Abstract: An add-on cartridge structure for electronic devices having a housing formed from upper and lower case sections. The upper case is typically made from plastic and has a conductive layer formed on inside surfaces, while the lower case is made from a metallic material such as aluminum. A wall-like mating member is disposed on an outer edge of the lower case, and mates with the sides of the upper case to form a nearly rectangular cross section housing. The double conductive layer formed by the outside surface of the mating member and the inside surface of the upper case prevents leakage of electromagnetic radiation from the cartridge. Furthermore, high frequency noise is prevented by grounding both the signal ground of the printed circuit board and the frame ground at multiple locations. The conductive layer has a surface break caused by a through-hole through which the printed circuit board plug protrudes to the outside.

Abstract: A heat sink for a compact, integral lamp system comprises a bimetal strip or a bimetal heat pipe containing a liquid. With temperature change, the bimetal strip or pipe flexes toward one metal or the other, depending on the physical properties of the particular metals. The deformation of the strip causes heat sink fins to press against the surface of the ballast wall, thereby significantly reducing or eliminating the air gaps therebetween and thus more effectively removing heat from the ballast.

Abstract: A power supply apparatus including a plurality of power modules, a holder-case, and a fan. The holder-case is box-shaped with a first surface plate and second surface plate as two surfaces, and contains a plurality of power modules arranged laterally, parallel, and in the same plane. A plurality of walls are provided between the plurality of laterally arranged power modules, and divide the holder-case interior into a plurality of rows of partitions. One row of power modules is disposed in each partition row. The power supply apparatus uses the fan to divide and induce air flow through flow inlets formed in the first surface plate into the plurality of partitions, and expels air out exhaust outlets formed in the second surface plate to cool power modules disposed inside each partition.

Abstract: The present invention provides a system to mount a group of fans on the system board of a computer server. The mounting system allows for the fans to be installed or removed as a group or as individual components without the use of tools. The fans are preferably hot-pluggable, or capable of being installed or removed without having to turn off the server. Therefore, an entire group of fans can be removed from a server without using any tools or having to power down the system. The fans can also be removed and installed as individual units, without effecting the other fans in the group.

Abstract: A computer cooling system including a cooling fluid source, and a cooling duct array adapted to distribute cooling fluid from the cooling fluid source over a plurality of high dissipation components on a circuit board.

Abstract: A planarizing heat sink plate having a top portion and a bottom portion is provided. The heat sink plate includes a plurality of receiving means formed therethrough and operable to receive a module ejection device, and at least one removing means formed therethrough and operable to receive a driving device. Also included is at least one planarizing projection formed on the bottom portion and adapted to receive a radiographic sensor module. The at least one removing means is disposed between the plurality of receiving means, and the at least one planarizing projection corresponds to the at least one removing means. The heat sink plate is a multi-functional device that can aid in forming an efficient radiographic detector head comprising a plurality of radiographic sensor modules in the same plane, safely removing the radiographic sensor modules, and conducting heat away from the radiographic sensor modules.

Abstract: A retention module includes a socket to connect to a package. At least one retention arm is coupled to the socket. At least one clamping bar is coupled to the at least one retention arm to secure placement of a heat sink against a surface of a package assembly.

Abstract: A system for cooling a component in a computer system is disclosed. The system comprises a socket for receiving the component and for coupling the component to a planar. A heat dissipating element is coupled to the component and to the socket via a plurality of socket tabs coupled to the socket. At least two socket tabs include an embedded reinforcing strip which extends from the socket. A further aspect of the present invention provides securing the socket to the planar by extending the reinforcing strip from each of the at least two socket tabs through the socket and out of a bottom surface of the socket, and coupling the reinforcing strip from each of the at least two socket tabs to the planar.

Abstract: An electronic control unit (10) mounted in a vehicle engine compartment, having a plastic case body (14), metal collars (32) each molded into the plastic case body, a metal base (12) having bolt through-holes (28) prepared in the same number of the metal collars such that a bolt passes through each metal collar and one of the holes corresponding thereto, and a heat-generating component (18) mounted on the base.

Abstract: A vacuum feedthrough heatpipe assembly includes a heatpipe having an inner end coupled to a heat generating device within a vacuum chamber, and an outer end disposed externally of the vacuum chamber. A vacuum flange seals the heatpipe to an opening in the chamber wall. The invention also includes an articulated arm assembly, each arm being a sealed heat pipe, the arms joined by angularly adjustable elbow joints. The heatpipe may comprise an electrically insulating construction formed of quartz or ceramic tube.

Abstract: A liquid-cooled circuit device including: a module having a circuit element and a module base plate on surface of which the circuit element is mounted; a circuit case for accommodating the module; and a cooling liquid chamber for flowing a cooling liquid in contact with a back face of the module base plate of said module. The module base plate of the module is fitted into an opening provided in a member forming the cooling liquid chamber and welded without a gap.

Abstract: An ignition apparatus is provided for internal combustion engines to obtain higher reliability for the solder bonding parts. The ignition apparatus includes a molded case having an input-output terminal formed on the molded case, a semiconductor switching device, a control circuit board, and a heat sink. As such, the molded case provides a single body for containing the input-output terminal, the semiconductor switching device, the control circuit board and the heat sink. On the heat sink, one or more laminated structures are used, including the semiconductor switching devices with beryllia as an electric insulation plate.

Abstract: A heat sink assembly includes an electronic device, a heat sink and a clip that compresses the heat sink against the electronic device. A spacer is mounted on the clip to restrain motion of the heat sink relative to the electronic device. A method of securing a heat sink to an electronic device includes compressing the heat sink against the electronic device with a clip, and attaching a spacer to the clip in order to restrain motion.

Abstract: A liquid-cooled circuit device including: a module having a circuit element and a module base plate on surface of which the circuit element is mounted; a circuit case for accommodating the module; and a cooling liquid chamber for flowing a cooling liquid in contact with a back face of the module base plate of said module. The module base plate of the module is fitted into an opening provided in a member forming the cooling liquid chamber and welded without a gap.

Abstract: A water-cooled system and method for cooling electronic components. The system includes a surface. At least one electronic component is coupled to the surface, the at least one electronic component including an integrated circuit. A closed-loop fluidic circuit is coupled to the surface for removing heat from the integrated circuit. The closed-loop fluidic circuit includes a heat exchanger. A blower is coupled to the surface, the blower having a first port, a second port, and an impeller that rotates around an axis. The blower is oriented such that the axis is perpendicular to the surface and non-intersecting with the heat exchanger, wherein the blower moves air through the heat exchanger.

Abstract: An electronic module substrate assembly and fabrication method, the assembly providing good thermal conductivity between an electronic device and an aqueous coolant, while maintaining physical separation between the coolant and electronic device, and relieving mechanical stresses caused by mismatches in thermal coefficients of expansion of materials within the device assembly. The assembly includes a substrate, at least one electronic device, and a preformed, thermally conductive, impermeable barrier. The barrier is preformed into a plurality of regions, some of which are bonded to other structures. One barrier region preferably forms a fluid tight seal with the substrate perimeter. At least one other barrier region forms a low thermal resistance bond with the at least one electronic device.

Abstract: An electronic equipment includes one or more electronic devices, a cold stage, and a cold insulation member. The one or more electronic devices perform a predetermined operation within a predetermined temperature range. The cold stage cools down the one or more electronic devices to a predetermined operational temperature at which the one or more electronic devices is operable. The phase transition temperature of the cold insulation member is in a range between the predetermined operational temperature and an upper limit of the predetermined temperature range. The cold insulation member is arranged adjacent to the one or more electronic devices, and retains the temperature of the one or more electronic devices within the predetermined temperature range. At least one electronic devices over which the cold insulation member is arranged is partially formed from a material which is in a superconductive state at the predetermined operational temperature.

Abstract: A system and method for cooling electronic components. A liquid is heated to a temperature near its boiling point and directed against electronic components such that a portion of the heated liquid vaporizes, forming a mixed phase fluid. The mixed phase fluid is drawn away from the electronic components and the vapor is condensed back into a liquid.

Abstract: A computing system includes a pivoting mounting structure for mounting one or more electronic devices. The mounting structure is itself mounted to pivot between an operating position, within the computing system, and a service position, with the pivoting mounting structure extending outside the computing system for the installation or removal of electronic devices. A support member, mounted to pivot on the mounting structure, is manually moved between an extended position, in which the frame of the computing system is contacted to prevent movement of the mounting structure away from the service position past the operating position, and a retracted position, in which the mounting structure can be moved between the operating and service positions without contact between the support member and an adjacent structure.

Abstract: An electronic component assembly is disclosed. The electronic component assembly may comprise a printed circuit board, a frame secured to the printed circuit board and one or more electronic components mounted in the frame and arranged in electrical contact with conductive traces of the printed circuit board, wherein no solder is used to connect the electronic components to the printed circuit board. A method for assembling the electronic component assembly is also disclosed.