Abstract: A resilient heat sink clip has a pair of legs joined together at one end by an acruate member. The other ends of the legs each terminate in a hook. The arcuate member bears against a heat sink while pressing it into thermal contact with an electronic device package to conduct heat into the heat sink and then into the atmosphere.

Abstract: A chassis is provided having a heat conductive side wall together with a flat heat conductive tab member extending therefrom, together with a planar heat sink for supporting a heat generating electrical device, the heat sink having a pair of flat, parallel, resilient prongs and including first and second flat inner surfaces facing each other and separated from each other by a distance slightly greater than the thickness of the tab to form a clearance gap, together with a pair of wedge clamps for squeezing said prongs together to produce a good thermal contact between the prongs and the tab member. A narrow slot is formed within the heat sink for enhancing the resiliency of the prongs to enable easy actuation of the clamps.

Abstract: A clip-on heat sink assembly includes a spring and electrically-insulating braces. The spring is shaped to fit over a heat sink and a chip carrier package and engage with the braces which support the chip carrier package. The spring holds the heat sink in place and forces the heat sink and the chip carrier package together in order to maintain good thermal contact. An alternative embodiment includes a spring with the braces attached to form one piece.

Abstract: A cooling system for a plurality of circuit boards, each circuit board having a substantially planar thermally conductive thermal sink having longitudinal sides and being in thermal contact with a plurality of electronic components dissipating heat, includes a heat exchanger for delivering heat to a cooling medium and a heat pipe for transferring heat from each thermal sink to the heat exchanger. The heat pipe includes at least one flat box-shaped heat pipe, at least a first part of the heat pipe being in thermal contact with the longitudinal sides of the thermal sinks of the circuit boards.

Abstract: An electronic power device for a juke box or the like comprises a highly thermally conductive heat sink defining a first cavity on one side thereof and a second cavity on the other side thereof, with the first and second cavities having a common, thermally conductive wall. A printed circuit board carries substantially non-heat generating components thereon and is located within the first cavity. At least one heat generating electronic component is provided, located in the second cavity. The circuit board and the generating electronic component are in electrical connection through the common, thermally conductive wall.

Abstract: A low temperature conduction module comprising a cold plate having recesses around the periphery thereof to accommodate memory cubes is disclosed. The recesses accommodating the memory cubes are of such depth and dimension as to enclose the memory cube on all but one side, thereby greatly enhancing the conduction of the heat generated by the memory cube to the cold plate. The memory cube may be surrounded by a material which possesses excellent thermal conductive properties to insure efficient transfer of the heat from the memory cube to the cold plate. The plurality of memory cubes so positioned within the cold plate may be connected by a flexible cable surrounding the cold plate and having branch conductors extending to connect with computer processors enclosed within the same low temperature conduction module.

Abstract: An air distribution system for electronic components utilizes an air supply unit with a silencer unit. The silencer unit attenuates sound associated with the air unit blowers with inlet and discharge silencers. The blowers have check valves which provide for isolating each blower for continued operation even with one blower. The cooling air is transported to a circuit board module stack from the blowers through ducts and a bank of rod valves. The valves allow maximum air flow to the modules with minimum resistance. The ducts have a flexible portion which have quick disconnects and act to isolate the modules from vibrations and static. The modules utilize channels in an air plate with different sized baffles to provide even distribution of cooling air to the printed circuit boards.

Abstract: A pressure switch comprises an electrically conductive housing, a stationary contact stationarily installed in the housing and a movable contact movably received in the housing. The movable contact is movable to contact with the stationary contact. A hydraulically operated moving device is employed for moving the movable contact in accordance with a hydraulic pressure applied thereto. The stationary contact is formed with a blind bore. An end piece to which an end of an electric cable has been connected is press-fitted in the blind bore.

Abstract: A thermal attachment assembly for heat generating electronic devices which includes a multi-element spring having low force, high deflection, spring fingers, and which is adjustable and attached by screws to a cover to apply pressure directly against electronic components arranged generally perpendicular to at least one edge of a printed wired board (PWB). The attachment assembly includes a heat sink housing in which the electronic components are pressed against an electrically insulating, thermally conductive film positioned against one wall of the heat sink housing. The PWB is snapped to a carrier and both are placed into the housing so that the electronic devices are positioned within spaces of the carrier. The carrier includes sloping surfaces, so that the spring fingers are deflected downward when the cover is attached to the housing, thereby insuring that the spring fingers are properly positioned onto the electronic devices, between the spaces of the carrier.

Abstract: In an electronic equipment assembly having a plurality of electronic equipment housings tiered, a horizontal air passageway is formed on the lower surface of each bottom plate of each electronic equipment housing, air ventilation openings being formed on the top plate thereof, vertical ducts open to the horizontal air passageway being formed on the outside of the side plate, the cross section of each vertical duct being the same in shape and size. When two electronic equipment housings are tiered, common vertical ducts are formed, through which heated air can be expelled and cables can be routed.

Abstract: A wedge clamp activator and circuit card extractor is provided for selective tightening and loosening of a wedge clamp on an electrical apparatus. The actuator includes a shaft for rotating the screw of the wedge clamp. The shaft is provided with pivot pins. A lever mounted to the pivot pins enables rotation of the actuator and the wedge clamp screw to which the actuator is attached. The lever includes a fulcrum dimensioned for engagement with a rigid support on the electrical apparatus. The lever may be translated into a position where the fulcrum engages the support. The lever may then be rotated about the fulcrum for extracting the circuit to which the wedge clamp is mounted from the electrical apparatus.

Abstract: A power cord for use by electricians to supply power to the construction area while normal electrical power has been disconnected. The present invention allows the electrician to draw power from severed power lines without the necessity of removing the insulation from the severed power lines. The power cord provides un-metered power to ground fault current interrupter and circuit breaker protected outlets.

Abstract: A molded case circuit breaker support and a circuit breaker enclosure are arranged with air transfer slots and passages to promote chimney effect cooling of the circuit breaker components. The slots in the circuit breaker support direct ambient cooling air onto the circuit breaker terminals while the passages through the enclosure direct the ambient air flow from the bottom to the top of the enclosure.

Abstract: A semiconductor apparatus comprises a heat diffusing plate and a surface installing printed board. A semiconductor device of a high heat generation is installed on the heat diffusing plate. A surface installing package and chip parts are installed on both surfaces of the printed board. A through hole is formed at the center of the printed board so that the semiconductor device is located at the center. The heat diffusing plate on which the semiconductor device has been installed and the surface installing printed board are connected and integrated.

Abstract: In a small-sized computer of a natural air-cooling type, a high-temperature radiator promotes natural convection so as to increase a quantity of heat radiation and to raise the allowable limit of heat generation of LSI chips, thereby improving the processing speed of the computer. For this purpose, a casing and fins are utilized as heat radiators at relatively low temperatures of about 40.degree. C. which are safe even if they are touched by an operator's hands. On the other hand, the high-temperature radiator set at about 50.degree. to 60.degree. C. is provided inside of the casing, thus preventing the operator's hands from touching it directly. Heat generated by the LSI chips and so forth is transmitted to the high-temperature radiator through heat conduction or the like, and heat exchange is performed between the high-temperature radiator increased in temperature and the air introduced into the casing, in order to promote natural convection inside of the casing.

Abstract: A pressure operated switch construction and method of making the same are provided, the pressure operated switch construction comprising a housing having an external surface and carrying an electrical switch unit and a diaphragm assembly therein, the housing having an opening passing through the external surface thereof, the switch unit having opposed sides and an opening passing therethrough in alignment with the opening of the housing, and a compression spring unit carried by the housing and being operatively associated with the switch unit and the diaphragm assembly to control the operation thereof in relation to the compression setting of the spring unit, the spring unit comprising a spring retainer operatively interconnected to the switch unit, an actuator carried by the housing and a compression spring having opposed ends respectively bearing against the actuator and the retainer, the retainer having an intermediate part disposed in the opening of the housing and having a surface and a projection extend

Abstract: A housing for installation in motor vehicles to accommodate SMD electronic components disposed on one side of a multi-layer circuit board or film. A metal plate serves as the carrier for the circuit board or film, with the planar expanse of the metal plate being the same as or greater than that of the board or film, with the board or film being disposed on, attached to and electrically insulated from the metal plate. When the area of the metal plate is greater than that of the board or film, power components are disposed on the surface of the metal plate in a region not covered by the board or film, whereas when the area of the metal plate is substantially the same as that of the board or film, power components are disposed on the board or film, with the metal plate serving as a heat sink for the power components.

Abstract: An inner space of an outer case is partitioned by a gas permiable diaphragm into a fluid pressure operating chamber and a reference pressure operating chamber. The former chamber communicates with a pressurized fluid inlet hole formed in the case, and the latter communicates with a pressure equalizing hole formed in the case. Electrical contacts are stored in the latter chamber to perform on/off-operation in response to deflection of the diaphragm caused by pressure change of pressurized fluid in the former chamber. Outer connection terminals for the contacts are supported by the outer case. A filter is provided in the equalizing hole.

Abstract: A switch having first and second housing members 12, 14 sandwiching a combination terminal and disc seat member 30 has a tortuous vent path 64, 66 and 68 formed through first and second, annular bearing surfaces 60, 62 in the top surface of the second housing member. The terminal and disc seat member 30 and top surface 42 of the second housing member are configured such that an interference fit is formed between the terminal and the disc seat member 30 and the second, annular bearing surface 62.

Abstract: A structure and method is disclosed for cooling a semiconductor computer chip module. The semiconductor computer chip module is made up of a plurality of semiconductor chips bonded together In one aspect of the present invention every other chip is staggered such that recesses are formed between protruding edges of every other chip along two opposite faces of the chip module. The opposite faces with the staggered chips are capped and sealed so that coolant channels are formed between the recesses and the sealing caps. In another aspect, one face of the chip module is bonded by a plurality of connectors to a base. The base and chip module with connectors form a chamber. The chamber is sealed and an opening is made in the base to circulate coolant into and around the connectors of the base and up along the coolant channels which are in fluid communication with the base. Thermal vias are provided between selected connectors and the chip module to conduct heat from the chips of the module to the connectors.