Abstract: A power supply apparatus has chassis (42, 44) mounted on opposing surfaces of a heat sink (40). Printed circuit boards (46, 48) are disposed outward of the chassis (42, 44) and detachably secured to the chassis (42, 44). Semiconductor modules (4, 16a, 16b, 32) are mounted on the respective surfaces of the heat sink (40) facing toward the printed circuit boards (46, 48) and extend through the chassis (42, 44). The semiconductor modules (4, 16a, 16b, 32) are electrically connected to the printed circuit boards (46, 48) to form a power supply circuit.

Abstract: The present invention is to provide a snapping device comprising a fastening resilient strip including a main body; at least one bolt parallel to the fastening resilient strip; a contact section moveable along the shank of the bolt; and a hollow support secured to a circuit board having a central hole for receiving an element (such as a CPU) mounted thereon and enabling top of the element to be in contact with a cooler mounted in the support, wherein the fastening resilient strip is secured to the support. Thus, while rotating the bolt, the contact section moves along the bolt toward the cooler due to a reaction of the main body and tightly press the cooler onto the element in an optimum contact condition.

Abstract: A combination device includes an optical fiber guide connected to a fastener for attaching a heatsink to a component and/or to be printed circuit board. As a component on a printed circuit board usually needs to be fastened to a heatsink for cooling, combining a heatsink fastener and a fiber guide allows a more efficient use of board space than using a fiber guide and a heatsink fastener separately. In one embodiment, the device includes a frame, one or more fiber guides attached to the frame, and one or more fasteners (e.g., a snap-on mechanism) connected to the frame. The frame may generally have a rectangular shape, with fiber guides attached to the four corners of the rectangular frame and fasteners attached to the side of the rectangular frame. The fiber guide may be designed to protect the fragile optical fiber and prevent bending of the cable beyond its minimum bend radius.

Abstract: The electronic device with a system for enhancing the cooling of components located therein is provided. The device includes a housing with a fan positioned adjacent the housing and adapted for producing airflow within the housing. The printed circuit board is mounted within the housing, and a heat-producing device is mounted on the printed circuit board. The heatsink is coupled to the heat-producing device, and a shroud is mounted on the printed circuit board and extends up to the heatsink so as to improve airflow in the region adjacent the heatsink.

Abstract: A common heatsink for multiple chips and modules which are spaced on electronic packages, and an arrangement for the formation of precision gaps intermediate two or more chips or modules covered by a common heatsink. Furthermore, a precision tool enables positioning of a common heatsink for multiple chips and modules for electronic packages facilitating the formation of x, y and z-directional compliant thermal interfaces intermediate a plurality of chips and a common heatsink with minimized effects of package tolerances.

Abstract: An electronic assembly 10 is provided, including a substrate 12 having a first a second side 16, and at least one opening 18, and a power device 20 mounted on side 14, positioned over said at least one opening 18, and in thermal communication with said at least one power device 20 through the at least one opening 18.

Abstract: A computer heat dissipating structure of the invention is mounted over a computer main board inside a computer principal unit to dissipate the heat irradiated by at least a principal heat source and a secondary heat source. The computer heat dissipating structure comprises a heat sink that is mounted on the principal heat source, and a fan that is mounted at one lateral side of the heat sink. The fan includes an outer casing that has a lower casing body made of a material having good thermal conduction characteristics. The outer casing further includes an airflow inlet and an airflow outlet that is connected to the heat sink, the lower casing body being placed on the secondary heat source. Via a separate mount of the heat sink and the fan, a lateral blow vis-à-vis the heat sink is thereby achieved to improve the simultaneous heat dissipation of two heat sources.

Abstract: A heat sink assembly includes a fan (10), two fixing members (20), a heat sink (30), and a plurality of screws (40, 50). The fan is generally parallelepiped, and defines four mounting holes (102) in corners thereof. Each fixing member has a first plate (202) defining a pair of first fixing holes (212), and a second plate (204) extending perpendicularly from a top edge of the first plate. An ear (203) defining a second fixing hole (214) corresponding to one of the mounting holes of the fan extends from each of opposite ends of the second plate. A pair of locking holes (302) is defined in a top portion of an outmost fin (304) at each of opposite sides of the heat sink, corresponding to the first fixing holes of one of the fixing members. The fan, the fixing members and the heat sink are fastened together by the screws.

Abstract: A structure and technique for forming an I/C chip module and circuit card construction is provided. An I/C chip module having a flexible substrate, with first and second opposite sides concave, results from the CTE mismatch between the I/C chip and substrate. The I/C chip module is mounted on a flexible circuit card by solderball connection. The curvature of the I/C chip module causes the circuit card to curve correspondingly. A heatsink in thermal contact with the I/C chip places pressure on the I/C chip module in a direction to decrease the curvature. A rigid backing member retains the circuit card, generating a curved space between the backing member and the circuit card. A leaf spring applies pressure to the I/C chip module against the backing member. A compliant member is interposed between the backing member and the circuit board filling a portion of the curved space therebetween.

Abstract: For the cooling of electronic components on a board (2) which is located within an (EMC) shield (3), the shield (3) lying within a housing (1), a part air stream of a fan (5) in the housing wall is guided into the shield (3) by an air guide duct (13). Cooling is highly effective, and known heat-conducting elements between the components (4) and the shield (3) are dispensible.

Abstract: A heat dissipation device includes a vaporizing portion (10), a condensing portion (20), and a pair of pipes (50a, 50b). The vaporizing portion is attached to a heat-generating electronic chip (40) and contains liquid having great heat conductivity. The condensing portion receives vapor from the vaporizing portion, and cools the vapor to back to liquid form. The pipes are engaged with the vaporizing portion and the condensing portion, thus forming a circulatory route for the vapor from the vaporizing portion to the condensing portion, and for the liquid from the condensing portion to the vaporizing portion.

Abstract: A mounting assembly for securing a heat sink (10) to an electronic package (50) mounted on a circuit board (40) includes a back plate (20), a clip (30), and two screws (70). The back plate abuts an underside of the circuit board. The back plate includes a cross-shaped main body (22), and two first positioning posts (24) and two second positioning posts (26). An annular groove (242) and a threaded hole (262) are defined in each first and each second positioning post respectively. The clip includes a horizontal portion (32), and two first legs (34) and two second legs (36). A guiding hole (342) and a communicating positioning slot (344) are defined in each first leg, the positioning slot engagingly receiving a corresponding first positioning post. A fastening slot (362) is defined in each second leg. The screws are inserted through the fastening slots into the corresponding threaded holes.

Abstract: A heat sink clip (10) includes two side plates (104), and two pressing portions (102) connecting between opposing ends of the side plates. Each pressing portion is generally arcuate, which enables it to resiliently press a heat sink. Each side plate is sloped slightly inwardly from top to bottom. This enables the side plates to resiliently clamp a mounting frame. Two first handles (114) are upwardly formed from top edges of the side plates respectively. Two second handles (124) extend outwardly in respective opposite directions from opposite side edges of each side plate. Two legs (134) depend from opposite ends respectively of a bottom edge of each side plate. Two spaced hooks (136) are inwardly formed from a free end of each leg. Two openings (144) are defined in the opposite ends of each side plate respectively, for insertion of a screwdriver thereinto.

Abstract: The present invention relates to an apparatus for adjusting a height of control boxes, which enables a driver to drive with an optimal posture according to his body condition by adjusting a height of the control boxes having operation levers. The apparatus for adjusting a height of control boxes according to the present invention distributes a weight of the control boxes to the upper and lower arms not to be directly transferred to the adjustment shaft, so a large force is not required for the rotations of the adjustment shaft, and, by using the same rotation shaft, has an advantage of enabling the left and right control boxes to simultaneously and constantly have the same height.

Abstract: In a holding and heat dissipation structure for a heat generation part for dissipating heat generated from the heat generation part having lead portions protruded from the main body thereof are soldered at a main substrate, a terminal plate is disposed at a position opposing to the main substrate with a predetermined distance therebetween, and a part housing portion for holding the part is provided at the terminal plate. The part housing portion is concavely formed. Insertion holes for inserting the lead portions protruded from the main body are formed at the part housing portion and the main substrate, respectively. The lead portions are inserted into these insertion holes, and the lead portions and the land portions of the main substrate are fixed to each other by the soldering in a state that the main body is separated from the bottom surface of the part housing portion.

Abstract: A multi-chip package having one or more embedded cooling elements. The package includes a substrate, a plurality of chips, at least one cooling element, a plurality of solder balls and packaging material. The substrate has a front surface and a corresponding back surface. The chip is attached to the front surface of the substrate and electrically connected to the substrate. At least one cooling element is attached to the chips through thermal glue. The solder balls are attached to the back surface of the substrate. The packaging material encloses the substrate, the chips and the cooling elements.

Abstract: An on-board mounting electronic apparatus including an apparatus body 6, made up of a main board 4 and terminal pins 5 for connection with a circuit board 21. The terminal pins 5 extend from an underside of the main board 4. A heat dissipation plate 8 is arranged on an upper surface of heat generating components 2 mounted on the main board 4. The heat dissipation plate 8 is thermally connected with the surface of the heat generating components 2. Such structure may be applied to an on-board mounting electric power supply as well.

Abstract: A wash down filtered fan apparatus for cooling and filtering a cabinet enclosure housing electromechanical equipment and sensitive electronics is provided consisting of an intake housing and exhaust housing. A blower mounted within an intake housing induces ambient air for cooling while a plurality of downwardly angled baffles provide protection at both intake and exhaust ports preventing the threat of detrimental external elements consisting of dust, residue, rain, pressurized water and other splashing liquids from penetrating such apparatus and cabinet enclosure housing.

Abstract: The present invention is to provide a wind guide device for a cooling fan mounted on a CPU of a computer comprising a first shroud and a second shroud. A first opening at one side of the first shroud having the fan mounted thereon is coupled to a vent opening on a housing of the computer for convection. A first opening at one side of the second shroud is coupled to a second opening at the other side of the first shroud to form an upper air passage and a lower air passage. Fins on one side of the CPU are partially enclosed by an L-shaped frame element extended from the second shroud so as to cause an air current generated by the fan to accelerate through the upper and lower air passages for cooling the CPU and other electronic elements therearound.

Abstract: A switchgear cabinet having at least one cabinet door and a fan-assisted air circulation on an interior for cooling heat-generating devices installed inside, which are disposed one above the other in tiers. With particular air circulation, the partial cooling air flows in the tiers and can be set and adjusted, to a large extent independently of one another.