Abstract: A circuit includes: a first node to receive a first current; a first resistive element receiving a first branch current of the first current; first transistors each including a first terminal connected to the second end of the first resistive element; a second resistive element connected to the first node and receiving a second branch current of the first current; a second node to receive a second current; a second transistor including a first terminal, the first terminal of the second transistor connected to the second node and receiving a first branch current of the second current; a third resistive element connected to the second node and receiving a second branch current of the second current; wherein a temperature coefficient is adjusted by a resistance of the second resistive element and a resistance of the third resistive element and corresponding to the first current.

Abstract: First and second memory cell arrays each having memory cells arranged in the X and Y directions lie side by side in the Y direction with space between them. A relay buffer is provided between first and second row decoders for buffering a control signal to be supplied to the second row decoder. An inter-array block between the first and second memory cell arrays is constituted by at least either a tap cell or a dummy memory cell. The relay buffer and the inter-array block are the same in position and size in the Y direction.

Abstract: A memory device includes a memory cell array, a write/read circuit, a control circuit and an anti-fuse array. The memory cell array includes a plurality of nonvolatile memory cells. The write/read circuit performs a write operation to write write data in a target page of the memory cell array, verifies the write operation by comparing read data read from the target page with the write data and outputs a pass/fail signal indicating one of a pass or a fail of the write operation based on a result of the comparing. The control circuit controls the write/read circuit and selectively outputs an access address of the target page as a fail address in response to the pass/fail signal. The anti-fuse array in which the fail address is programmed, outputs a repair address that replaces the fail address.

Abstract: A data storage circuit for storing data from volatile memory in response to a power loss, the data storage circuit including an input for receiving a power loss signal in response to a power loss from at least one power source, an input configured to receive data from a volatile memory, a single block of non-volatile matrix of memory cells and a driver circuit coupled to said single row of non-volatile matrix of memory cells. The driver circuit is configured to write data to and read data from said single block of non-volatile matrix of memory cells. The single block of non-volatile matrix of memory cells can be provided as a single row electrically erasable programmable read only memory (EEPROM).

Abstract: A resistive memory apparatus and a method of operating a resistive memory apparatus are disclosed. In an embodiment, a resistive memory apparatus can include a memory cell that includes at least two transistors and a resistive element. The resistive memory apparatus can further include a bit line through which data is exchanged with the memory cell, wherein the bit line electronically interconnects with the memory cell, and a bit line regulator connected to the bit line. The bit line regulator can regulate the bit line based on the state of the resistive element. The forming signals and voltage settings can be transmitted over the bit line regulator and across the bit line to the memory cell.

Abstract: Apparatuses and methods for refreshing memory of a semiconductor device are described. An example method includes producing, responsive to a first refresh command, a plurality of first refresh addresses and detecting, responsive to the plurality of first refresh addresses, that the plurality of first refresh addresses include a first defective address and a first non-defective address. The example method further includes refreshing, responsive to a second refresh command following the first refresh command, the non-defective first address without refreshing the first defective address.

Abstract: A semiconductor circuit includes first (IV1, IV3) and second (IV2, IV4) circuits, first (31) and second (32) transistors, a first storage element (35), and a driver (22, 23, 52, 53). The first (IV1, IV3) and second (IV2, IV4) circuits, respectively, apply inverted voltages of voltages at first (N1) and second (N2) nodes to the second (N2) and first (N1) nodes. The first transistor (31) is turned on to couple the first (N1) and third nodes. The second transistor (32) includes a gate coupled to the first node (N1), a drain and a source. One of the drain and the source is coupled to the third node, and another is supplied with a first control voltage (SCL1). The first storage element (35) includes a first end coupled to the third node and a second end supplied with a second control voltage (SCTRL). The first storage element (35) is able to take a first or second resistance state.

Abstract: Provided herein may be a semiconductor memory device and a method of operating the semiconductor memory device to program a selected physical page of the semiconductor memory device. The method may include performing a plurality of program loops. Each of the program loops may include: applying a bit line voltage based on data input to a page buffer of the semiconductor memory device; applying a two-step program pulse to a word line coupled to the selected physical page; performing a program verify operation on the selected physical page using a double verify scheme; and determining a bit line voltage to be applied in a subsequent program loop based on a result of the program verify operation.

Abstract: The present invention provides a semiconductor memory device capable of performing rapid erasing while reducing power consumption. In the flash memory of the present invention, the voltage of the P well is detected by the voltage detecting unit 200 during the erasing operation. When the voltage is lower than the threshold value, it is determined that the off leakage current of the selection transistor of the non-selection block is large, and the voltage of the global word line at the time of applying the next erase pulse is increased. When the voltage is above the threshold value, it is determined that the off leakage current is small, and the voltage of the global word line at the time of applying the next erase pulse is maintained.

Abstract: Apparatuses and methods related to memory disablement for memory security. Disabling the memory for memory security can include, responsive to receiving a trigger signal, provide a voltage, which may be in excess of an operating or nominal voltage, to the access circuitry. The voltage may thus be sufficient to render the access circuitry inoperable for accessing data stored in the memory array.

Abstract: Apparatuses including input buffers and methods for operating input buffers are described. An example input buffer includes a plurality of input buffer circuits, each receiving input data and activated by a respective clock signal. An input buffer circuit includes a decision feedback equalizer (DFE) having adjustable capacitances and reference capacitances to set a reference level of the input buffer circuit. The capacitance of the adjustable capacitances may be set by a code. The DFE provides a capacitance of the adjustable capacitances to a first sense node and further provides a capacitance of the reference capacitances to a second sense node to set the reference level of the input buffer circuit. The input buffer circuit provides output data based on the input data and the reference level set by the DFE.

Abstract: An erasing method adapted for a semiconductor memory device is provided. The erasing method includes executing a pre-program process on the semiconductor memory device, executing an erase process on the semiconductor memory device, executing an over-erase verification process on a plurality of memory cells of the semiconductor memory device, detecting a total current consumption of the plurality of memory cells, determining the number of the memory cells to be executed with a soft program process according to the total current consumption, and executing the soft program process on the memory cells based on the number of the memory cells.

Abstract: According to one embodiment, a magnetic memory device includes a first conductive layer, a first stacked body, and a controller. The first conductive layer includes a first region, a second region, and a third region between the first region and the second region. The first stacked body includes a first magnetic layer, a second magnetic layer provided between the third region and the first magnetic layer in a first direction crossing a second direction, and a first nonmagnetic layer provided between the first magnetic layer and the second magnetic layer. The second direction is from the first region toward the second region. The controller electrically is connected to the first region, the second region, and the first magnetic layer. The controller performs at least first to third operations. In the operations, the controller sets the first stacked body to first to third resistance state.

Abstract: Methods, systems, and apparatuses for self-referencing sensing schemes are described. A cell having two transistors, or other switching components, and one capacitor, such as a ferroelectric capacitor, may be sensed using a reference value that is specific to the cell. The cell may be read and sampled via one access line, and the cell may be used to generate a reference voltage and sampled via another access line. For instance, a first access line of a cell may be connected to one read voltage while a second access line of the cell is isolated from a voltage source; then the second access line may be connected to another read voltage while the first access line is isolate from a voltage source. The resulting voltages on the respective access lines may be compared to each other and a logic value of the cell determined from the comparison.

Abstract: Apparatuses and methods for reducing read disturb are described herein. An example apparatus may include a first memory subblock including a first select gate drain (SGD) switch and a first select gate source (SGS) switch, a second memory subblock including a second SGD switch and a second SGS switch, and an access line associated with the first and second memory subblocks. The apparatus may include a control unit configured to enable the first and second SGD switches and the first and second SGS switches during a first portion of a read operation and to provide a first voltage on the access line during the first portion. The control unit may be configured to disable the first SGD switch and the first SGS switches during a second portion of the read operation and to provide a second voltage on the access line during the second portion.

Abstract: Provided herein may be a memory system and a method of operating the same. The method of operating a memory system may include receiving a first program command, and performing an operation corresponding to the first program command, receiving a second program command while performing the operation corresponding to the first program command, delaying setting of a queue status register for the second program command by a first wait time, receiving a third read command before the first wait time elapses, and setting the queue status register for the third read command before setting the queue status register for the second program command.

Abstract: A data storage circuit for storing data from volatile memory to non-volatile memory is powered by a low power charge pump circuit that is independent of the power for the volatile memory and that is activated upon power loss. The low power charge pump circuit includes an amplifier, a voltage-controlled oscillator, a charge pump core, and a voltage divider. The amplifier outputs a current according to a voltage difference between a reference input voltage and a feedback voltage output from the voltage divider. The current is converted to a voltage that controls the oscillator, which outputs a series of pulses to power the charge pump core. The charge pump core in turn provides the output voltage, which may be used to power an attached load. The attached load may be a programming port for an EEPROM.

Abstract: An ephemeral system includes an ephemeral communications device and associated ephemeral memory system (onboard or peripheral) for securing user data. Different secure operating modes are provided for customizing user security requirements across end-to-end communications links, including in exchanges of electronic data between smartphone devices.

Abstract: A memory device is disclosed. The memory device includes a bottom contact and a memory layer connected to the bottom contact. The memory layer has a variable resistance. The memory device also includes a top electrode on the memory layer, where the top electrode and the memory layer cooperatively form a heterojunction memory structure. The memory device also includes a top contact on the top electrode; a first barrier layer, configured to substantially prevent the conduction of ions therethrough, where the first barrier layer is between the top electrode and the top contact, and where the first barrier layer has a resistivity less than 1e-4 ohm-m; and a second barrier layer, configured to substantially prevent the conduction of ions or vacancies therethrough, where the second barrier layer is between the memory layer and the bottom contact, and where the first barrier layer has a resistivity less than 1e-4 ohm-m.

Abstract: Techniques are provided for sensing a signal associated with a memory cell capable of storing three or more logic states. To sense a state of the memory cell, a charge may be transferred between a digit line and a node coupled with a plurality of sense components using a charge transfer device. Once the charge is transferred, one or more of the plurality of sense components may sense the charge with one of a variety of sensing schemes. Based on the charge being transferred using the charge transfer device and each sense component sensing the charge, a logic state associated with the memory cell may be determined. The number of sensed states may be correlated to the number of sense amplifiers. The ratio of the number of states read by the first sense component and the second sense component to the number of sense components may be greater than one.