Abstract: A memory device includes: a memory cell array including a plurality of memory cells; a peripheral circuit coupled to the memory cell array through word lines and bit lines, and suitable for performing one or more program loops on memory cells that are coupled to a selected word line of the word lines, each program loop including a program voltage application operation and a program verification operation; and a program control circuit suitable for controlling the peripheral circuit to decrease a level of a precharge voltage that is applied to the bit lines during the program verification operation when the number of program loops that are performed is greater than a reference number.

Abstract: Tracking circuitry for a memory device is disclosed. The tracking circuitry includes an inverter, a level shifter, delay circuitry, and a logic gate. The inverter is configured to receive a first clock signal and generate an inverted clock signal. The level shifter is configured to receive the first clock signal and the inverted clock signal and generate a level shifted clock signal. The delay circuitry is configured to receive the level shifted clock signal and generate an inverted level shifted clock signal. The logic gate comprises a first input configured to receive the first clock signal and a second input configured to receive the inverted level shifted clock signal. The logic gate is configured to generate a second clock signal based on the first clock signal and the inverted level shifted clock signal.

Abstract: A semiconductor device includes: a substrate extending in a first direction and a second direction intersecting with the first direction; a plurality of input/output pads disposed at one side of the substrate; a first circuit adjacent to the input/output pads in the first direction; a second circuit disposed to be spaced farther apart from the input/output pads in the first direction than the first circuit; a first memory cell array overlapping the first circuit; a second memory cell array overlapping the second circuit; first metal source patterns overlapping the first memory cell array and being spaced apart from each other in the second direction; and a second metal source pattern overlapping the second memory cell array and formed to have a width wider than a width of each of the first metal source patterns in the second direction.

Abstract: Embodiments relate to the field of semiconductors and provide a wordline driver circuit and a memory. The wordline driver circuit at least includes a first type of wordline drivers and a second type of wordline drivers, wherein each of the wordline drivers includes a PMOS transistor and an NMOS transistor. A first type of PMOS transistors in the first type of wordline drivers and a second type of PMOS transistors in the second type of wordline drivers are configured to receive different first control signals. The first type of PMOS transistors and the second type of PMOS transistors are arranged side by side, and the NMOS transistors included in the first type of wordline drivers and the NMOS transistors included in the second type of wordline drivers are positioned on the same side of the first type of PMOS transistors and the second type of PMOS transistors.

Abstract: Disclosed in some examples are methods, systems, devices, and machine-readable mediums that provide for techniques for scrambling and/or updating meta-data that enable an efficient internal copyback operation. In some examples, improved data distribution techniques decouple the scrambling key from a physical address to allow for copyback operations while maintaining data distribution requirements across a memory device. The controller may generate a seed value that is used by a scrambling algorithm to scramble the host-data and meta-data prior to the data being written. The seed value is then encoded and written to the page with encoded versions of the scrambled user data and meta-data—the random seed is written without scrambling the random seed.

Abstract: Differential programming of multiple resistive switching memory cells defining a bit is disclosed. The differential programming can mitigate invalid data values for the defined bit, referred to herein as an identifier bit. Embodiments of the present disclosure provide for detection of a program event(s) for a portion of resistive switching memory cells defining an identifier bit, and disconnecting a remainder of the memory cells from program supply voltage, prior to a duration of a program cycle. Additionally, the program cycle can be continued for the programmed memory cell(s) to facilitate a robust programming and enhance data longevity. The detection and subsequent disconnection can facilitate proper differential programming and mitigate unwanted program events that lead to invalid identifier bit results, as well as reducing power consumption for a program cycle of resistive switching memory.

Abstract: A control circuit, a method for reading and writing and a memory are provided. The control circuit includes a pre-charge circuit, an amplification circuit and an equalization circuit. The pre-charge circuit is directly electrically connected to at least one of a bit line or a complementary bit line. The amplification circuit has a first node and a second node. The equalization circuit is connected between the first node and the bit line and between the second node and the complementary bit line.

Abstract: An example method of performing memory access operations comprises: receiving a request to perform a memory access operation with respect to a set of memory cells connected to a wordline of a memory device; identifying a block family associated with the set of memory cells; determining, for each logical programming level of a plurality of logical programming levels, a corresponding default block family error avoidance (BFEA) threshold voltage offset value associated with the block family; determining a value of a data state metric associated with the set of memory cells; responsive to determining that the value of the data state metric satisfies a threshold criterion, determining, for each logical programming level of a plurality of logical programming levels, a corresponding sub-BFEA threshold voltage offset value; and performing the memory access operation by applying, for each logical programming level of the plurality of logical programming levels, a combination of the default BFEA threshold voltage value

Abstract: Methods, systems, and devices for random number generation based on threshold voltage randomness are described. For example, a memory device may apply a voltage to a chalcogenide element and increase the applied voltage at least until the applied voltage satisfies a threshold voltage associated with the chalcogenide element. The memory device may detect the state of an oscillating signal at a time at which the applied voltage satisfies the threshold voltage, and the memory device may output a logic value corresponding to the state of the oscillating signal. The threshold voltage of the chalcogenide element may vary in a statistically random manner across voltage applications, and hence the state of the oscillating signal at the time an applied voltage reaches the threshold voltage may likewise vary in a statistically random manner, and thus the corresponding logic value that is output may be a random value suitable for random number generation.

Abstract: A page buffer circuit includes a sensing latch circuit and a caching latch circuit. The sensing latch circuit is configured to receive and sense data that is stored in a memory cell during a normal read operation. The caching latch circuit is configured to receive and sense the data that is stored in the memory cell during a suspend read operation.

Abstract: In some embodiments, an integrated circuit (IC) device includes an active semiconductor layer, a circuitry formed within the active semiconductor layer, a region including conductive layers formed above the active semiconductor layer, and a memory module formed in the region. The memory device includes a three-dimensional array of memory cells, each adapted to store a weight value, and adapted to generate at each memory cell a signal indicative of a product between the stored weight value and an input signal applied to the memory cell. The memory module is further adapted to transmit the product signals from the memory cell simultaneously in the direction of the active semiconductor layer.

Abstract: A memory device in which reliability of a clock signal is improved is provided. The memory device comprises a data module including a clock signal generator configured to receive an internal clock signal from a buffer, and to generate a first internal clock signal, a second internal clock signal, a third internal clock signal, and a fourth internal clock signal having different phases, on the basis of the internal clock signal, and a first data signal generator configured to generate a first data signal on the basis of first data and the first internal clock signal, generate a second data signal on the basis of second data and the second internal clock signal, generate a third data signal on the basis of third data and the third internal clock signal, and generate a fourth data signal on the basis of fourth data and the fourth internal clock signal.

Abstract: Apparatus and methods are disclosed, including memory devices and systems. In an example, a memory module can include a first stack of at least eight memory die including four pairs of memory die, each pair of the four pairs of memory die associated with an individual memory rank of four memory ranks of the memory module, a memory controller configured to receive memory access commands and to access memory locations of the first stack, and a substrate configured to route connections between external terminations of the memory module and the memory controller.

Abstract: One aspect of this description relates to a memory cell. In some embodiments, the memory cell includes a first gate structure, a second gate structure, a third gate structure, a fourth gate structure, and a fifth gate structure that each extend along a first lateral direction, a first active structure extending along a second lateral direction and overlaid by respective first portions of the first to fourth gate structures, a second active structure extending along the second lateral direction and overlaid by respective second portions of the first to fourth gate structures, and a third active structure extending along the second lateral direction and overlaid by respective third portions of the third and fifth gate structures. In some embodiments, the first and second gate structures are aligned with each other, with the fourth and fifth gate structures aligned with a first segment and a second segment of the third gate structure, respectively.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a first gate structure extending along a first direction and electrically connected to a first transistor, a second gate structure extending along the first direction and electrically connected to a second transistor, a first active region extending along a second direction different from the first direction and across the first gate structure and the second gate structure, and a first conductive element extending along the second direction and disposed on the first active region. The first conductive element is electrically connected to the first active region. The first conductive element is electrically connected to the first active region, such that a short circuit between the first active region and the third transistor is formed. The first gate structure and the first active region form a first fuse element, and the second gate structure and the first active region form a second fuse element.

Abstract: A memory array and an operation method of the memory array are provided. The memory array includes first and second ferroelectric memory devices formed along a gate electrode, a channel layer and a ferroelectric layer between the gate electrode and the channel layer. The ferroelectric memory devices include: a common source/drain electrode and two respective source/drain electrodes, separately in contact with a side of the channel layer opposite to the ferroelectric layer, wherein the common source/drain electrode is disposed between the respective source/drain electrodes; and first and second auxiliary gates, capacitively coupled to the channel layer, wherein the first auxiliary gate is located between the common source/drain electrode and one of the respective source/drain electrodes, and the second auxiliary gate is located between the common source/drain electrode and the other respective source/drain electrode.

Abstract: Disclosed art a magnetic tunnel junction device, a magnetic memory using the same, and a method for manufacturing the same. The method for manufacturing the magnetic tunnel junction device may include the steps of a lamination step of forming an initial multilayer structure including at least one metallic oxide layer and a metallic layer on a substrate; a heat treatment step of heat-treating the initial multilayer structure; and a device forming step of forming a magnetic tunnel junction device of a final multilayer structure in which at least one metallic oxide layer and the metallic layer are converted to at least one ferromagnetic material layer and the oxide layer by heat treatment.

Abstract: A semiconductor memory device includes a memory cell array including a plurality of memory cell transistors, a word line connected to a gate of each of the memory cell transistors, a sequencer configured to control an operation of the memory cell array, and an input/output circuit. When the input/output circuit receives a command instructing an operation of continuously reading data of a plurality of pages from the memory cell transistors, the sequencer determines the data of the plurality of pages by continuously applying read voltages corresponding to the plurality of pages to be read, to the word line. In each continuous time period during which the control circuit applies read voltages for determining the data of one of the pages to the word line, the control circuit does not apply any read voltage for determining the data of another one of the pages to the word line.

Abstract: A sensing device for a non-volatile memory includes a reference circuit, two switches, a sensing circuit and a judging circuit. The reference circuit is connected to a first node. A first terminal of the first switch is connected with the first node and a control terminal of the first switch receives an inverted reset pulse. A first terminal of the second switch is connected with the first node, a second terminal of the second switch receives a ground voltage, and a control terminal of the second switch receives a reset pulse. The sensing circuit is connected between the second terminal of the first switch and a second node. The sensing circuit generates a first sensed current. The judging circuit is connected to the second node. The judging circuit receives the first sensed current and generates an output data according to the first sensed current.

Abstract: According to one embodiment, a memory system includes a semiconductor memory and a controller. The semiconductor memory includes blocks each containing memory cells. The controller is configured to instruct the semiconductor memory to execute a first operation and a second operation. In the first operation and the second operation, the semiconductor memory selects at least one of the blocks, and applies at least one voltage to all memory cells contained in said selected blocks. A number of blocks to which said voltage is applied per unit time in the second operation is larger than that in the first operation.