Abstract: Rack assemblies and methods for cooling one or more rack-based computer systems, as well as data center configurations that utilize the rack assembly. The rack assembly comprises a rack providing support for multiple columns of heat-generating electronic devices and device fans for moving air from an air inlet side of the rack through the devices and through an air outlet side of the rack. The rack assembly also comprises a unitary door having a support frame spanning the air outlet side of the rack and hingedly coupling the door to a rear vertical edge of the rack. The door includes an air-to-liquid heat exchanger panel spanning an air outlet passage inside the support frame so that substantially all of the air passing through the air outlet must pass through the heat exchanger panel. The air outlet passage has a cross-sectional area that is substantially equal to or greater than the cross-sectional area of the multiple columns of heat-generating devices.

Abstract: A notebook computer (1000) includes a base (100), a cover (300), a computer printed circuit board (PCB) (200) and a centrifugal fan (40). The cover covers the base, and cooperates with the base to form a receiving space (500) therebetween. The computer PCB is received in the receiving space and mounted on the base. The centrifugal fan is received in the receiving space, and includes a stator (401) and an impeller (402), rotatable with respect to the stator. The stator includes a motor (415) and a fan PCB (405) directly attached to the base. The motor electrically connects to the fan PCB. When the impeller rotates, airflow enters the receiving space through top and bottom air inlets (304, 104). The fan PCB is integrally formed with the computer PCB and has a height less than the computer PCB.

Abstract: A heat dissipating device includes a bracket, a heat dissipater and a circuit board. The bracket includes a bracket and a cover. The bracket includes an inside wall, an outside wall, a pair of sidewalls extending perpendicularly from opposite ends of the outside wall and opposite ends of the inside wall, and a bottom wall perpendicularly positioned between the sidewalls and connected to the inside wall. The cover is attached to the bracket. The heat dissipater is attached to the bottom wall and receiving in the cover. The circuit board is configured to supply power for the heat dissipater and attached to the bracket. The circuit board is capable of connecting with a power interface of the electrical device to power the heat dissipaters.

Abstract: A method and apparatus for dissipating heat from an electronic device is described. The method and apparatus provides a scalable, cost effective, highly efficient, universally applied thermal solution for high heat generating electronic components. In one embodiment, a housing attaches over a heat sink for an electronic device. Various cooling attachments can be attached to this housing to provide a multitude of air flow enhancers. The cooling attachments are designed to provide a thermal engineer or a system integrator with several options for cooling an electronic component. The cooling attachments can be placed in multiple configurations to provide unique thermal solutions. In another embodiment, a kit of parts for a cooling system is provided. The kit of parts includes a housing and a variety of cooling attachments.

Abstract: A liquid cooling unit includes components such as first and second heat receivers, a heat exchanger, a tank and a pump in an electronic apparatus. The electronic apparatus includes a first enclosure and a second enclosure coupled to the second enclosure for relative movement. The liquid cooling unit is enclosed in the first enclosure. No component of the liquid cooling unit is enclosed in the second enclosure. The liquid cooling unit is thus incorporated in the first enclosure in a facilitated manner. This results in a reduced production cost. The liquid cooling unit can also be removed from the first enclosure in a facilitated manner.

Abstract: According to one embodiment, an electronic device includes a housing, a heat generating part contained in the housing, and a loop heat pipe contained in the housing. The loop heat pipe includes a heat receiving portion, a heat radiating portion, a vapor flow path and a liquid return flow path. The heat receiving portion includes a first region connected to the liquid return flow path and provided with a wick, and a second region formed to be hollow, connected to the vapor flow path. The heat receiving portion is thermally connected to the heat generating part at a position across the first region and the second region.

Abstract: A method and incorporated assembly is provided to enhance structural integrity and prevent interface deflection in a computer rack having a midplane and capable of housing a plurality of nodes. The assembly comprises at least one structural filler book capable of being disposed above or below said midplane where any node may be disposed having geometry and material properties to resist and counteract the plugging force of said node an causing a cancellation effect. The filler book have at least two horizontal supports being connected to one another via a vertical support and a plenum an air for directing air flow. The filler book is being secured to said rack or midplane via an engagement component disposed on one of its horizontal supports.

Abstract: The disclosed embodiments include a plurality of plenums for distributing cooling air throughout the switch. The switch is divided into separate cooling domains. Each PCB receives a separate supply of cooling air, so that no PCB is located upstream or downstream from another PCB. The present embodiments thus eliminate the problem of stack rise, which can decrease switch performance.

Abstract: For mounting in a host on a motherboard over memory modules in insertion slots and cooler modules on CPUs on the motherboard to guide currents of air in carrying waste heat from the cooler modules and the memory modules to the outside of the host, an adjustable air director is disclosed to include a main air duct shell, which has sliding tracks on the top wall thereof, and a supplementary air duct shell, which is attached to one lateral side of the main air duct shell and has sliding coupling devices respectively coupled to the sliding tracks and movable with the supplementary air duct shell relative to the sliding tracks to adjust the transverse width of the adjustable air director subject to the arrangement of the CPUs and the insertion slots on the motherboard.

Abstract: The present invention discloses a hot pluggable fan system and connection apparatus. The system includes at least one fan assembly, and a hot pluggable fan connection apparatus. The hot pluggable fan connection apparatus includes a bottom plate; a crossbar existed on the bottom plate, for dividing the bottom plate into a forepart and a rear part; two side panels located on both sides of the bottom plate and vertical to the crossbar; a beam connected to the two side panels and above the crossbar; and one or more fan baffles combined with the side panels for forming at least one slot for accommodating the fan assembly, the baffles located at the forepart of the bottom plate and parallel to the side panels.

Abstract: A mounting device (10) for mounting a heat sink (20) to a printed circuit board (40) on which a heat generating electronic component (30) is disposed, includes a mounting frame (100), two clasping legs (104) and four resilient arms (105). The mounting frame includes two first mounting arms (101) and two second mounting arms (102) disposed above the first mounting arms. The first mounting arms abut on the circuit board. The clasping legs connect with the second mounting arms and are inserted through the printed circuit board to be attached to the printed circuit board. The resilient arms connect with the second mounting arms and exert a downward resilient force on the heat sink toward the heat generating electronic component.

Abstract: A conductive heat transport cooling system and method are provided for cooling primary and secondary heat generating components of an electronics system. The cooling system includes a liquid-based cooling subsystem including at least one liquid-cooled cold plate physically coupled to at least one primary heat generating component of the electronics system, and a thermally conductive coolant-carrying tube coupled to and in fluid communication with the at least one liquid-cooled cold plate. A thermally conductive auxiliary structure is coupled to the coolant-carrying tube and to at least one secondary heat generating component of the electronics system. When in use, the thermally conductive auxiliary structure provides conductive heat transport from the at least one secondary heat generating component to the at least one thermally conductive coolant-carrying tube coupled thereto, and hence via convection to liquid coolant passing therethrough.

Abstract: A heat dissipating device includes a heat sink, and a block. The heat sink includes a base and a plurality of fins formed on the base. A bottom portion of the base defines a first groove. The block defines a second groove in one surface of the block. The block is received in the first groove, and an electronic component is received in the second groove.

Abstract: A storage control device comprising a plurality of logic boards having a plurality of cooling objects, comprises a first cooling device for cooling the plurality of cooling objects on each of the logic boards, and a second cooling device for cooling at least one special cooling object out of the plurality of cooling objects on each of the logic boards.

Abstract: The present invention provides an air cooling system for an electronics rack, including: a front inlet area disposed between a lower shelf of the electronics rack and an upper shelf of the electronics rack, substantially adjacent to a middle shelf of the electronics rack, wherein the front inlet area includes a lower front inlet area, a middle front inlet area, and an upper front inlet area; a lower fan assembly disposed substantially adjacent to the lower shelf; and an upper fan assembly disposed substantially adjacent to the upper shelf. The front inlet area, the lower fan assembly, and the upper fan assembly are collectively operable for pulling the cooling air flow into the front of the electronics rack, through the middle shelf, and into a backplane of the electronics rack. The front inlet area, the lower fan assembly, and the upper fan assembly are collectively operable for pulling the cooling air flow into the front of the electronics rack and through the lower shelf and the upper shelf.

Abstract: A fiber distribution terminal system includes a below ground vault, and a terminal enclosure within the vault. The system also includes a lift system in the vault, the lift system including a screw drive and a track system. Rotation of the screw drive lifts the terminal enclosure from a below ground to a lifted position, and the track system guides the terminal enclosure as the enclosure is lifted. The system also includes a tool such as a cordless drill to drive the screw drive. The screw drive can include a ball screw and a ball nut. The system can include a bracket to couple the terminal enclosure to the screw drive and the track system. The track system can include two sets of tracks, a first set of tracks that is fixed in the vault, and a second set of tracks that is coupled to the first set of tracks.

Abstract: A heat dissipation device includes a heat sink assembly, a fan holder and a fan mounted in the fan holder. The heat sink assembly includes a heat spreader for contacting with a heat-generating electronic component, and two fin assemblies thermally connecting with the heat spreader and sandwiching the fan therebetween. Each fin assembly defines cutouts at opposite ends thereof. The fan holder includes a top plate and a pair of vertical, downward-extending baffle walls. A pair of clamping arms extends from each baffle wall and inserted into the cutouts of the fin assemblies. Screws extend through the top plate to engage in holes defined in the fin assemblies and communicating with the cutouts. A vaulted operating plate is formed by the top plate for a user to grip to conveniently transport the heat dissipation device.

Abstract: A thermal transfer apparatus for cooling a heat-producing electronic component includes an evaporator disposed over the heat-producing electronic component and thermally coupled to the heat-producing electronic component, a plurality of heat pipes carrying a working fluid therein disposed over the evaporator and thermally coupled to the evaporator, a cold plate thermally coupled to a first end of the plurality of heat pipes, and a condenser thermally coupled to a second end of the plurality of heat pipes. The heat pipes extend over the evaporator such that the first end and the second end of the heat pipes couple to the cold plate and condenser at a location not over the heat-producing electronic component. The cold plate and the condenser are supplied with a coolant from outside the thermal transfer apparatus.

Abstract: A heat sink assembly for removing heat from a plurality arrays of heat generating-components mounted on a printed circuit board includes a fist and a second heat sink, a plurality of fastening assemblies. Each of the first and second heat sinks comprises an elongated base and a plurality of fins mounted on the base. The base extends beyond the fins at two lateral sides of the fins to form a first shoulder and a second shoulder located above the first shoulder in a manner such that the second shoulder of the first heat sink is superposed on the first shoulder of the second heat sink. The fastener assembly extends through the superposed first and second shoulders of the first and second heat sinks to assemble the first and second heat sinks on the printed circuit board.

Abstract: An air director includes a fan bracket, which has a circular center opening, a fan mounting structure provided at the front side to secure a fan and to have a fan blade of the fan in alignment with the circular center opening, a plurality of clamping arms extended from the rear side for fastening to respective side arms at a motherboard at two sides relative to insertion slots on the motherboard, and protruding blocks and eye lugs disposed above the protruding blocks, and an air duct, which has a bottom open side attached to the motherboard around the insertion slots, front hooks and top hooks respectively hooked on the protruding blocks and the eye lugs of the fan bracket.