Abstract: An electronic circuit is equipped with a lid-shaped heat sink made from aluminum sheet. Components are held in contact with the wall of the heat sink by means of lugs connected to the heat sink. The lugs are formed by bending U-shaped parts of the aluminum sheet out of the plane of the aluminum sheet.

Abstract: A mounting structure for a semiconductor device of the present invention includes a substrate, a semiconductor device, a plurality of connecting members and a member. The substrate has a first surface and a plurality of pads on the first surface. The semiconductor device has first and second main surfaces and a plurality of terminals provided, on the second main surface, at locations corresponding to the pads. The connecting members connect the pads to the terminals, respectively. The member has at least one surface which is coupled to the first main surface. The thermal expansion coefficient of the member is equal to, or substantially equal to, that of the substrate.

Abstract: An enclosure includes spaced apart sidewalls and a bottom wall, rear wall, and top cover each forming an RF tight seal with the sidewalls, and defining separate chambers for a plurality of circuit packs. The edges of the sidewalls, bottom wall and top cover at the entrance to each chamber are configured to form an RF tight seal with the faceplate of an installed circuit pack. A fluid for cooling the circuit pack enters each chamber and a baffle allows the fluid to escape while being resistant to the transmission of RF energy. Surfaces of the sidewalls that are interior to each chamber are able to disrupt and absorb a substantial portion of the RF energy radiating from the enclosed circuit pack and thereby minimize the level of RF energy within the chamber.

Abstract: A computer assembly is disclosed having a computer system having at least a central processing unit and memory located within a chassis, and a housing, wherein the computer system is located within and coupled to the housing. The housing has first and second portions positioned substantially adjacent to one another and configured so as to define therebetween at least first and second substantially identical ports in at least first and second sides of the housing respectively. The assembly further includes a mounting member for mounting the computer assembly to a supporting structure, with the mounting member being capable of being removably coupled to the chassis through either of the first and second ports. The computer assembly may also include a locking assembly having a locked state in which the first and second housing portions cannot be separated from one another, and an unlocked state in which the first and second housing portions can be separated from one another.

Abstract: A load center is upgraded by removing the existing load center and replacing it with a renovation load center. As the existing incoming and branch circuit wiring may not be sufficiently long enough to reach the proper terminations in the replacement load center, renovation terminal blocks are provided in the renovation load center adjacent the penetrations of the external wiring to which the incoming lines, and if necessary, the branch circuit wiring are connected. Cabling is then provided between the terminations on the renovation terminal blocks and the appropriate load center terminations. The renovation terminal block(s) can be housed in an auxiliary enclosure mounted adjacent to a main enclosure containing the load center interior or all of the components can be housed in a single renovation enclosure.

Abstract: A heat sink comprises a side including a structural member defining a distance between a heat generating structure and the second side of the heat sink.

Abstract: The invention refers to a telecommunications system comprising a module rack that defines a core bay, a service plane and a rack interface plane where the service plane is transverse to the rack interface plane. The core bay is in part bounded by the service plane and the rack interface plane. The telecommunications system also comprises a series of electronics modules each defining an electronics orientation plane where each of the modules includes two opposed cooling surfaces oriented substantially parallel to the electronics orientation plane. Each of the electronics modules is removably secured within the core bay. The series of the electronics modules forms an array such that their electronics orientation planes are substantially perpendicular to both the rack interface plane and the service plane. The array also defines at least one coolant stream passage across each cooling surface.

Abstract: A semiconductor chip package with cooling arrangement includes a heat sink adapted for covering at least a semiconductor chip, characterized in that said heat sink has an inverted U-shaped cross section thereby forming a recess at an inner bottom thereof adapted for covering at least a semiconductor chip and a plurality of pins extending downwardly from a circumferential lower edge of said heat sink, each of said pins being formed with a neck, an enlarged head, and an open slot separating said neck and said enlarged head into two portions, whereby the package can rapidly remove heat from the semiconductor chip, filter noise and reduce inductance.

Abstract: A reliable bracket for CPU cooler having a latched piece on each of four corners is provided. Bracket comprises a rectangular hollow frame, a flat area extended between frame and a central opening for supporting cooler, a lower surface of flat area being in proximity to CPU, four upright members on four corners of frame, an opening on each upright member, each opening being secured to corresponding latched piece; a tunnel on each corner of flat area; and a well on a lower part of each tunnel and including a channel aligned with tunnel. Tunnels and channels of wells are driven through by fasteners to secure bracket to mainboard.

Abstract: Edges of the surface metal of a cage shield are bent inwardly towards an interior of a cavity formed by the cage shield to eliminate leakage at apertures in the shield. In a further embodiment, bends can also be formed by the metal layers and through holes within a printed circuit board.

Abstract: A fixing apparatus includes a retention module (30), four rivets (10), and a back plate (50). The retention module is attached on a motherboard (60), the motherboard defining four orifices (62) therein. The retention module defines four through holes (31) therein. The back plate is attached on an underside of the motherboard, for reinforcing the motherboard. The back plate defines four apertures (52) therein. Four posts (34) depend from the retention module through the orifices and the apertures. A bore (36) is defined through each post, and in axial alignment with a corresponding through hole. The rivets are inserted through the through holes and the bores such that the posts are firmly engaged with the motherboard and the back plate.

Abstract: A disk drive module is adapted to be slidably disposed within the chassis of a data storage system. The disk drive module includes a fiber channel disk drive for storing data, an upper carrier sled mounted onto the disk drive and a lower carrier sled mounted onto the disk drive. A bezel assembly is snap mounted onto the upper and lower carrier sleds. The bezel assembly includes a bezel which is capable of lateral displacement relative to the upper carrier sled, an ejector pivotally mounted onto the bezel for releasably locking the disk drive module within the chassis, and a latch for releasably locking the position of the ejector. An adaptive spring includes a first end which is mounted onto the upper carrier sled and a second end which abuts against the bezel, the adaptive spring resiliently urging the bezel away from the upper carrier sled.

Abstract: An object of the present invention is to provide an information processing equipment which is excellent in the shock resistance, and has a strap and pen storing portion, and has a drip-proof ability. The information processing equipment 1 is constructed by putting a lower case 2 as the base and successively stacking a main board 3, a chassis 4, an LCD 5, a touch panel 6, a packing 7 and an upper case 10 in this order. A battery 11 for driving the equipment is provided and is detachable from the lower portion of the lower case 2. Further, an inverter board 14 for driving the LCD 5, a flexible cable 15 and an inverter cushion 18 is arranged in a position in the upper portion of the chassis 4 and beside a speaker 12. The flexible cable 15 from the main board 3 is connected to the inverter board 14, and a lead wire of the LCD 5 is connected to the inverter board 14.

Abstract: A CPU cooling structure is constructed to include a CPU holder holding a CPU, a heat sink mounted on the CPU holder in contact with the CPU, two fans at two sides of the heat sink, and a narrow elongated, substantially -shaped heat sink fastener bridged the heat sink and hooked on front and back hooks of the CPU holder to secure the heat sink in position, the heat sink fastener having a top center screw hole fastened to a top center locating hole of the heat sink by a hand screw, and two coupling end pieces respectively extended from the ends of two arms thereof and hooked on the hooks of the CPU holder.

Abstract: A spring loaded drive clip that retains a drive unit, typically a CD drive, in a component tray that is utilized in a rack mounting arrangement for a computer system is disclosed. The clip is mounted onto the chassis of the component tray, and includes a defined internal receiving area that receives the drive. The clip is mounted in the drive compartment so that arms of the clip support the drive as it is inserted into the compartment. As the drive unit is inserted, the arms of the clip are displaced outward by the drive as the drive moves into the compartment, thereby creating a spring force. One of the arms of the clip includes an inward extending securing projection. As the drive is inserted into the compartment, the drive must overcome an inward bias of the arms created by displacement of the spring blade in each of the arms. Therefore, as the drive is seated in the compartment, the securing projection is urged inward toward the drive.

Abstract: A system to facilitate the use of an automation control disposed within an enclosure. An automation control, such as a distributed motor starter, is disposed within an enclosure. The control is coupled to modules, such as I/O modules, mounted to a glandplate. The glandplate is mounted to the enclosure over an appropriate opening. Furthermore, the glandplate is designed to accommodate a variety of module arrangements and to facilitate the connection of various data and power lines without individually wiring the lines to a separate terminal block.

Abstract: To prevent an operator from being hurt by a hot outside panel of an electronic device when he touches the outside panel with his hand or a portion of his body, the outside panel is improved and an electronic device safe for the operator is provided. There are provided spaces for heat insulation in an outside panel and, by the action of the spaces, the apparent temperature of the outside panel is decreased. Also, ducts are provided in the outside panel, and the temperature of the outside panel itself is decreased by the action of the ducts. Further, a large number of protrusions are provided on the surface of the outside panel, and a heat insulating section is formed at the forward end of each protrusion, so that the apparent temperature is decreased.

Abstract: This invention provides a combined base frame for supporting and fixing a CPU heat sink. The base frame has a left-side frame body and a right-side frame body. The buckling pieces are integrally formed under the base frame. The base frame can be efficiently mounted on a circuit board by the engagement between the left-side frame body and a right-side frame body. When an operator needs to install a CPU onto the circuit board, the base frame can be disassembled in a short time.

Abstract: A heat sink retention frame is disposed about an electronic package, and a heat sink is disposed within the heat sink retention frame above the electronic package. A clip is mounted across a lateral edge surface of the heat sink and fastened to the heat sink retention frame. The clip can help hold the heat sink in place during normal operation and can retain the heat sink in the retention frame during mechanical shocks.

Abstract: A securing device for a locking member of a heat dissipating element of a CPU includes several engaging members and a main body. The heat dissipating element is locked between upper removable parts and a base of the locking member. The engaging members each has outwardly sticking engaging parts and inwardly sticking engaging parts; all the engaging parts are bent upwardly to become sloping surfaces; the outward engaging parts have sharp outer ends. The outward engaging parts of each of the engaging members engage one of annular walls around recesses formed on the base to fix the engaging member to the base. The main body is disposed under a main board with connecting poles thereof passing through a respective hole of the main board and central holes of the recesses.