Abstract: A heat spreader having at least two adjoining strips of pyrolytic graphite material is made by cutting a strip from a sheet of pyrolytic graphite in the z direction. Thermal conductivity in the xy plane of the graphite sheet is greater than in the z direction. The z direction cut provides strips which are then each individually oriented 90 degrees such that the thickness direction of the original pyrolytic graphite sheet becomes the width or length of the cut strip. A face on the side of a first strip adjoins a face on the side of a second strip. Due to the greater thermal conductivity in the xy plane of the strips as compared to in the z direction heat transfers more rapidly in the length and thickness direction of the strips than across adjoining sides of the oriented strips.

Abstract: A fastener includes a connecting pole, a sleeve, an elastic element enclosing the sleeve and a baffling portion. The connecting pole includes a shaft, a head and a thread portion. The sleeve includes an engaging portion and a receiving portion extending from the engaging portion. The engaging portion encloses a top end of the shaft therein and abuts against the head. The receiving portion encloses a bottom end of the shaft and a top end of the thread portion. The receiving portion includes a plurality of spaced resilient pieces. The baffling portion screws onto the thread portion of the connecting pole. When the connecting pole rotates relative to the sleeve, the baffling portion moves upwardly along the thread portion to push the pieces of the receiving portion outwardly to make the pieces abut against a bottom surface of a printed circuit board.

Abstract: A flat vapor chamber apparatus and method are provided for transferring heat between integrated circuits. In use, a flat vapor chamber is provided with a first end in thermal communication with a first integrated circuit and a second end in thermal communication with a second integrated circuit.

Abstract: An outdoor apparatus that incorporates a heat sink and has a box-shaped casing, having a plurality of aligned ventilation holes formed on an upper plate and a lower plate so as to oppose the heat sink, and wherein inter-hole portions that are portions of the upper plate between adjacent ventilation holes are recessed downward with respect to other portions of the upper plate.

Abstract: A meter cover is provided and includes an opaque portion, including an outer perimeter section to perimetrically fit around a meter, a sidewall extending axially from the perimeter section toward a frontal region and a shield disposed at a portion of a sidewall edge at the frontal region and a transparent portion having an edge, which is shiplap joint bonded with a remaining portion of the sidewall edge and edges of the shield.

Abstract: A motor control center subunit includes a subunit housing configured to fit within a motor control center. The housing has a front panel. The motor control center subunit also includes a drive mechanism attached to the subunit housing. The drive mechanism is configured to control a plurality of line connectors to move between a retracted position and an extended position when the subunit housing is seated in the motor control center and the front panel of the subunit housing is in a closed position. A window is disposed in the front panel of the subunit housing and is positioned to provide a view of the plurality of line connectors.

Abstract: An electrical connector assembly is provided for connecting an IC chip (2) to a printed circuit board (3). The electrical connector assembly includes a housing (1) engaging with the IC chip, a heat sink (6), a loading plate (4) and a number of first connecting portions (5). The loading plate is located between the heat sink and the housing and has a number of spring plates (41) extending toward the IC chip. The first connecting portions are provided for connecting the heat sink to the printed circuit board.

Abstract: In a system for housing electronics cards, methods and systems for cooling the electronics cards are presented. Each electronics card preferably contains heat-producing electronics and a heat sink, and is preferably placed within a card guide of the chassis and secured into position with a clamping device. At least one of the heat sink, the card guide, the clamping device, and a cold wall of the chassis are used to facilitate the conduction cooling of the heat-producing electronics. Furthermore, a clamping device may rigidly secure a card into position, thus reducing the impact of vibrations (including shock) on the card. Additionally, an air flow further cools the electronics cards, the card guides, and/or the cold wall.

Abstract: A switchgear cabinet assembly or rack assembly including an electric supply device that can be or is connected to a primary power supply. Equipment that is housed in at least one switchgear cabinet or rack on the user side, or equipment that is to be supplied with electricity can be or is connected to the electric supply device. To achieve simple and reliable connection options, a sub-distribution device is located in the switchgear cabinet or rack or in a separate cabinet or rack. The device has at least one sub-distribution unit that can be or is connected to the primary power supply, having a housing or frame and being retained and secured by a mounting unit. According to this invention, the sub-distribution unit can be or is connected to primary supply lines that lead to the primary power supply and to pre-fabricated connection lines that lead to the rack.

Abstract: A heat dissipation device for dissipating heat generated from an add-on card. The heat dissipating device includes two heat sinks and two heat pipes connecting with the two heat sinks. Each of the heat sinks includes a base and a fin group mounted on a top surface of the base. Each of the heat pipes includes a connecting section and two heat-conductive sections extending from opposite ends of the connecting section. One of the two heat-conductive sections of each of the heat pipes is sandwiched between the base and the fin group of one heat sink, and another of the two heat-conductive sections is sandwiched between the base and the fin group of another heat sink.

Abstract: A method of producing a thermally conductive cover for an electric circuit assembly having a plurality of heat dissipating components is disclosed. The thermally conductive cover including a top surface, a bottom surface, and at least one rib extending downwardly from the bottom surface. The method includes selecting a plurality of dimensions for the thermally conductive cover such that the bottom surface will be spaced above and extend over top sides of the plurality of heat dissipating components when the thermally conductive cover is installed over the electronic circuit assembly. The at least one rib will extend over and be spaced from the plurality of heat dissipating components when the thermally conductive cover is installed over the electronic circuit assembly. The method further includes producing the thermally conductive cover with the selected dimensions. Thermally conductive covers are also disclosed.

Abstract: A thermal module includes a heat sink disposed on a contact surface of the heat source, a mounting bracket having first and second ends, a fastening member, a pressing member, and at least one clip. The mounting bracket surrounds the heat source. The first end has at least one latch portion. The second end has at least one mounting slot and at least one first opening in communication with the mounting slot. The fastening member is slidably mounted in the mounting slot. The clip spans the heat sink and has two ends respectively engaged with the latch portion and a portion of the fastening member respectively. The pressing member includes a pressing tightly engaged with the clip and urges the heat sink when an operation portion of the pressing member is rotated from the first predetermined position to the second predetermined position.

Abstract: A heatsink assembly includes a heatsink having a base board which includes fins extending from a top thereof and a recessed area defined in an underside thereof. The recessed area of the heatsink is adapted for engagement with a chip set. A positioning device includes a rectangular frame that is mounted to the heatsink and includes two side plates extending downward from two opposite sides thereof. Each side plate has a hook extending from an inside thereof so as to hook the chip set. Two flexible rods extend from the two opposite sides of the rectangular frame and each flexible rod has a pressing portion which presses on the top of the base board of the heatsink.

Abstract: A heat-dissipating structure for the expansion board architecture is provided. A fixing element disposed on the heat-absorbing substrate fixes the motherboard and the first expansion board. The heat-generating elements on the motherboard or the first expansion board are directly in touch with the heat-absorbing surface of the heat-absorbing substrate to absorb their heat. The heat-dissipating board extended from the side of the heat-absorbing substrate then dissipates the heat absorbed by the heat-absorbing substrate. The structure thus solves the problems that existing heat-dissipating structures occupy larger space and therefore cannot be effectively used in an expansion board architecture to dissipate heat produced by the heat-generating elements between the motherboard and the expansion board and that it is likely to have assembly tolerance. Using the structure can reduce the space and the assembly tolerance, but effectively enhance heat dissipation in the expansion board architecture.

Abstract: A heatsink assembly includes a heatsink which has a base board and fins extending from a top thereof. The heatsink is directly put on the chip set. A positioning device includes a rectangular frame which is mounted to the heatsink and includes two first extensions and two second extensions extending from two pairs of opposite sides thereof. Each first extension has a hook extending from an inside thereof so as to hook the circuit board and the second extensions each have a first inclined surface engaged with the inclined surface defined in a periphery of the chip. Two flexible rods extend from the two opposite sides of the rectangular frame and each flexible rod has a pressing portion which presses on the top of the base board of the heatsink.

Abstract: An improvement for an assembly for use in a computing device which includes a microprocessor and a motherboard and a socket for receiving and making electric contact with the microprocessor. A heat sink is included which is in thermal contact with the microprocessor whereby a water barrier is applied to and proximate the socket for preventing water of condensation from contacting areas covered by the water barrier and a moisture absorbent surrounding the heat sink.

Abstract: A display device includes: a display unit which displays an image; a casing which supports the display unit; a pair of supporting members which are respectively combined at peripheral areas of a backside of the display unit and are supported by the casing; and a connecting member which has higher heat resistance than the supporting members and interconnects the supporting members.

Abstract: Embodiments disclosed herein include EMI shielding to cool a computing device with one or more vents. In some embodiments, a louvered vent formed in the EMI shield of a computing device creates an air curtain between the EMI shield and a heat-generating component to cool the component, the EMI shield and the external wall. Other embodiments are described.

Abstract: An electrical distribution device assembly includes a drawout substructure having at least first and second opposing side portions. The electrical distribution device assembly also includes a telescoping rail unit mounted to one of the first and second opposing side portions. The telescoping rail unit includes a carrier rail having a carrier rail support surface and a loading rail having a loading rail support surface. The loading rail is slidably supported by the carrier rail to define an extended deployed configuration and a retracted stowed configuration. The electrical distribution device assembly also includes an electrical device is supported upon at least one of the carrier rail and the loading rail and is selectively shiftable into and out from the drawout substructure.

Abstract: A reconfigurable high performance computer occupies less than 360 cubic inches and has an approximate compute power of 0.7 teraflops per second while consuming less than 1000 watts. The computer includes a novel stack of semiconductor substrate assemblies. Some semiconductor substrate assemblies involve field programmable gate array (FPGA) dice that are directly surface mounted, as bare die, to a semiconductor substrate. Other semiconductor substrate assemblies of the stack involve bare memory integrated circuit dice that are directly surface mounted to a semiconductor substrate. Elastomeric connectors interconnect adjacent semiconductor substrates proceeding down the stack. Tines of novel comb-shaped power bus bar assembly structures extend into the stack to supply DC supply voltages. The supply voltages are supplied from bus bars, through vias in the semiconductor substrates, and to the integrated circuits on the other side of the substrates.