, wherein when the solder bumps are formed of any of first, second, third and fourth solders, the first, second, third and fourth solders have different melting points and the melting points of the first, second, third and fourth solders are arranged as the melting point of the first solder, the melting point of the second solder, the melting point of the third solder and the melting point of the fourth solder in order of high melting point and the first, second, third and fourth solders are sequentially used to solder electronic components and the like in order of high melting point. Further, in that case, it is preferable that the solder bump having large volume should be soldered earlier than other solder bumps.

Abstract: A printed circuit board (PCB) and appertaining method of manufacturing are provided. The method includes: coating a metal layer on the entire surface of a substrate having an outer surface on which an interconnection pattern is formed; partially removing the metal layer from the surface of the substrate to form a window for a chip to be mounted therein and partially exposing the interconnection pattern to form a bonding finger; forming a first insulating layer on the metal layer by primarily anodizing the metal layer; electroplating a surface of the bonding finger by supplying power to the metal layer; and forming a second insulating layer disposed below the first insulating layer by entirely and secondarily anodizing the metal layer. A gold electroplating process can be performed without a lead wire, and an oxide layer formed by an anodizing process can protect circuits formed on the substrate and electrically insulate them.

Abstract: In a method of producing a honeycomb structure molding die composed of feed holes through which molding material is fed and slit grooves communicated with the feed holes for the use of molding a honeycomb structure body, the slit grooves are formed on one surface of a metal material in a lattice arrangement by repeatedly moving a thin circular grindstone blade which is rotating in a straight-line direction or a line direction approximating a straight line in order to cut the surface of the metal material. In particular, the method removes fine metal powder, generated by cutting the surface of the metal material, using polishing grooves formed in a dressing grindstone disposed in front of the metal material every cutting of the metal material during the slit groove formation.

Abstract: A method of forming an isolated electrically conductive contact through a metallic substrate includes creating at least one via through the substrate, where the via includes a first opening in a top surface of the substrate, a second opening in an opposing bottom surface and at least one continuous sidewall extending therebetween. A dielectric sleeve is formed on the at least one sidewall of the via while preserving at least a portion of the through via. An electrically conductive filler is then placed into the via. In the examples disclosed, the filler may be a conductive ink or a conductive epoxy.

Abstract: An automatic or semiautomatic method of assembly of radiation digital imaging tiles to form a one or two dimensional imaging panel whereby the imaging tiles are provided with alignment mark(s), inherent or specific, and a mother board or substrate is also provide with alignment mark(s) and the imaging tiles are mounted on the mother board by means of mechanical pick and place mechanism, whereby the distances of corresponding alignment mark are set to predetermined values, programmed in the automatic machine.

Abstract: In a method of manufacturing a probe card, a plurality of probe modules, including a sacrificial substrate and probes on the sacrificial substrate, is prepared. The probe modules are mutually aligned to form a probe module assembly having the aligned probe modules and a desired size. The probe module assembly is then attached to a probe substrate. Thus, the probe card having a large size may be manufactured.

Abstract: A method includes providing a voltage switchable dielectric material having a characteristic voltage, exposing the voltage switchable dielectric material to a source of ions associated with an electrically conductive material, and creating a voltage difference between the source and the voltage switchable dielectric material that is greater than the characteristic voltage. Electrical current is allowed to flow from the voltage switchable dielectric material, and the electrically conductive material is deposited on the voltage switchable dielectric material. A body comprises a voltage switchable dielectric material and a conductive material deposited on the voltage switchable dielectric material using an electrochemical process. In some cases, the conductive material is deposited using electroplating.

Abstract: An apparatus and method adapted to facilitate removal of stator vane segments in a slot of a casing of a rotating machine with stator vanes segments and rotating blades. The apparatus includes a compression device adapted to apply a pushing force on a rear surface of a stator vane segment, a clearing element adapted to free adhesion materials holding the stator vane segment to the dovetailed slot of the lower casing of the rotating machine with stator vanes segments and rotating blades, and a tension device adapted to apply a pulling force on a forward part of the stator vane segment.

Abstract: According to one embodiment, an input-output (I-O) panel is transformed. The I-O panel is configured to couple to an array of first midplane connectors of a first shelf configured according to a first format, where the first shelf has rear access. The I-O panel comprises an array of I-O panel connectors and defines an xy-plane. An array of second midplane connectors of a second shelf is transformed to substantially align the second midplane connectors with the I-O panel connectors. The second shelf is configured according to a second format, where the second shelf has front access. The array of second midplane connectors is arranged in columns defining a midplane column axis and rows defining a midplane row axis.

Abstract: A method for manufacturing an electronic circuit board which contains an electronic circuit on a main surface of a glass substrate according to the invention sequentially performs a step of electrically inspecting the main surface of the glass substrate on which the electronic circuit is formed, a step of specifying positions and defect types of defects on the main surface of the glass substrate, a step of calculating reference point coordinates on the main surface of the glass substrate and correcting the coordinates, a step of extracting respective defects from an image around the defects and specifying a defect to be corrected in the extracted defects by referring to a defect existing range registered in advance for each defect type, and a step of cutting the specified defect. By this method, a foreign material adhering to the glass substrate is not erroneously judged as short-circuit defect causing short-circuit on the electronic circuit, and only defect actually requiring correction can be removed.

Abstract: A high voltage capacitor design is provided that provides improved performance. The high voltage capacitor includes a stack of mechanically bonded capacitor cells, which in one variant utilize a separator formed of two layers of paper. In one version, the high voltage capacitor may be used as a capacitative voltage divider.

Abstract: A printed circuit board including a conductor portion, an insulating layer formed over the conductor portion, a thin-film capacitor formed over the insulating layer and including a first electrode, a second electrode and a high-dielectric layer interposed between the first electrode and the second electrode, and a via-hole conductor structure formed through the second electrode and insulating layer and electrically connecting the second electrode and the conductor portion. The via-hole conductor structure has a first portion in the second electrode and a second portion in the insulating layer. The first portion of the via-hole conductor structure has a truncated-cone shape tapering toward the conductor portion.

Abstract: A hearing aid includes a shell (104) manufactured by a rapid prototyping process, so as to include a first part customized to adapt it to the shape of the ear canal of a user, and a second part that defines an aperture; an electronics module; and a plug (200) with means for retaining it in a fixed position in the shell. The shell has guideways (212) for guiding lateral portions of the plug to support the plug in the aperture. The shell is adapted to receive by the aperture the electronics module; and the electronics module is adapted to engage a lip (206) of the plug to secure it in the shell. The invention further provides a method of assembling a part of a hearing aid.

Abstract: Embodiments of buffer coatings for semiconductor and integrated circuit manufacturing are presented herein.

Abstract: A series of electric terminals in which each member of the series has an identical receptacle portion at one end and a unique cable attachment portion at an opposite end is manufactured by forming a generic strip of partially formed terminals having a receptacle portion at one end in a first progressive die forming operation for all members of the series of electric terminals. Strips of completely formed electric terminals of particular members of the series of electric terminals are then completed in respective unique die progressive die forming operations using the generic strip of partially formed terminals. A modular die may be used for forming the strips of completely formed electric terminals from the intermediate generic the strip of partially formed terminals.

Abstract: The present invention directs to fabrication methods of single-sided or double-sided multi-layered substrate by providing a lamination structure having at least a core structure and first and second laminate structures stacked over both surfaces of the core structure. The core structure functions as the temporary carrier for carrying the first and second laminate structures through the double-sided processing procedures. By way of the fabrication methods, the production yield can be greatly improved without increasing the production costs.

Abstract: Methods and apparatus for removing condensed metal from the surfaces of metal processing chambers, such as, a vacuum induction metal (VIM) furnaces having, for example, condensed Mg or Ti, are disclosed. The methods and apparatus provide a robotic arm end positioned in the furnace having a nozzle operatively connected to a source of dry ice. The robotic arm end directs a stream of dry ice particles against the surface of the furnace to displace condensed metal. The displaced metal is collected for reuse or disposal. Aspects of the invention provide a safe and automated process for cleaning process chambers and recovering metal that can typically be dangerous when performed by conventional methods.