Patents Examined by Gerald Tolin
  • Patent number: 6900985
    Abstract: A heat sink clip (1) includes a main body (50), an operating part (30) movably received in the main body, and a pressing cam (70) pivotably attached to the main body. The main body includes a central portion (52), and two hooks (54) depending from opposite ends of the central portion. The operating part includes a driving portion (34) and a handle (32). A plurality of first teeth (346) is formed in the driving portion. The pressing cam includes a plurality of second teeth (74) that mesh with the first teeth. When the handle is slid, the first teeth drive the second teeth to rotate. The pressing cam accordingly rotates until it is forced against a top surface (3a) of a heat sink (3). The main body is thus resiliently displaced upwardly, causing the hooks to be firmly engaged with a socket (5) on which the CPU is mounted.
    Type: Grant
    Filed: July 5, 2002
    Date of Patent: May 31, 2005
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Chun-Chi Chen, Hsieh Kun Lee, Zhigang Liu
  • Patent number: 6882536
    Abstract: A wrap-around cooling arrangement for a printed circuit board is disclosed. Such an arrangement comprises: a printed circuit board (“PCB”) having a first side and a second side opposite to said first side; a heat sink arranged on said first side of said PCB; a first to-be-cooled component coupled to said second side of said PCB; and a thermal jumper to thermally couple said first component on said second side to said heat sink on said first side, said jumper being configured to extend physically around a side edge of said PCB.
    Type: Grant
    Filed: April 25, 2002
    Date of Patent: April 19, 2005
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Jeffrey L. Deeney, Joseph D. Dutson, Glenn C. Simon
  • Patent number: 6781836
    Abstract: A fastening frame of the invention includes a fastener comprised of a transversal connecting arm that connects two attachment parts at two opposite sides. The transversal connecting arm has a thickness that is smaller than the space between the fins, and an edge that is parallel to the base of the heat slug. The fastening frame is thereby mounted in a manner that the transversal connecting arm inserts in a space between two fins with the attachment parts attached to the positioning socle. The transversal connecting arm is further downwardly connected to a pressing part that presses the base of the heat slug in tight abutment against the microprocessor.
    Type: Grant
    Filed: June 17, 2002
    Date of Patent: August 24, 2004
    Assignee: Cooler Master Co., Ltd.
    Inventor: Pei Chih Lei
  • Patent number: 6771493
    Abstract: A notebook computer with a sliding keyboard has the keyboard portion forming an independent keyboard module that mounts on slide rails located on two sides of the body. The keyboard module is laid flat on the body in normal conditions. When in use, the keyboard module may be slid to the edge of the body. The thickness of the body forms an elevation from the desktop surface to allow the keyboard module be raised to an angle to conform to ergonomics to facilitate user operations and to alleviate fatigue in the user's hands.
    Type: Grant
    Filed: July 18, 2002
    Date of Patent: August 3, 2004
    Assignee: MITAC Technology Corp.
    Inventor: Jung Hung Chen
  • Patent number: 6760224
    Abstract: An apparatus for providing heat sinks or heat spreaders for stacked semiconductor devices. Alignment apparatus may be included for the alignment of the stacked semiconductor devices. An enclosure may be used as the heat sink or heat spreader.
    Type: Grant
    Filed: February 25, 2003
    Date of Patent: July 6, 2004
    Assignee: Micron Technology, Inc.
    Inventors: Walter L. Moden, David J. Corisis, Larry D. Kinsman, Leonard E. Mess
  • Patent number: 6724631
    Abstract: A package for power converters in which all parts are electrically connected with one multi-layer circuit board. A sub-package with at least a power-dissipating chip, having a bare top up-facing heat-slug is electrically connected with the board by a plurality of symmetric leads. A heat spreader is directly attached onto the bare top heat-slug of the sub-packages, planar magnetic parts and top surfaces of other components with thermally conductive insulator. The heat dissipated by the sub-packages is transferred to the attached heat spreader by the bare top heat-slug, and further transferred to the ambient. The assembly features compact and inexpensive power converter package with improved electrical performance and enhanced thermal management.
    Type: Grant
    Filed: April 22, 2002
    Date of Patent: April 20, 2004
    Assignee: Delta Electronics Inc.
    Inventors: Runqing Ye, Alpha J. Zhang
  • Patent number: 6717815
    Abstract: A heat dissipation module and its fixed member. The fixed member is disposed on a main board and is provided with a base. The base is provided with a plurality of protrusions. Each of the protrusions is provided with a flange. By means of the flange, the protrusion is engaged with a fixed hole disposed on the main board. Alternatively, the base is provided with a plurality of engaging portions. By means of the engaging portions, the protrusion is engaged with the fixed hole disposed on the main board so that the fixed member is fixed on the main board.
    Type: Grant
    Filed: June 18, 2002
    Date of Patent: April 6, 2004
    Assignee: Quanta Computer, Inc.
    Inventor: Chi-Hsueh Yang
  • Patent number: 6711015
    Abstract: A CPU chip-cooling device is provided. The CPU chip is disposed on a chassis, and the cooling device comprises a heat sink, a bracket and a fan. The heat sink is disposed on the CPU chip. The bracket, having a pivot portion and a retention portion, is pivotally disposed on the chassis by the pivot portion. The fan is disposed on the bracket. The fan is adjacent to the heat sink when the bracket engages with the chassis by the retention portion. The fan is away from the heat sink when the retention portion of the bracket does not engage with the chassis.
    Type: Grant
    Filed: February 4, 2002
    Date of Patent: March 23, 2004
    Assignees: Acer Inc., Wistron Corp.
    Inventors: Harold Syring, Rex Karl
  • Patent number: 6707673
    Abstract: A heat sink is provided for use with stacks of integrated chips. The heat sink includes a thermally conductive body having a heat absorbing section which is inserted within the chip stack, and heat transfer and dissipating sections which are located outside of the chip stack.
    Type: Grant
    Filed: July 29, 2002
    Date of Patent: March 16, 2004
    Assignee: Micron Technology, Inc.
    Inventors: Kevin G. Duesman, L. Jan Bissey
  • Patent number: 6704197
    Abstract: An electronic unit includes a housing and a plurality of heat-generating electronic devices. The devices are stored in the housing. The heat generated by the devices is transferred to the housing and further transferred to ambient air from the housing to cool the electronic unit. A sheet of paper, which is made of art paper having a thermal emissivity higher than the housing, is adhered to an outer surface of the housing to improve the heat radiation from the housing to the ambient air.
    Type: Grant
    Filed: May 1, 2002
    Date of Patent: March 9, 2004
    Assignee: Denso Corporation
    Inventor: Hironori Iwamiya
  • Patent number: 6700781
    Abstract: A heat-dissipating module includes a lower housing, a first magnet portion, a second magnet portion and a circuit board. The lower housing is made of a highly thermal conductive material. The upper housing has an opening in the center thereof, wherein when the upper housing and the lower housing are jointed together, an outlet is defined. The first magnet portion includes a plurality of first magnets. The second magnet portion has a plurality of second magnets, wherein a permanent magnetic field is formed between the plurality of first magnets and the plurality of second magnets. The circuit board is disposed between the first magnet portion and the second magnet portion and having a plurality of winding coils, wherein when a current is applied to the plurality of winding coils, the permanent magnetic field is repulsed to rotate the blade portion, and an ambient air flow is inhaled from the opening and exhaled via the outlet.
    Type: Grant
    Filed: February 5, 2002
    Date of Patent: March 2, 2004
    Assignee: Delta Electronics, Inc.
    Inventors: Liao Chia-Kuan, Hu Sheng-Yan
  • Patent number: 6700780
    Abstract: The present invention relates to an apparatus for supplying heat to directly cooled electronics. To ensure that directly cooled electronics are maintained at a temperature above 0° C., a circulation fan is provided in a transverse junction between an outlet duct and an inlet duct, for a recirculation flow of supplied cooling air, whereby outgoing hot air from the electronics, when necessary, may be mixed with the cold air, so as to raise the temperature of the cooling air to be supplied to the electronics.
    Type: Grant
    Filed: September 27, 2002
    Date of Patent: March 2, 2004
    Assignee: Emerson Energy Systems AB
    Inventors: Klas Hedberg, Per-Olow Bjerkensjo
  • Patent number: 6690576
    Abstract: A cooling fan apparatus includes a plastic housing and an electric fan. The housing containing the fan is mounted directly on the external surface of equipment being cooled. No separate mounting frame is utilized. The modular fan apparatus is on-line replaceable and is useful with other units to provide cooling fan redundancy. Preferably, a filtered electrical connector and a light emitting diode are integrated with the housing.
    Type: Grant
    Filed: July 31, 2001
    Date of Patent: February 10, 2004
    Assignee: Hewlett Packard Development Company, L.P.
    Inventors: Bradley E Clements, Angela L Minichiello
  • Patent number: 6687124
    Abstract: An apparatus for cooling electronic components disposed in a sealed container in a phase change electronic cooling system includes a hood disposed in the container adjacent the electronic components. The electronic components and the hood are immersed in a nonconductive liquid that partially fills the container when the container is in a predetermined location relative to the ground. The apparatus also includes at least one cooling tube having one end connected to the hood and an opposite end disposed adjacent a portion of the electronic components whereby during operation the electronic components transfer heat to the liquid, causing the liquid below the hood to vaporize forming bubbles, the bubbles traveling through the at least one tube and carrying an entrained portion of the liquid to said opposite end.
    Type: Grant
    Filed: June 24, 2002
    Date of Patent: February 3, 2004
    Assignee: General Motors Corporation
    Inventor: Gary B Ostby
  • Patent number: 6680847
    Abstract: An air vent comprises a vent assembly including an electrically-conductive screen mounted inside an enclosure constructed of panels. One or more of the panels has an array of holes through it. The holes are configured and sized to prevent an appendage, such as a finger from penetrating the enclosure. However, the collective hole area is sufficient to permit adequate airflow. The conductive screen covers the holes and provides for EMI suppression.
    Type: Grant
    Filed: December 21, 2001
    Date of Patent: January 20, 2004
    Assignee: EMC Corporation
    Inventor: Christopher S. Heard
  • Patent number: 6678158
    Abstract: A heat sink assembly includes a fixing device (10), a fin member (40), and a fan (50). The fixing device is integrally formed by extruding aluminum. The fixing device includes a base (12), two side plates (16) extending upwardly from opposite sides of the base, and an upper plate (18) connecting the side plates and being parallel to the base, thereby defining a space therebetween accommodating the fin member. Four threaded holes (22) are defined in four corners of the upper plate of the fixing device. The fin member is formed by continually bending a metal sheet to yield a concertina-like structure. The fan is box-shaped, and has four through holes (52) defined in four corners thereof. Four screws (60) extend through the through holes of the fan and engage in the threaded holes of the fixing device, thereby attaching the fan to the fixing device.
    Type: Grant
    Filed: April 22, 2002
    Date of Patent: January 13, 2004
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Liang Hui Li, Tsung-Lung Lee
  • Patent number: 6671177
    Abstract: Graphics card apparatus with improved heat dissipation and including a planar metallic cover plate having an external perimeter configuration that generally corresponds to the plan-form of the printed circuit board used in the graphics card assembly, a plurality of thermal transfer blocks that can be selectively affixed to sources of thermal energy on the graphics card assembly and thermally coupled to the cover plate, and a fan and carriage therefor comprised of a heat sink and flow directing structure. Heat generated by the active board elements is transferred to the thermal blocks, sinked in part to the cover plate and ultimately removed from blocks and plate by air flow drawn into and through thermal baffles or vanes in the cooling structure. The outer surface of the cover plate also provides a broad surface upon which the manufacturer or marketer can display artwork, trademarks or other decorative indicia.
    Type: Grant
    Filed: October 25, 2002
    Date of Patent: December 30, 2003
    Assignee: EVGA.com Corporation
    Inventor: Tai Sheng Han
  • Patent number: 6667886
    Abstract: A cooling body-conductor strips arrangement for electrical devices has a cooling body for withdrawing heat to a surrounding area, a base plate composed of an electrically insulating material and provided with a first conductor strip unit which is embedded in the material of the base plate, the base plate being flatly connected with the cooling body.
    Type: Grant
    Filed: November 9, 2001
    Date of Patent: December 23, 2003
    Assignee: Robert Bosch GmbH
    Inventors: Henning Stilke, Thomas Bilsing
  • Patent number: 6667882
    Abstract: A cooling assembly for dissipating heat produced in a heat generating component of an electronic system includes a shroud assembly. The cooling assembly also includes a heat dissipating device removably housed within the shroud assembly and a fan assembly removably housed within the shroud assembly. The shroud assembly further includes a plurality of mounting assemblies slidably attached to the shroud assembly and configured to removably secure the cooling assembly in thermal connection to the heat generating component.
    Type: Grant
    Filed: May 15, 2002
    Date of Patent: December 23, 2003
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: Donald George Pauser
  • Patent number: 6665187
    Abstract: An electronic package having one or more components comprising: a substrate having a first coefficient of thermal expansion; a lid attached to the substrate, the lid including a vapor chamber, the lid having a second coefficient of thermal expansion, the first coefficient of thermal expansion matched to the second coefficient of expansion; a thermal transfer medium in contact with a back surface of each component and an outer surface of a lower wall of the lid; and each component electrically connected to a top surface of the substrate.
    Type: Grant
    Filed: July 16, 2002
    Date of Patent: December 16, 2003
    Assignee: International Business Machines Corporation
    Inventors: David J. Alcoe, William L. Brodsky, Varaprasad V. Calmidi, Sanjeev B. Sathe, Randall J. Stutzman