Abstract: Cooling apparatus of a magnetron having a plurality of embossed cooling fins for radiating high temperature heat generated by an anode of the magnetron. Each of the cooling fins includes an anode support boss for tightly receiving and supporting the anode, a pair of erected walls being provided at both sides of the cooling fin, and a plurality of embossments for causing cooling airflow to be forced toward the rear surface of the anode and providing a cooling passage. These embossments are provided between the anode and the erected walls in order to symmetrical to each other with respect to the cooling airflow. The embossments comprise a plurality of protruded embossments provided at a side of the cooling fin and a plurality of depressed embossments provided at the other side of the cooling fin. The protruded and depressed embossments have an interval which is gradually shortened such that it is minimized at the rear of the anode.

Abstract: An elongated ferromagnetic core is surrounded by two windings. Optional separators separate the core from the windings and one winding from the other winding. A tube-like ferromagnetic sheath covers the windings and core. The sheath and core are connected, preferably at both ends. At one end, one winding may be connected to a plug for connecting to a wall outlet for supplying an alternating current thereto. At the other end, the other winding may be connected to an external load for providing a voltage thereto. Optionally, an electrically insulating, thermally conductive, outer cover covers the ferromagnetic sheath. In a first embodiment, one winding is surrounded by the other winding. In a second embodiment, one winding surrounds a portion of the core and the other winding surrounds another portion of the core.

Abstract: A coolant for cooling a semiconductor element by direct immersion, cooling, which has an improved cooling capability, is disclosed. The coolant comprises a low boiling point fluorocarbon having a boiling point of 30.degree. C. to 100.degree. C. and a high boiling point fluorocarbon having a boiling point higher than that of the low boiling point fluorocarbon by at least 100.degree. C.; an amount of the high boiling point fluorocarbon being less than 20% by volume, based on the volume of the low boiling point fluorocarbon.

Abstract: An electronic device comprising at least one heat-generating electronic component and a passive electronic component in association with the heat generating component. The passive component comprises a porous preform of green silicon carbide or polygranular graphite, and a metal filling the porosities of the preform which can be aluminum, an aluminum alloy, magnesium or a magnesium alloy. The preform forms about 50 to 90% by volume of the passive component.

Abstract: An apparatus for containing and cooling an integrated circuit device includes a container defining a chamber, a first portion of the container includes a first heat sink. The apparatus further includes a second heat sink positioned within the chamber, the integrated circuit device being securable to the second heat sink. Moreover, the apparatus includes a cooling device interposed between the first heat sink and the second heat sink. In addition, the apparatus includes an insulator positioned in the chamber so as to provide thermal isolation between a second portion of the container and the cooling device.

Abstract: The present invention discloses a method and apparatus for conductively transferring heat away from electrical devices located on daughter boards attached to mother boards. The preferred method involves the steps of conductively transferring heat from each electrical device to a conductive layer located within the daughter board, transferring heat from the conductive layer within the daughter board to a conductive structure located on the surface of the daughter board, and transferring heat from the conductive structure to a cooling surface located on the cold plate. The preferred apparatus includes a mother board, a cold plate adjacent the mother board and attached to the mother board, a daughter board with an electrical device attached thereto, the daughter board attached to the mother board opposite the cold plate. The daughter board lies in a plane which is adjacent and substantially parallel to the plane of the mother board.

Abstract: The safety shutter device comprises, a fixed shutter blade (19) provided on the front face of the lead conductor carrying member (11), at least one shutter driving unit accommodated in an insertion space (18) which is between the lead conductor carrying members (11) or between one of the lead conductor carrying member and the side wall of a base frame (1) and secured there by the fixed shutter blades, and a pair of movable shutter blades (27) provided on the shutter driving units to be actuated by the pushed-in and drawn-out operation of the circuit breaker (2).

Abstract: An arrangement for cooling electronic components in a system. Several circuit boards are connected to a backplane electrically and through heat pipes, which are mounted on the boards and provide connections between the electronic components on the board and the cooling system. The circuit boards, including the attached heat pipes, can be removed from the backplane by detaching electrical connections on the boards from corresponding connectors on the backplane, while at the same time detaching the ends of the heat pipes from sockets in an expander which forms part of the cooling system. If desired, backplanes can be positioned on both sides of the expander, with sockets provided on both sides of the expander to receive end portions of heat pipes.

Abstract: An electromagnetic interference filter has an input socket, an insulated base, an insulated upper cover, a metal case, an L-shaped, elongated ground terminal, two short output terminals, a grounded bridge hook, two spring plates and the internal circuit elements. The two spring plates are fitted into openings on the upper and lower surfaces of the metal case which covers the insulated base. An oblique protruding block on either side of the input socket penetrates through a square hole on either side of the metal case to couple the case to the input socket. Upwardly oblique extending spring plates are provided on both of the upper and lower surfaces of the metal case which spring plates are pressed against casing walls to hold the assembly firmly and stably immobilized onto the casing walls.

Abstract: In an improved panel interior assembly of the type in which elongated bus bars are snap-fit into an insulating support structure a plurality of integrally molded pins are attached to the insulating support structure positioned to extend through holes in a pan to which the insulating support structure is to be attached. These pins are ultrasonically staked to securely hold the insulating support structure and bus bars attached thereto on the pan.

Abstract: A bracket 14 for mounting a lead frame 12 having pressure responsive electrical switches 20 is provided with a pair of bores 88 through the bracket at each switch station in alignment with recessed portions 78 and 86 in the bottom surface of the switch housing. A layer 92 of filter material is disposed between the bores and the recessed portions so that fluid flowing through the bores into the recessed portions will be forced to flow through the filter material to exclude particles of contamination larger than a selected size.

Abstract: A circuit board assembly comprising a surface-mounted microelectronic device combination, including a metallic base member having an insulating layer thereon, and a plurality of electrically conductive mounting pads patterned on the insulating layer. At least one pair of hermetically sealed diodes is bonded to the pads, such that each diode of each pair has one terminal bonded to a first pad, and the other terminal bonded to second and third pads, respectively. For example, a two-diode combination is provided with three leads, one for each pad, whereby various lead connections may be selected, for the purpose of using each diode separately; or for the purpose of using both diodes, either in series or in parallel.

Abstract: A pressure operated switch construction, parts therefor and methods of making the same are provided, the pressure operated switch construction comprising a housing having an external surface and carrying an electrical switch unit and a diaphragm assembly therein, and a compression spring unit carried by the housing and being interconnected to the switch unit and the diaphragm assembly to control the operation thereof in relation to the compressive setting of the spring unit, the housing having a bracket member extending outwardly from the external surface thereof in a flange-like manner and having first structure for mounting a first movable actuator unit to the housing that is to be interconnected to the spring unit to select the desired compressive setting thereof, the switch construction comprising a bracket interconnected to a second structure of the bracket member, and a second movable actuator carried by the bracket and being interconnected to the spring unit to select the desired compressive setting th

Abstract: A bypass contactor usable in a solid state motor starter for shunting current around a fully-conducting solid state switching device comprising an electromagnetic contactor housed in a molded insulating enclosure having a plurality of bridging contacts movable into and out of engagement with a pair of stationary contacts to provide plural parallel current paths within the contactor, the stationary contacts having rigid terminal portions projecting externally of the insulating enclosure connectable to the heat sinks of the solid state motor starter in a preferred manner to suspend the contactor above the panel, permitting other components to be mounted below the bypass contacts. Alternate embodiments have the contactor mounted to the same support as the starter power pole component assembly and electrically connected thereto by rigid preformed connectors or flexible braided straps.

Abstract: A plastic panel has a central row of openings, each having a forwardly facing shelf at one end, a plurality of rearwardly directed posts having forwardly facing shoulders, a plurality of projections proximate the respective openings, each projection having a forward facing shoulder a plurality of resilient latches integrally molded in the panel, and lateral sidewalls extending rearwardly well beyond a main body portion of the panel, the sidewalls being parallel to the row of openings. A bus bar selected from two different width bus bars has a plurality of holes to be disposed over the posts and a plurality of branch circuit fingers extending transversely to the bus bar.

Abstract: A circuit breaker assembly is equipped with a pre-tripping device comprising a fixed cam securedly united to a connecting base, which cooperates with a rocker and a transmission lever when the circuit breaker is drawn-in and drawn-out from the connecting base. The profile of the fixed cam is chosen to actuate the transmission lever and impose tripping of the circuit breaker, during draw-in or draw-out travel, whereas the transmission lever is in the inactive position after the circuit breaker is drawn-in or drawn-out, in which the latter can be opened or closed normally.

Abstract: A stacking arrangement for combining a plurality of discrete interconnected electronic modules in aligned stacked relation includes a plurality of modules having discrete three-dimensional housing enclosures. Integral cooperating pin and socket electrical connector units are mounted in the top and bottom panels for interconnecting respective facing panels of juxtaposed modules electrically to interconnect all stacked modules in a manner not externally visible. An integral intermodular ventilation system is provided that has matching openings in corresponding facing top and bottom surfaces of the modules in aligned relation to accommodate continuous vertical intermodular air flow and includes one or more fans for pressurizing the stack and impelling air to flow through the stacked modular arrangement. A cover mounts on top of the ultimate functional module covering the pin and socket connecting unit of the top module and contains a plurality of side openings to accommodate outward ventilation flow.

Abstract: An electronic equipment has heat pipes for radiating heat generated from heat generating electronic parts. The electronic parts are arranged such that electronic parts generating more heat are arranged nearer to a heat radiating portion of each heat pipe to prevent a phenomenon of dryout and radiate the heat efficiently, whereby heat generated from the electronic parts such as LSI chips can be effectively radiated and an excessive rise in temperature of the electronic parts can be suppressed. When the invention is applied to computers, the entire computer size can be reduced.

Abstract: A low pressure monitor for hybrid air bag systems for vehicles includes a pressure responsive disc 34.6 exposed on one side to a reference pressure chamber 34.11 and on the other side to the pressure in an air bag bottle 40 and positioned adjacent a movable arm 28.10 of an electric switch, The switch includes an electrically conductive sheet having a first portion partially encased in a base 26 of electrically insulative material and being connected to a first terminal 14 and a second portion forming the movable contact arm 28.10 extending from the insulative material and culminating with a portion formed with contact rib 28.14 adapted to be received beneath a laterally extending stationary contact portion 22 of a second terminal 16. Tabs 28.4, 28.6 extend from the sheet out of the insulative material for connection to a resistor 30 mounted on the electrically insulative base and a frangible portion 28.

Abstract: An encapsulated electrically and thermally enhanced integrated circuit is disclosed. An integrated-circuit die is attached to a thermally conductive, electrically-insulated substrate. A lead frame having inwardly-extending bonding fingers has the bottom sides thereof attached to the top of the substrate. A contiguous layer of insulating material is bonded to the top sides of the bonding fingers, such that the layer of insulating material peripherally surrounds the integrated-circuit die. A conductive layer of material is then bonded to the top of the insulating layer. A second layer of insulating material followed by a second conductive layer may be bonded on top of the first conductive layer. Electrical connections are made from the integrated-circuit die to the conductive layers surrounding the die. The device is then encapsulated in a plastic material.