Patents Examined by Derris H. Banks
  • Patent number: 7832097
    Abstract: A method includes forming a patterned sacrificial layer on a first carrier and a patterned trace layer on the patterned sacrificial layer. The patterned sacrificial layer and the patterned trace layer are laminated to a dielectric material. The first carrier and the patterned sacrificial layer are removed creating sacrificial layer gaps above the patterned trace layer. The sacrificial layer gaps are filled with a trace layer isolation dielectric material. Shield trenches are laser-ablated within the dielectric material and on opposite sides of a signal trace of the patterned trace layer. The shield trenches are filled with an electrically conductive material to form shield walls. The electrically conductive material is patterned to form a shield top. The shield top, the shield walls, and a second carrier form a bias shield around the signal trace.
    Type: Grant
    Filed: January 23, 2008
    Date of Patent: November 16, 2010
    Assignee: Amkor Technology, Inc.
    Inventors: Ronald Patrick Huemoeller, Sukianto Rusli, Nozad Karim
  • Patent number: 7827660
    Abstract: A bimorphic structure responsive to changes in an environmental condition, sensor structures incorporating one or more of such bimorphic structures, and a method of forming such bimorphic structures. The sensor structure has an electrically-conductive first contact on a substrate, and a bimorph beam anchored to the substrate so that a portion thereof is suspended above the first contact. The bimorph beam has a multilayer structure that includes first and second layers, with the second layer between the first layer and the substrate. A portion of the first layer projects through an opening in the second layer toward the first contact so as to define an electrically-conductive second contact located on the beam so as to be spaced apart and aligned with the first contact for contact with the first contact when the beam sufficiently deflects toward the substrate.
    Type: Grant
    Filed: July 30, 2008
    Date of Patent: November 9, 2010
    Assignee: Evigia Systems, Inc.
    Inventors: Bishnu Prasanna Gogoi, Navid Yazdi
  • Patent number: 7827677
    Abstract: A component mounting system includes first to third (pickup, transfer, and placement) stations. A component supplied at a component supply is picked up by a transport head at the pickup station and then transferred to a placement head at the transfer station. The placement head carries the component to the placement station where the component is placed and mounted onto a substrate such as a circuit board. The component, when held by the placement head, is recognized by an imaging device at or in the vicinity of the transfer station.
    Type: Grant
    Filed: September 1, 2005
    Date of Patent: November 9, 2010
    Assignee: Panasonic Corporation
    Inventors: Yasuharu Ueno, Shozo Minamitani, Shinji Kanayama, Takashi Shimizu, Satoshi Shida, Shunji Onobori
  • Patent number: 7827666
    Abstract: The present alignment tool, method, and system improve the alignment of a driver to a motor. The alignment tool includes a securing ring, a track, and a rotatable ring. The rotatable ring of the alignment tool eliminates the onerous and dangerous rotation of the driver, or motor, previously required for aligning the motor to the pump.
    Type: Grant
    Filed: August 23, 2006
    Date of Patent: November 9, 2010
    Assignee: Southern Nuclear Operating Company, Inc.
    Inventors: Tommy B. Harlon, Benji J. Hodges, Steve Thomas
  • Patent number: 7827691
    Abstract: A method for manufacturing a nozzle plate, which has a nozzle hole, includes radiating of a plurality of laser beams. The method further includes applying of the plurality of laser beams to at least one axial end surface of a plate member substantially throughout an inner circumferential periphery, which defines a boundary between a small hole defining the nozzle hole and the plate member.
    Type: Grant
    Filed: June 27, 2007
    Date of Patent: November 9, 2010
    Assignees: Denso Corporation, Komatsuseiki Kosakusho Co., Ltd
    Inventors: Masanori Miyagawa, Tsunehiro Uehara
  • Patent number: 7823279
    Abstract: A packaged device may be provided with an in package power supply. The in package power supply may be selectively coupled to another component when the packaged device is not active.
    Type: Grant
    Filed: April 1, 2002
    Date of Patent: November 2, 2010
    Assignee: Intel Corporation
    Inventors: Steven R. Eskildsen, Duane R. Mills
  • Patent number: 7823277
    Abstract: A method for preparing a bipolar plate assembly for a fuel cell stack is provided. The method first includes the steps of providing a first unipolar plate having a first active area with a plurality of channels formed on a first inner surface thereof, and a second unipolar plate having a second active area with a plurality of lands formed on a second inner surface thereof. The first unipolar plate and the second unipolar plate are aligned to dispose the first active area adjacent the second active area. A first pressure is then applied to the first and second active areas to pre-nest the first active area and the second active area. The perimeters of the first and second unipolar plates are then joined. A clamping fixture and associated method for assembling the bipolar plate assembly is also provided.
    Type: Grant
    Filed: January 30, 2008
    Date of Patent: November 2, 2010
    Assignee: GM Global Technology Operations, Inc.
    Inventors: Mark W. Keyser, Jeffrey A. Rock, Keith E. Newman, Lewis Dipietro, Scott Ofslager, Steven J. Spencer
  • Patent number: 7823261
    Abstract: The inventive subject matter relates to methods for reconditioning a barrel previously used for containing a substance, comprising the steps of determining cutting parameters specific to the barrel material to provide controlled cutting of the barrel material; removing a desired depth of the barrel material using an automated high pressure water cutting device; testing for a remnant of the substance using a sensor device; optionally spraying with a dissolving agent; and repeating the steps of removing and testing upon detecting the presence of the substance in or on the barrel. Additionally, the inventive methods comprise applying a liquid to the wood of the reconditioned barrel to control evaporation of the barrel contents.
    Type: Grant
    Filed: October 30, 2006
    Date of Patent: November 2, 2010
    Inventor: Eugene Joseph Rogers
  • Patent number: 7823280
    Abstract: The present invention relates to a connector of an electromagnetic clutch for a compressor and a manufacturing method thereof. The method includes the steps of arranging a leading end of a lead wire 62 or 72 of at least one discharge device 60 or remaining magnetic field removing device 70, which configures a surge absorbing circuit, to a terminal 50 installed in a connector 30 configuring a field coil assembly and having a coupling slot 56 formed in one side thereof; plastically deforming at least one slot bridge 57 to fix the lead wire 62 or 72 to the coupling slot 56; and making the connector 30 in a state where the terminal 50 is fixed to an assembly of at least the discharge device 60 or remaining magnetic field removing device 70 by injection molding.
    Type: Grant
    Filed: November 13, 2008
    Date of Patent: November 2, 2010
    Assignee: Halla Climate Control Corp.
    Inventors: Suk-Jae Chung, Sung-Taeg Oh, Dae-Yong Park, Hwa-Yeop Shin
  • Patent number: 7823282
    Abstract: A method for connecting at least one wire to a contact element to facilitate connection of the wire to a power source comprising the following steps: a) preparation of the contact element which is fitted with a groove for receiving at least one wire; b) insertion of the wire into the groove of the contact element; c) lowering an electrode onto the contact element; and d) heating of the area around the groove by means of the electrode while simultaneously deforming the area around the groove thereby embedding the wire lying in said groove.
    Type: Grant
    Filed: June 24, 2005
    Date of Patent: November 2, 2010
    Assignee: Friatec Aktiengesellschaft
    Inventors: Andre Heinzel, Andreas Hojenski
  • Patent number: 7818879
    Abstract: A system for connecting circuit boards is provided. A plurality of overlapping spaced apart circuit boards have a plurality of conductive pins passing through holes in the circuit boards. A connector includes a flexible sheet insulator and a plurality of conductive surfaces separated and supported by the flexible insulator. At least one of the conductive surfaces has a hole there through and a bent compliant lead extending there from. The hole engages one of the pins, and the complaint lead connects to one of the circuit boards.
    Type: Grant
    Filed: March 13, 2009
    Date of Patent: October 26, 2010
    Assignee: General Dynamics Advanced Information Systems, Inc.
    Inventor: Deepak K. Pai
  • Patent number: 7818855
    Abstract: Methods of making thin film capacitors formed on foil by forming onto a thin film dielectric in a single deposition event an integrally complete top electrode having a minimum thickness of at least 1 micron.
    Type: Grant
    Filed: October 8, 2007
    Date of Patent: October 26, 2010
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: William Borland, Cengiz Ahmet Palanduz, Olga L. Renovales
  • Patent number: 7814652
    Abstract: A sensor assembly for sensors such as microfabricated resonant sensors is disclosed. The disclosed assembly provides improved performance of the sensors by providing a thermally insensitive environment and short pathways for signals to travel to processing components. Further, the assembly provide modular construction for the sensors and housing modules, thereby allowing replacement of the sensors at a lower cost. The assembly includes a sensor module including a sensor formed on a conductive substrate with a cavity formed on one surface. The substrate has conductive vias extending from the cavity to a second surface of the substrate. A housing assembly accommodates the sensor and includes a rigid housing, preferably made from a ceramic. An electronic component, such as an amplifier, is mounted on the rigid housing. The electronic component electrically engages the vias substantially at the second surface of the substrate. The electronic component receive signals from the sensor through the vias.
    Type: Grant
    Filed: July 25, 2008
    Date of Patent: October 19, 2010
    Assignee: BioScale, Inc.
    Inventors: Colby Bellew, Boyce E. Collins, Kelvin Liu
  • Patent number: 7814634
    Abstract: A tool for extracting or inserting a connector into a connector receptacle includes a tool body having an elongated shape with a first end and a second end. The first end is adapted to engage and stabilize the connector.
    Type: Grant
    Filed: July 13, 2005
    Date of Patent: October 19, 2010
    Assignee: Alcatel-Lucent USA Inc.
    Inventors: Errol Gladstone Francis, Ray C Mitchell
  • Patent number: 7814645
    Abstract: A mounting apparatus applies ultrasonic vibration exactly to a junction between a SMD and a SMD receiving device and maintains the junction at the suitable temperature, in simple construction in ultrasonic bonding of the SMD and the SMD receiving device held by holding unit. This includes SMD holding unit, SMD receiving device holding unit, moving unit moving at least one of the SMD holding unit and SMD receiving device holding units to contact each other, vibration generating unit applying ultrasonic vibration to the a contact portion between the SMD and the SMD receiving device, pressing unit applying an bias force between the SMD and SMD receiving device, heating unit arranged movably so as to surround in a noncontact manner a portion of the SMD holding unit near the SMD and heating the SMD holding unit, and interlocking unit interlocking the heating unit with the SMD holding unit.
    Type: Grant
    Filed: July 18, 2008
    Date of Patent: October 19, 2010
    Assignee: TDK Corporation
    Inventors: Toru Mizuno, Tomomi Asakura, Yuji Saito, Hiroyuki Takano, Toshinobu Miyagoshi
  • Patent number: 7814654
    Abstract: The invention relates to a method for removing a cable core from a cable sheath, which cable core comprises an envelope (8), wherein, at an end of the cable (1), a flowable medium (22) is introduced under pressure into the cable tube (9) so as to reduce friction, and a tensile force (F) is exerted on the cable core at an end (5) of the cable (1). To provide a method by which existing cables can be freed from their core in as quick and inexpensive a manner as possible, it is provided for the flowable medium to be introduced precisely targeted into the annular space between the inner side of the cable sheath and the envelope (8) of the cable core.
    Type: Grant
    Filed: February 20, 2002
    Date of Patent: October 19, 2010
    Inventor: Alois Pichler
  • Patent number: 7814646
    Abstract: A compression assembly hand tool for attaching a connector to a coaxial cable tool includes a sliding carriage driven by handles through multiple stages of mechanical advantage to provide a very high level of compression assembly force in order to compress large diameter connectors. The middle and the back of a connector are engaged between relatively closely spaced, parallel, and opposed compression surfaces on the front of the tool and on the sliding carriage. Adapter inserts that slide into openings in the compression surfaces allow different connector sizes to be compressed. The tool allows the cable to extend outward from either end so that splice connectors may be attached. In the preferred design, a ratcheting system using two pawls provides the very highest level of compression force.
    Type: Grant
    Filed: October 31, 2007
    Date of Patent: October 19, 2010
    Assignee: Capewell Components Company, LLC
    Inventors: Andrew J. Tarpill, Tadeusz Zagula
  • Patent number: 7814637
    Abstract: An installation apparatus for installing a wire harness over a fixed structural body and a movable structural body which is slidingly movable to the fixed structural body, the installation apparatus includes a case that receives the wire harness such that the wire harness extends in a sliding direction of sliding movement of the movable structural body, and is folded back into a generally U-shape; and a slider that holds a distal end-side portion of the wire harness extending from the folded-back portion toward a distal end of the wire harness, and is slidably supported on the case so as to move in the sliding direction of the movable structural body, and is operatively connected to the movable structural body so as to move in accordance with the sliding movement of the movable structural body. A slit is formed in a wall of the case, and extends in the sliding direction of the movable structural body.
    Type: Grant
    Filed: August 16, 2006
    Date of Patent: October 19, 2010
    Assignee: Yazaki Corporation
    Inventor: Tomoyasu Terada
  • Patent number: 7810230
    Abstract: A sealing member fitting apparatus includes a sealing member transfer device that switches between a sealing member receiving position where the sealing member transfer device faces a sealing member holding device provided with a hollow sealing member and a sealing member fitting position where the sealing member transfer device faces an electrical wire clamping device. The sealing member transfer device receives the sealing member in the sealing member receiving position and fits the sealing member on a covering end portion of the electrical wire in the sealing member fitting position. An electrical wire insertion guide device is disposed between the sealing member transfer device and the electrical wire clamping device and is slidable along the electrical wire from a lead-out member to the covering end portion. The sealing member transfer device positions a central axis of the covering end portion substantially coaxially with a central axis of the sealing member.
    Type: Grant
    Filed: December 20, 2007
    Date of Patent: October 12, 2010
    Assignee: Tyco Electronics Japan G.K.
    Inventors: Yuji Ikeda, Koji Imai, Minoru Abe, Jun Funakawa, Koichi Nakajima, Daisuke Toma, Hirohide Miyazaki
  • Patent number: 7810234
    Abstract: An apparatus, and a method for forming, a split thin film capacitor for providing multiple power and reference supply voltage levels to electrical devices such as integrated circuits, may be useful in space restricted applications, and in applications that require very close electrical connections between the power consumer and the power supply. An example of both a space restricted application and a close coupling application may be an integrated circuit (IC) such as a microprocessor. The capacitor supplying and moderating power to the microprocessor needs to be closely coupled in order to respond to instantaneous power demands that may be found in high clock rate microprocessors, and the space inside a microprocessor package is very restricted.
    Type: Grant
    Filed: April 10, 2007
    Date of Patent: October 12, 2010
    Assignee: Intel Corporation
    Inventors: Cengiz A. Palanduz, Larry E. Mosley