Abstract: A computer system utilizes a heat sink which optimizes the benefits of both linear airflow and turbulent airflow within the computer housing. The heat sink has rows of metal fingers extending from a metal sheet. A fan generates linear airflow within the housing. The heat sink is attached to a heat producing element such that the rows of fingers are placed parallel to the direction of airflow in the housing. The fingers are spaced apart within a single row to generate turbulence in the airflow, and the rows are spaced apart to prevent the turbulence of one row from interfering with the turbulence of an adjacent row.

Abstract: Display tube including a deflection unit which comprises a coil support (8), a field deflection coil (12), a line deflection coil (11) and a yoke ring (14). Plate-shaped metal field correction elements (15, 15', 15") are arranged between the field deflection coil (12) and the coil support (8), which elements are rigidly secured to the inner surface of the yoke ring by means of a form-filling adhesive which extends between the parts of the field deflection coil. Vibrations of the field correction elements and sound generated by transfer of these vibrations to the coil support are thereby substantially prevented.

Abstract: The present invention provides a wireway assembly for mounting to the housing wall of an electrical distribution device to enclose and protect electrical wiring therein. Generally rectangular, u-shaped channels have at least one aperture positioned in the channel wall to overlap the aperture of an adjacent channel to define a wireway through which the electrical wiring extends from the bight portion of one channel to the bight portion of the adjacent channel. An interlocking means manually attaches and detaches each channel with an adjacent channel and with the housing wall.The present invention also includes a method of safely protecting electrical wiring extending across a housing wall of an electrical distribution device. The method includes the step of interlocking a plurality of u-shaped channels in an abutting position to each other and the housing wall.

Abstract: A single unit enclosure containing an electric power meter compartment and a power receptacles compartment is adapted for use on a temporary construction site employing underground utility cables. The meter compartment is located under the power receptacles compartment and is protected from the environment by means of the overhang provided by the access door attached to the power receptacles compartment. The incoming power cables to the enclosure are also protected by means of the access door overhang.

Abstract: A carrier for a printed circuit board or card on which electronic components are mounted, the carrier making it possible to disperse an increased quantity of heat given off by the components in the direction of an energy dissipating frame with which the carrier is in contact. The carrier comprises two flat parallel metal plates of identical perimeter defining between them a space which is entirely closed along the perimeter, the space containing a porous metallic material in contact with the plates, and being partially filled by a liquid which evaporates at the working temperature of the carrier.

Abstract: A housing for accommodation of a plurality of electric circuitry packages, a method for assembling the housing, a cooling arrangement, and an electrical connection arrangement are disclosed. The housing can accommodate a plurality of packages, supply the packages with power, connect them electrically, support them and cool them. By means of the resilient support, the housing can withstand and protect the packages from shocks and vibrations. By means of the resilient connection, the housing can handle package size differences, e.g. due to thermal expansion caused by temperature changes. The cooling arrangement for cooling the electric circuitry packages includes several cooling units sandwiched with the packages into a stack. A cooling fluid cools the packages by flowing through each cooling unit. The units have flexible package facing walls, which form themselves to the package surfaces due to the cooling fluid pressure.

Abstract: A centrifugal switch assembly for a single phase induction motor connecting a start winding and/or start capacitors in circuit. A centrifugal actuator positions a contact unit on a cantilevered spring arm relative to an aligned fixed contact unit. Each contact unit is identically constructed with a cylindrical steel base and an outer contact button which defines a radial lip. A silicone rubber boot in the form of a tubular member having similar thick end hubs connected by a thin-wall convolution between the hubs to establish a flexible enclosure. The hubs are telescoped respectively over the contact bases with the same interference fit to totally enclose the contact units. The lips of the contact buttons lock the boot to the contact units. The boot length is greater than the spacing of the open contact units and the convolution is continuously deflected to create a closing force.

Abstract: Disclosed is a 3D encapsulation of semiconductor chips, each chip containing for example an integrated circuit, this encapsulation being aimed at optimising heat dissipation by conduction. Connection means are associated with each chip, making it possible to extend the pads of chips towards three sides of the chip, thus leaving the fourth side free. The chips are stacked on one another and then can be connected to heat dissipation means by their fourth side.

Abstract: In a flyback transformer device wherein the leads of diodes or like electronic components are connected between pairs of terminal pieces provided upright at opposite ends of a coil bobbin, the lead ends of the components are fixedly connected to the respective terminal pieces by electric welding. A coil conductor wound around the bobbin has an end twined around the terminal piece, and the twined portion is soldered by dipping.

Abstract: In a power module having at least one power device chip and circuits for driving and controlling the power device chip which are incorporated within one and the same package, a heat spreader which is constituted by a material having a heat dissipation property and supports the power device chip on its upper surface is inserted into an opening formed in a control substrate having an upper surface on which patterns for forming the chip driving and controlling circuits and a connection pattern for connection with the power device chip are printed, and the control substrate and the heat spreader inserted into the opening are fixedly supported on a base substrate. Thus, the power device chip and the control substrate can be disposed in plane and reduced in size.

Abstract: A heat sink assembly for a multichip module. A thermally conductive plate is bonded to integrated circuit chips on a multichip module by indium solder. The plate in turn is thermally coupled to a heat sink such as finned aluminum by thermal paste. The plate is made of a material such as silicon carbide or copper-tungsten alloy having a relatively low coefficient of expansion to minimize mechanical stress resulting from lateral motion of the chips due to thermal expansion. Relatively low-power chips may be thermally coupled to the plate by thermal paste instead of being bonded by solder.

Abstract: A heat sink assembly for dissipating thermal energy from a heat generating electrical components wherein the heat sinking includes a component support member and a cover which surrounds and clamps the electric component to the heat sink and a method of heat sinking where the parts are not heat sunk until the cover is attached to the circuit board. The clamping force for the electrical component may also be varied for optimum heat transfer.

Abstract: A wiring assembly is provided for mounting on an exposed surface of a wall or wall panel to supply electrical power to the wall or wall panel. The wiring assembly includes a plurality of conductive bus bars and an insulating support having a base and a plurality of generally parallel dividers extending upwardly from the base to define a plurality of slots therebetween. Each slot is configured to receive a conductive bus bar therein. The support is coupled to said exposed surface. The assembly also includes a cover coupled to the support. The cover is situated over the plurality of dividers to shield the plurality of conductive bus bars situated in the plurality of slots. The assembly further includes an electrical outlet coupled to the conductive bus bars for providing an outlet for electrical power from the wiring assembly.

Abstract: The pistons of a cold plate frame orient themselves as a result of being free to move along one axis and about two other axes by the reflowing of solder tinning on the external surfaces of the pistons and the walls of the recesses within which the pistons reside. As the pistons are permitted to move freely under a biasing force during the solder reflow the face of the piston will engage with the top surface of an electronic chip against which the piston is engaged. The cooling of the solder after reflow will freeze the position and orientation of the piston to that of the electronic chip and will permit enhanced cooling. The cold plate may be disassembled from and reassembled with the components of the cooling system and the electronic chips while maintaining significantly enhanced cooling capabilities.

Abstract: A motion producing device in the form of a linear actuator, circular pump, or a robotic or prosthetic limb which functions to produce many kinds of work is provided. The device includes a linear series of alternately spaced fixed and polarity reversible magnets. The fixed and polarity reversible magnets may have more than one magnet assembled as a force unit of magnets of fixed polarity or reversible polarity which is surrounded by a rigid electrically insulating material and that carries rigid electrical conductors in the form of tubes. Between each magnetic force unit is an elastic electrically insulating material allowing expanding or shrinking of the distance between the magnetic force units in accordance with the polarity reversal of the reversible magnetic force units. The elastic expansion or contraction material carries flexible elastic tubes that connect with the rigid tubes to hold a current carrying electrolyte to carry electrical current from a D.C.

Abstract: The present invention provides a mechanism for kinetic energy dissipation which allows the bulk of the mass (e.g., a portable terminal) to be decelerated over some working distance such that the deceleration force is below the damage point. The present invention provides a molded "rubberlike" structure that serves as a carrier or cushion for internal structure (e.g., internal components of a portable terminal). The carrier structure has molded features including an outer frame that serves as a gasket, bumper and support and an inner structure which is molded to conform to the shape of the fragile electronic components that make up, for example, the terminal.

Abstract: The invention is directed to a coding device for electrical assemblies that can be inserted parallel to one another into a module frame and that are contacted via plug devices attached at the back to a wiring backplane.A coding flange having three quadratic openings arranged in a right angle pattern is arranged on the wiring backplane between the guard rails, and a corresponding coding housing likewise provided with three quadratic openings arranged in a right angle pattern is arranged on the assembly next to the plug connector. Coding pins can be selectively oriented within the openings by 90.degree. turns, whereby the free ends of said coding pins are fashioned as tongues having a rectangular cross-section, and the area of the cross-section of the tongues corresponds to half the area of the cross-section of the quadratic openings.

Abstract: An electrical installation device for fastening in an attachment position on a carrier rail includes an instrument housing made of insulating plastic and having an instrument housing wall and a bottom facing the carrier rail in an attachment position. A sliding latch is shaped in one piece to the instrument housing wall and is movable in a locking direction outside of the housing bottom transversely to the attachment direction and to the carrier rail direction. A flexible web, spring elastic in the locking direction, is connected between the sliding latch and the instrument housing wall. A detent lug is attached to the sliding latch and, in the locking direction, grips behind the carrier rail. An actuating end is connected to the flexible web and faces away from the detent lug, whereby the sliding latch is returnable against the spring elasticity of the flexible web from a locked position into a release position by actuation of the actuating end.

Abstract: An apparatus and method for using a circuit board as a heat sink for another circuit board which effectively draws heat away from the other circuit board while the one circuit board is actively producing its own heat. Since the one circuit board is much larger than the other circuit board, the thermal mass of the one circuit board is great enough to absorb and spread the heat generated by both boards in the presence of forced air cooling. The method includes the steps of mounting a thermal conductivity layer on a predetermined area on the one circuit board and mounting the other circuit board over the area on the one circuit board such that components on an underside of the other circuit board firmly contact the thermal conductivity layer so as to conduct heat from the components through the one circuit board.

Abstract: A chip carrier is disclosed which includes a chip carrier substrate and at least one semiconductor chip mounted in a flip chip configuration, via solder balls, on a circuitized surface of the chip carrier substrate. The solder balls are encapsulated in a first encapsulant having a composition which includes an epoxy. In addition, at least a portion of the circuitry on the circuitized surface is encapsulated in a second encapsulant having a composition which includes a urethane, and which composition is chosen so that the second encapsulant exhibits a modulus of elasticity which is equal to or less than about 10,000 psi. As a consequence, the second encapsulant exhibits neither internal cracks, nor interfacial cracks at the interface with the first encapsulant, nor does the second encapsulant delaminate from the circuitized surface, when the chip carrier is thermally cycled.