Abstract: An electronic circuit assembly with improved heatsinking is provided. The assembly includes a component carrying board (56) which has an opening (62) through it. The opening is sized to receive a heat generating electronic component (64). A diamond layer (50) is attached as a heat sink to the bottom (58) of the component carrying board. The heat generating component (64) is attached directly to the diamond layer (50), through the opening (62) in the component carrying board (56). The diamond layer provides electrical insulation as well as superior heat dissipation.

Abstract: An enclosure for a personal computer card is constructed of a single sheet of material folded into confronting upper and lower enclosure members secured together in the confronting arrangement by nested side walls and channels formed along peripheral edges of the enclosure members to house an electronic device within the enclosure.

Abstract: A device for attaching a heat sink to an electronic package comprises a pin having a compressible point, the point being adapted to pass through aligned holes in a heat sink and a printed circuit board so that the point compresses as it passes into two holes and flexes back to an expanded position after it exits the printed circuit board hole opposite the heat sink thereby holding the heat sink to the board with the electronic package therebetween.

Abstract: A dielectric structure (12) includes a plurality of stacked sheets (16) of low thermal conductivity, low-temperature-cofired-ceramic (LTCC) tape formed with a hole (18) therethrough. A heat sink (20) includes a plurality of stacked sheets (22) of high thermal conductivity LTCC tape disposed in the hole (18). The high thermal conductivity sheets (22) and the low thermal conductivity sheets (16) are cofired to produce the heat sink (20) as an in-situ element in the dielectric structure (12). A heat generating electrical component (28) is mounted on the heat sink (20) in thermal communication therewith. The dielectric structure (12) is mounted on a high thermal conductivity substrate (24) with the heat sink (20) in thermal communication with the substrate (24) to conduct away heat generated by the component (28). The high thermal conductivity sheets (22) and the substrate (24) can be electrically conductive and electrically communicate with the component (28), or can be electrically insulative.

Abstract: A mounting spring clamp for securing a heat sink to a device package is secured to the heat sink by positioning the central body portion of the spring clamp in an attachment clip. The clip is compressed and positioned in a groove of the heat sink. The clip comprises a semi-circular shaped seat with ears extending from both sides of the seat and is made from a flexible material. Compression of the ears reduces the seat diameter, thereby trapping the spring's central body, and also creates spring force in the ears, thereby trapping the clip between the fins of the heat sink. The mounting spring has an elongated body with ends extending from the axis of its central body. The ends may be trapped or hooked in appropriate receivers on a frame or socket holding an electronic device package to secure the heat sink adjacent the device package.

Abstract: By employing High Density Interconnect (HDI) multi-chip modules (MCMs) having elements of a distributed power supply embedded in the MCM itself, the functions of an MCM and a power converter are combined. The embedded power supply elements include DC-DC or AC-DC converters to convert an input voltage and input current to a relatively lower output voltage and relatively higher output current, thereby decreasing the current requirements of external power supply lines connected to the multi-chip module. The current and voltage outputs may be connected to chip power inputs through relatively short, low-impedance power distribution conductors comprising copper strips direct bonded to a ceramic substrate; alternatively, or in combination with direct bonded copper conductors, the low-impedance power distribution conductors may be situated within an HDI overcoat structure. The power supply elements may be placed within cavities formed in the substrate, or on a thinner portion of the substrate.

Abstract: A modular electrical-energy distribution system has at least one conductor and a contacting device which makes it possible to establish, at essentially any point in the conductor system, a contact with the conductor. The tap or contacting devices essentially clamp onto or between conductor bars and therefore essentially permit all contacts to be made simply from one side of the conductor bars thereby reducing installation time.

Abstract: A process for making metallized vias in diamond substrates is disclosed. The process involves laser-drilling a plurality of holes in a CVD diamond substrate and depositing tungsten, or a similar refractory metal, in the holes by low pressure CVD to provide substantially void-free metallized vias. Diamond substrates having metallized vias are also disclosed. The structures are useful for making multichip modules for high clock rate computers.

Abstract: A shelf assembly in an electronic switching system in which storability of a cable and coolability of the assembly are enhanced. The shelf assembly comprises an upper stationary rail firmly secured to an upper member of the shelf, an upper slide rail slidably mounted on the upper stationary rail, a lower stationary rail firmly secured to a bottom member of the shelf, and a slide rail slidably mounted on the lower stationary rail. The shelf assembly further comprises a cable box firmly secured to the upper and lower slide rails, the cable box having a plate spreading vertically, an area for receiving the cable being defined in one side surface of the vertical plate; and a drawer unit removably inserted in the cable box along the other side surface of the vertical plate, the drawer unit having a plurality of per-line packages which are withdrawably inserted in the drawer unit, the per-line packages each storing the contents of service per subscriber.

Abstract: A junction box (10) defining an enclosed card cage and including a backplane assembly (200) for interconnecting circuits of daughter cards (130) with associated conductors extending thereinto at an input/output interface. The junction box (10) includes a front panel (50) removable from the front face to permit insertion and removal of respective daughter cards, and includes an array of interior fins (58) engaged with the daughter cards at thermal junctions (64) and an array of exterior fins (52) for dissipating the thermal energy. The rear wall (14) includes shield sections (214) surrounding input/output connectors (208) joined to the backplane assembly. The junction box (10) prevents EMI/RFI leakage therethrough.

Abstract: An improved encapsulant and method of application for rework of a modular electronic assembly. A housing is provided with a structure that permits deformation with thermal expansion of the encapsulant and reduces stresses applied to the electronic components therewithin. The selected encapsulant provides mechanical stability from shock and vibration, thermal conductivity to the surroundings, and freedom from deterioration of electrical performance. Critically, the encapsulant is readily excised for repair and replacement of defective components, thus allowing rework and salvage of the assembly. A potting tool is adapted for selectively refilling the housing to replace the excised portions.

Abstract: Disclosed is a parallel processor packaging structure and a method for manufacturing the structure. The individual logic and memory elements are on printed circuit cards. These printed circuit boards and cards are, in turn, mounted on or connected to circuitized flexible substrates extending outwardly from a laminate of the circuitized, flexible substrates. Intercommunication is provided through a switch structure that is implemented in the laminate. The printed circuit cards are mounted on or connected to a plurality of circuitized flexible substrates, with one printed circuit card at each end of the circuitized flexible circuit. The circuitized flexible substrates connect the separate printed circuit boards and cards through the central laminate portion. This laminate portion provides XY plane and Z-axis interconnection for inter-processor, inter-memory, inter-processor/memory element, and processor to memory bussing interconnection, and communication.

Abstract: An improved packaging technique for packaging a thermally-enhanced, molded-plastic quad flat package (TE-QFP). An integrated-circuit die is attached to a thermally conductive, electrically-insulated substrate having a stepped area formed into the outer margins thereof. A lead frame has inwardly-extending fingers, which are attached to the stepped areas in the outer margins of the thermally conductive, electrically-insulated substrate. The stepped area centers the thermally conductive, electrically-insulated substrate and attached integrated-circuit die within the mold cavity so that the flow of plastic material is balanced over the top and bottom of the substrate to provide a molded package body substantially free of voids.

Abstract: A general-purpose, pressure-sensitive electrical switch, having a frangible electrically conductive path that is irreversibly broken by an excessive applied pressure differential, The switch includes a pressure-deflectable diaphragm and an interior chamber. The diaphragm forms an interface between the internal chamber and the external environment. As the pressure differential across the diaphragm exceeds a specified level, the diaphragm deflects. The internal chamber can also be sealed with an internal pressure P.sub.1 so that the diaphragm deflects for a specified absolute external pressure P.sub.2. The force of the deflection is transmitted to brittle, inelastic structure within the switch through an intermediate load transmission element. The electrical path, which is along the brittle structure, terminates in a pair of externally-accessible terminals.

Abstract: An apparatus and a method of mounting a power semiconductor (10) to an external heat sink (18) when both fastening faces (11, 13) of the semiconductor are inaccessible during the assembly process. The apparatus comprises a nut plate (20) that mates with the semiconductor (10) and a thermally conductive layer (28) that engages the nut plate (20) and wraps around the semiconductor (10) in a captive manner. The external heat sink (18) threadably engages the nut plate (20) without the need to access either fastening face (11, 13) of the semiconductor (10).

Abstract: A liquid level switch assembly is provided which can be adjusted as to what liquid level will actuate the switch. A support bracket is mountable to the tank and a float arm is pivotally mounted to the support bracket inside the tank by way of a pivot axle. A magnet is mounted to the pivot axle such that the magnet rotates as the float arm pivots to follow the liquid level on the tank but such that the angular position of the poles of the magnet can be adjusted relative to the float arm when the float arm is retained as the magnet is rotated. A reed switch is mounted on the support bracket near the magnet such that when the float arm is in a predetermined range of angular position relative to the horizontal, the reed switch is actuated by the magnet.

Abstract: A circuit breaker has a line terminal comprising a pair of vertically spaced resilient terminal strips which extend in the transverse horizontal direction out from the breaker's housing to free ends of the strips, and which strips have formed therein near those ends respective bends disposed opposite each other and vertically projecting away from each other to bound opposite sides of a circular cylindrical cavity defined between those strips. A horizontal rail for conducting current is aligned in its lengthwise direction normal to those strips, and the rail has a flange received in the cavity in electromechanical contact with the strips, and also, a web extending in the transverse horizontal direction from the front flange out beyond the terminal to a rear flange for the rail. The shape, size and mass of the rail promote reduction of the temperature generated at the line terminal by the inrush of current carried by the rail in the presence of a short circuit in the load served by the breaker.

Abstract: A pressure responsive switch is shown having an electrically conductive body 12 formed with a bore 24 which extends from one side through the body into recess 30 formed in the opposite side of the body. A switch assembly 34 is received and locked in the recess by crimping downwardly extending wall 32 of the body over the assembly. The switch assembly has a terminal 35 formed with a stationary contact 36 on an end thereof mounted electrically isolated from an annular disc seat member 40 which in turn receives an electrically conductive disc member 56 and a flexible diaphragm 60. An elongated piston 64 is receivable in a port 18 of a pump and is slidably received in bore 24 of body 12 with an end 70 placed contiguous to the diaphragm 60 and center of the disc member 56.

Abstract: A bond pad is provided for improving the reliability of the bond joints between a surface-mounted integrated circuit package and a conductor on a circuit board substrate. In particular, the reliability of the bond joints is promoted by preventing the bond pad from being placed upside down on the conductor, wherein a material mismatch occurs between the bond pad and the aluminum alloy wire used to electrically connect the package leads to the bond pad, and between the bond pad and the conductor patterned on the substrate. To avoid such a mismatch, the bond pad is configured such that it cannot be picked up with conventional vacuum-operated pick and place devices when delivered upside down to the loading station. As a result, only properly oriented bond pads will be placed on the circuit board, such that the bond pad properly presents the appropriate bond surfaces to the conductor and wire during assembly.

Abstract: Three serially-connected units (19, 20, 21) of a one and half busbar type gas insulated switchgear are disposed parallely, wherein each unit includes: a vertical-type circuit breaker (16) having an upper connection (16a) and a lower connection (16b). To each connection a series connection of a horizontally-extending current transformer (4a, 4b) and a disconnecting switch (2a, 2b) are connected; and oblique connecting busbars (17, 18) each diagonally bridges a disconnecting switch (2a) in the upper disposed series connection to a disconnecting switch (2b) in the lower disposed series connection in the adjacent unit.