Abstract: A spring clamp and insulating shoe assembly is used to secure a finned heat sink to an electronic device package. The spring clamp body fits between or around fins or pins extending from one face of a heat sink and carries an insulating shoe which fits around the edge of the device package and has a lip which engages the opposite face of the device package to urge the device package and heat sink into mutual contact.

Abstract: A safety pressure sensor in particular for microswitches comprises a base body (2) to be engaged to a receptable containing a fluid under pressure, a flexible diaphragm (6) disposed in contact with the fluid under pressure and acting on a microswitch (9) connected to the pressure sensor (1 ), a protective cap (5) adapted to accommodate the flexible diaphragm (6) and actuating means (10) adapted to transmit the diaphragm thrust to the microswitch (9) through the protective cap (5).

Abstract: An electrical module assembly (100) includes a mounting frame (130) having a passage (135) extending though the mounting frame (130). A heat sink (160) is positioned within the passage (135) of the mounting frame (130). A module substrate (120) is located on or near the heat sink (160) such that there is thermal conductivity between the module substrate (120) and the heat sink (160). A heat-generating semiconductor device (122), such as a power amplifier (122), which requires heat dissipation, is positioned on the module substrate (120) such that there is thermal conductivity between the heat-generating semiconductor device and the heat sink (160). Electrical connection to the module substrate (120) is provided through the mounting frame (130).

Abstract: A multi-layer printed circuit board or card including at least one passage in at least one of the layers of the circuit board or card for preventing the diffusion of heat throughout the circuit board or card during the securing or removal of components in plated through holes in the circuit board or card by the heating of the plating material to a temperature above a melting point of the plating material.

Abstract: A traffic counting cord has a plurality of sections designed to be identical in physical characteristics, set-up procedures, durability and performance as a road tube. Each section has a portion with conductive upper and lower members and a portion with non-conductive upper and lower members. The upper and lower members are separated by resilient, non-conductive material. Embedded within the members are a plurality of wires insulated with nylon or other material and at least one non-insulated wire which is in contact with the conductive member. A count occurs when traffic impacting the cord causes the upper and lower members of a section to make contact. Individual counts for each lane can be obtained by cross-wiring the sections, so that the uninsulated conductors of each section are routed to a counter through insulated conductors or wires of the other sections. Any even or odd number of lanes, typically four, six, or eight lanes can be accommodated, although there is no theoretical limit.

Abstract: In a cooling apparatus of an electronic equipment, a plurality each of integrated circuit devices and large-scale integrated circuit devices are mounted onto a plurality of substrates, respectively, and a cooling fan supplies cooling air from outside to each of these integrated circuit devices. A duct having a comb-tooth shape suitable for encompassing each substrate and defining flow paths along the substrates introduces the cooling air supplied by the cooling fan to each of the integrated circuit devices. The duct includes a plurality of small holes disposed at positions corresponding to the positions of the integrated circuit devices on the substrates and having open areas corresponding to the heating values of the integrated circuit devices. The small holes flow the cooling air supplied by the cooling fan as jet streams to the integrated circuit devices. This jet stream cooling improves cooling performance and can make uniform the temperature distribution of the integrated circuit devices.

Abstract: A packaging system for a standard electronic module is provided utilizing a multi-layer, low temperature, co-fired ceramic motherboard. Device packages, such as an RF device package, are formed of low temperature, low dielectric, co-fired ceramic materials. The device packages are mounted on a composite heat sink provide on one side of the motherboard. A pressure plate provide on the opposite side of the motherboard is fastened to the heat sink to compress the device package. Pressure contact interconnects are used to make contacts between the device packages and the particular conductor layer in the multilayer motherboard. The radio frequency conductor layer in the motherboard is isolated from power and control layers by ground planes provided in the motherboard.

Abstract: The invention is to a three dimensional circuit module constructed around a heat sink 10. A large integrated circuit component 21 such as a Micro Processing Unit for a computer is mounted over contact pads 27 on a printed wiring board 20. Also mounted to contact pads 27 on the printed wiring board are submodules 11, 12, 24, 25 that have wiring patterns interconnected to other circuit components 13-17, such as high power memory devices. The printed circuit submodules are mounted on the sides of the heat sink.

Abstract: Disclosed is an electric connection box integral with an ignition switch to be incorporated into an instrument panel in an automobile. The electric connection box, which is to be disposed in an instrument panel, includes in its internal circuit protect parts such as a fuse and the like and a branch circuit (a bus bar circuit) having circuits respectively to be connected directly with an ignition circuit, thereby connecting the ignition circuit directly with the branch circuit, whereby an ignition switch and the circuit protect parts are integrated into the electric connection box.

Abstract: The assembly of an electronic package, a socket which holds the package, an electrically-conductive heat sink placed over and around the package, and an EMI shield for minimizing EMI leakage. The shield is a metal frame extending around the socket and package, and secured to it by locking tabs extending inwardly from the frame to detents on the edges of the socket. The socket contains double-wall structures spaced along its periphery which support the frame when it is on the socket, and the heat sink is provided with depending skirts which extend downwardly on all sides of the socket and package, to contribute additional EMI shielding. The sink is held to the socket by resilient retainers, each secured at one end to an upper surface of the heat sink and extending downwardly through the heat sink to be releasably secured to latching detents on the edges of the socket, by means of latches located inside the frame.

Abstract: An over electrical power supply system for delivering of electrical power to a plurality of instruments in an environment which has a generally vertical wall such as a room. The electrical instruments of the type used with this system are operable with electrical power. The power supply system comprises a plurality of conduits which are secured to a generally vertically disposed wall and have angularly outwardly struck portions which extend from the vertical portions of the conduit and which are generally horizontally located. A mechanism is located at the ends of each of these arms for retaining an electrical implement such as a barbershop hair clipper, a razor or the like. This mechanism is designed to releasably retain the instruments and to deliver electrical power to these instruments. Electrical conductors extend through the conduits to these mechanisms to supply electrical power to the instruments connected thereto.

Abstract: A multi-layer interposer in which the X-Y engineering change wiring pattern in the interposer terminates in a pattern of pads on the upper surface of the interposer around the periphery of the chip. In order to make an engineering change, a jumper wire connect pads on adjacent interposers mounted on the multi-chip module.

Abstract: An elongated casing includes an elongated insulated seat which is disposed transverse to a longitudinal length of the casing and adjacent to one end thereof. The insulated seat has two spaced through bores that extend along a full longitudinal length to receive two conducting rods, four inlet holes that extend from a bottom of the insulated seat to communicate with the through bores, and a flat top surface. The flat top surface is provided with a T-shaped member, two inverted L-shaped members which cooperate with the T-shaped member to define two hooking units, and two recesses formed adjacent to a respective one of the hooking units. Two pairs of conducting pins are provided lengthwise in the elongated casing and which extend from the end towards another end of the casing. The conducting pins have upright insert portions that extend into the inlet holes of the insulated seat to contact the conducting rods.

Abstract: A connection arrangement with PC board features a ceramic substrate glued to a base plate of metal, used as a cooling body. Islands have been hollowed out of the adhesive layer and are filled with thermally conductive paste. Particularly effective thermal dissipation is possible in the area of the islands filled with thermally conductive paste, so that the islands are always disposed underneath components with great energy or heat dissipation.

Abstract: The present invention is relative to a deflection yoke in which a leaking magnetic field preventing member is formed without a magnetic body, such that coil winding parts are formed opposite to and apart from each other at a predetermined distance in the inside of a case formed in the same curvature as that of a flange part of a separator and coils of a predetermined diameter are wound therearound at a predetermined number of turns; a current which can form the current of direction contrary to a magnetic field generated from a horizontal deflection coil supplied therewith; and a leaking magnetic field preventing member in which a cover having a plurality of heat emitting holes fixed on the case is combined with a flange part in the form of corresponding a horizontal deflecting coil by combining an attaching part of the case with a corresponding part of the flange part.

Abstract: The present invention relates to an electrical device such as a resistor or silicon controlled rectifier that is provided with an improved heat transfer medium for transferring heat from the device to an adjacent structure such as a mounting panel. The improved heat transfer medium includes a bonded series of laminates including a layer of nickel-plated copper sandwiched between two layers of ceramic, such as aluminum oxide.

Abstract: A modular construction power circuit arrangement is disclosed which comprises a thin metal plate performing holder and heat sink functions, a multiplicity of electronic devices in the form of semiconductor material chips having metalized pads as their terminals, a printed circuit board attached to the thin metal plate, electric conductors between the metalized pads and the printed circuit on the board, terminating connectors which form a part of the printed circuit board for connecting the circuit arrangement to external circuits, and a plastics material body which conglomerates a portion of the thin metal plate, the semiconductor material chips, and the printed circuit board. At least one of the semiconductor material chips is attached directly to the thin metal plate and extends therefrom through an opening in the printed circuit board.

Abstract: A method of mounting fuse holding clips for a fuse holder on a circuit board by such an automatic part inserter as is used for inserting radial parts and including a pusher having a lower dead point set at 5 to 20 mm upwardly distant from an upper face of the circuit board and comprising a step of inserting a fuse holding clip while the pusher of the automatic inserter is engaging narrowed faces of a clip body which are to support a lower portion of a fuse until a bottom of the fuse holding clip is engaged with the upper face of the circuit board.

Abstract: A multi-chip module includes a substrate supporting a plurality of chips. A dielectric layer which overlies the chips and the substrate has a connection surface and a substrate surface with metallization planes having plane openings patterned on each surface and vias aligned with predetermined pads on the chips and predetermined portions of the metallization plane of the substrate surface. An adhesive layer is situated between the substrate and the substrate surface of the dielectric layer, and a pattern of electrical conductors extends through the vias to interconnect selected chips and selected portions of the metallization planes. In a related design, the dielectric layer may be a board having chip openings and conductive through-connections aligned with predetermined portions of the metallization plane of the substrate surface.

Abstract: An electric junction box installed in an automotive instrument panel incorporates the meter board and its associated switch circuits as the internal circuit of the box. The electric junction box has an internal busbar circuit having branches that are directly connected to the meter board and the switch circuits so that they form an integral part of the internal circuit of the junction box.