Abstract: A z-axis compression connector includes a plurality of high-speed signal contacts arranged in a grid of M rows by N columns, and a plurality of signal return contacts arranged between the N columns. A first signal return contact is positioned mid-way in line between a first signal contact and a second signal contact, where the first signal contact is in a first row and a first column and the second signal contact is in the first row and a second column adjacent to the first column.

Abstract: Disclosed are a non-volatile memory including a negative capacitance blocking oxide layer, an operating method of the same, and a manufacturing method of the same. The non-volatile memory may include a tunneling oxide layer formed on a channel; a charge storage layer formed on one surface of the tunneling oxide layer; a negative capacitance blocking oxide layer in which a dielectric layer and an imprinted polarization layer are sequentially configured on one surface of the charge storage layer; and a gate formed on one surface of the negative capacitance blocking oxide layer.

Abstract: A semiconductor apparatus includes a command address control circuit. The command address control circuit is configured to receive a row command address signal and a column command address signal, and is configured to selectively invert the row command address signal and the column command address signal based on a logic level of at least one bit of the row command address signal.

Abstract: A system and method for efficiently creating layout for memory bit cells are described. In various implementations, a memory bit cell uses Cross field effect transistors (FETs) that include vertically stacked gate all around (GAA) transistors with conducting channels oriented in an orthogonal direction between them. The channels of the vertically stacked transistors use opposite doping polarities. The memory bit cell includes one of a read bit line and a write word line routed in no other metal layer other than a local interconnect layer. In addition, a six transistor (6T) random access data storage of the given memory bit cell consumes a planar area above a silicon substrate of four transistors.

Abstract: Differential programming of multiple resistive switching memory cells defining a bit is disclosed. The differential programming can mitigate invalid data values for the defined bit, referred to herein as an identifier bit. Embodiments of the present disclosure provide for detection of a program event(s) for a portion of resistive switching memory cells defining an identifier bit, and disconnecting a remainder of the memory cells from program supply voltage, prior to a duration of a program cycle. Additionally, the program cycle can be continued for the programmed memory cell(s) to facilitate a robust programming and enhance data longevity. The detection and subsequent disconnection can facilitate proper differential programming and mitigate unwanted program events that lead to invalid identifier bit results, as well as reducing power consumption for a program cycle of resistive switching memory.

Abstract: An information handling system includes a printed circuit board, a z-axis compression connector, and a compression attached memory module (CAMM). The compression connector coupled receives a first memory channel and a second memory channel from the PCB. The CAMM receives the first memory channel and the second memory channel from the first compression connector. The CAMM is configured to provide memory transaction on only the first memory channel.

Abstract: A memory device includes a clock input configured to receive a clock from a host device. The memory device also includes a command input configured to receive command and address bits from the host device. The memory device further includes multiple die stacked in a three-dimensional stack. A first die of the plurality of die includes a first plurality of memory cells and first local control circuitry. The first local circuitry includes division circuitry configured to receive the clock from the clock input, generate a divided clock having a lower frequency than that of the clock, and generate multiple clocks from the divided clock with each of the multiple clocks having a lower frequency than the divided clock. The memory device also includes one or more transmitters configured to transmit the multiple clocks using inter-die interconnects between the multiple die.

Abstract: Implementations described herein relate to a memory device with a fast write mode to mitigate power loss. In some implementations, the memory device may detect a condition associated with power supplied to the memory device. The memory device may detect one or more pending write operations to be performed to cause data to be written to memory cells of the memory device. The memory device may switch from a first voltage pattern, previously used by the memory device to write data to one or more memory cells of the memory device, to a second voltage pattern based on detecting the condition and based on detecting the one or more pending write operations. The memory device may perform at least one write operation, of the one or more pending write operations, using the second voltage pattern.

Abstract: A semiconductor device includes a ferroelectric field-effect transistor (FeFET), wherein the FeFET includes a substrate; a source region in the substrate; a drain region in the substrate; and a gate structure over the substrate and between the source region and the drain region. The gate structure includes a gate dielectric layer over the substrate; a ferroelectric film over the gate dielectric layer; and a gate electrode over the ferroelectric film.

Abstract: The present disclosure provides a semiconductor structure, a method of reading data from the semiconductor structure, and a method of writing data into the semiconductor structure. The semiconductor structure includes: a memory matrix, including a plurality of magnetic storage domains arranged in a staggered manner and including a first end, a second end, and an intermediate portion; and a reading and writing circuit, connected to the intermediate portion of the memory matrix and configured to write data into the magnetic storage domains and read data from the magnetic storage domains.

Abstract: A memory device includes a first layer, wherein the first layer includes a first memory array, a first row decoder circuit, and a first column sensing circuit. The memory device includes a second layer disposed with respect to the first layer in a vertical direction. The second layer includes a first peripheral circuit operatively coupled to the first memory array, the first row decoder circuit, and the first column sensing circuit. The memory device includes a plurality of interconnect structures extending along the vertical direction. At least a first one of the plurality of interconnect structures operatively couples the second layer to the first layer.

Abstract: A clock control circuit, a memory storage device, and a clock control method are disclosed. The method includes: tracking a frequency of a first signal from a host system; generating, in a first mode, a clock signal according to the frequency of the first signal; and generating, in a second mode, the clock signal without reference to the frequency of the first signal.

Abstract: A memory device includes at least one bit line, at least one word line, at least one memory cell, at least one source line, and a controller electrically coupled to the at least one memory cell via the at least one word line, the at least one bit line, and the at least one source line. The memory cell includes a first transistor, data storage elements, and second transistors corresponding to the data storage elements. The first transistor includes a gate electrically coupled to the word line, and first and second source/drains. Each data storage element and the corresponding second transistor are electrically coupled in series with the first source/drain of the first transistor and the bit line. The controller controllably applies a voltage other than a ground voltage to the at least one source line in an operation of a selected data storage element among the data storage elements.

Abstract: In an embodiment a device includes a supply node configured to receive a supply voltage, an output node configured to provide an output voltage, a plurality of switching stages coupled to the supply node and to the output node, a sensing circuit coupled to the supply node and configured to provide at least one sensing signal based on the supply voltage and a driver circuit coupled to the sensing circuit and to the plurality of switching stages, wherein the driver circuit is configured to provide the drive signal based on at least one sensing signal exceeding or failing to exceed at least one reference voltage level and to selectively bypass a selected number of the plurality of switching stages based on the drive signal thereby varying an output voltage level at the output node.

Abstract: The present technology relates to an electronic device. A memory device according to an embodiment includes a memory cell string including first memory cells included in a first channel area, second memory cells included in a second channel area, and dummy memory cells connected between the first memory cells and the second memory cells, a peripheral circuit configured to perform a program operation of storing data in the first and second memory cells, and a program operation controller configured to control the peripheral circuit to apply a first pass voltage to a dummy word line connected to the dummy memory cells during the program operation, apply a second pass voltage less than the first pass voltage to the dummy word line, and then apply a program voltage to a selected word line among a plurality of word lines connected to the first and second memory cells.

Abstract: A semiconductor memory device includes n physical banks, each of which is configured to be entirely or partially included in one of a first logic bank or a second logic bank and arranged in a row direction, wherein n is an integer that is greater than or equal to 3, and wherein a proportion of a sum of respective widths of the n physical banks in the row direction to a height of the n physical banks in a column direction is a real number multiple that is not a multiple of 2.

Abstract: There are provided an apparatus and method for performing impedance control (ZQ) calibration without a ZQ pin and an external resistor. The apparatus includes an output driver circuit connected to a signal pin interfacing with an external device; a register control word (RCW) configured to store an output driver impedance parameter related to a pull-up output voltage (VOH) condition of the signal pin; and a ZQ calibration circuit connected to the signal pin and configured to perform calibration using a VOH target level of the signal pin and control a termination resistance of the signal pin.

Abstract: A spin-orbit torque type magnetoresistance effect element including a magnetoresistance effect element having a first ferromagnetic metal layer with a fixed magnetization direction, a second ferromagnetic metal layer with a varying magnetization direction, and a non-magnetic layer sandwiched between the first ferromagnetic metal layer and the second ferromagnetic metal layer; and spin-orbit torque wiring that extends in a first direction intersecting with a stacking direction of the magnetoresistance effect element and that is joined to the second ferromagnetic metal layer; wherein the magnetization of the second ferromagnetic metal layer is oriented in the stacking direction of the magnetoresistance effect element; and the second ferromagnetic metal layer has shape anisotropy, such that a length along the first direction is greater than a length along a second direction orthogonal to the first direction and to the stacking direction.

Abstract: Dynamic program caching reduces latency of a program operation on multi-level cell (MLC) memory having at least three pages and programmable with multiple threshold voltage levels, such as a Triple Level Cell (TLC) NAND. A controller determines that the program operation can be initiated without loading all pages into the memory. In response, the NAND loads a first page and then executes portions of the program operation in parallel, at least in part, with loading subsequent pages. The NAND behavior is modified to monitor data loading completion times, to copy pages from a cache register to a data register as needed, and to resume program operation if a shutdown occurs. The portions of the program operation include a program prologue operation and a pulse verify loop for the first voltage level (L1) of the MLC memory.

Abstract: An apparatus for storing data in a nonvolatile memory includes a controller configured to erase a group of physical memory cells in the nonvolatile memory. The controller is configured to write multiple bits of information to each of a first group of physical memory cells in the nonvolatile memory. The controller is configured to map a logical address range to a physical address range for the first group of physical memory cells in the nonvolatile memory. The controller is configured to determine if the first group of physical memory cells fails a data integrity test. If the first group of physical memory cells fails the data integrity test, the controller writes at least some of the information stored in the first group of physical memory cells to a second group of physical memory cells in the nonvolatile memory. The controller writes a single bit of information per cell in the second group of physical memory cells.