Abstract: A thermal management device for a circuit substrate having at least a first heat generating component and at least a second heat generating component, the thermal management device includes a first thermal spreader and a second thermal spreader. The second thermal spreader is mountable to the circuit substrate to thermally couple with the second heat generating component. Additionally, the second thermal spreader is adapted to couple to the first thermal spreader to thermally couple the first thermal spreader to the first heat generating component when the second thermal spreader is mounted to the circuit substrate. The thermal management device also includes a bias device that is coupled to the first thermal spreader and the second thermal spreader and is adapted to maintain the thermal coupling between the first thermal spreader and the first heat generating component when the second thermal spreader is mounted to the circuit substrate.

Abstract: An electronic device can be provided with a first housing at least partially containing a first electronic component, a second housing, and a hinge assembly coupled to the first housing and the second housing. The hinge assembly may be configured to dissipate heat generated by the first electronic component away from the first housing. In some embodiments, the hinge assembly may be configured to dissipate heat generated by the first electronic component away from the first housing and on to the second housing. The second housing may include a heat spreader for dissipating the heat from the hinge assembly throughout the second housing.

Abstract: A passively cooled computer includes two or more components arranged in a housing frame 41, wherein each of these components is associated with a cooling body for dissipating waste heat of the component when the component is in operation. The cooling bodies each include a cooling surface, and these cooling surfaces are arranged to oppose one another with their cooling surfaces and thereby define an air channel leading vertically through the inside of the housing frame. The cooling bodies substantially separate the air channel from the remaining volume inside the housing frame.

Abstract: A printed circuit board (PCB) assembly is provided. The PCB assembly is adapted for mounting at least one heat-generating electrical device and providing integrated heat dissipating capability to dissipate heat generated by the electrical device. The PCB assembly has a top surface and a bottom surface and comprises a signal carrying layer and an insert of pyrolytic graphite (PG). The signal carrying layer, disposed between the top surface and the bottom surface, comprises a material that is both thermally conductive and electrically conductive (such as at least one of aluminum, copper, and silver and alloys thereof) and has at least a portion lying in a first plane. The insert of PG is disposed within at least a portion of the first plane of the signal carrying layer, is in thermal contact with the signal carrying layer, and is constructed and arranged to have its greatest electrical conductivity in the first plane.

Abstract: An axial-flow fan unit that produces less noise is provided. Blades 19 are exposed from a venturi 29. The shape of each of the blades 19 is so defined that a space formed between at least an inner surface 28a of each of web leg sections 28A to 28C and an edge 19a of each of the blades 19 located in the radially outward direction of the blades 19 expands toward the ends of the web leg sections 28A to 28C (or web bodies 30A to 30C). With this arrangement, noise produced when the blades 19 rotate along the web leg sections 28A to 28C is reduced.

Abstract: A notebook computer with a tilting keyboard, which opens a vent when tilted, solves multiple problems and may further materially contribute to countering terrorism. A tilted position of the keyboard allows the vent to open when the notebook lid is open, thereby providing extra cooling capacity during periods of computer use when there is a lessened need for compactness. The vent is it least partially closed when the keyboard is in the stowed position and the lid is closed, thereby reducing the possibility of debris ingestion when air flow needs are reduced and the need for compactness is increased. A security inspection position of the keyboard enables inspection of the inside of the computer, for example as part of a security checkpoint procedure. A negative tilt can reduce wrist strain and repetitive motion injuries for some users. Some embodiments tilt the keyboard automatically in response to the lid opening, and stow the keyboard automatically in response to the lid being closed.

Abstract: A motor controller which eliminates a positioning operation between a power semiconductor element and a base plate to improve the assembly process is provided. The motor controller has a power semiconductor element closely contacted with a heatsink and mounted in a first base plate, wherein a spacer having an engaging section formed therein as a hole for the power semiconductor element is interposed between the heatsink and the base plate, and the power semiconductor element is positioned in the spacer. Further, the peripheral wall of the hole is arranged so as to shut off a space between a terminal projecting from the side of the power semiconductor element and the heatsink.

Abstract: A heat sink assembly includes a base frame and a heat sink having a module engagement surface configured to be in thermal communication with an engagement surface of a pluggable module. The heat sink assembly also includes transfer links extending between the heat sink and the base frame. The transfer links are movable to transfer the heat sink with respect to the base frame. The heat sink is movable between a recessed position and an elevated position, wherein the transfer links maintain the heat sink in a predetermined orientation with respect to the engagement surface of the pluggable module as the heat sink is transferred, between the recessed position and the elevated position.

Abstract: A waterproof casing for a power supply has a lower casing, an upper casing, an inlet cover and an outlet cover. The lower cover contains electronic components. The upper casing is mounted on the opening of the lower casing and has an inlet cavity, at least one inlet, an outlet cavity and at least one outlet. The at least one inlet and outlet are formed through the upper casing and respectively communicate with the inlet cavity and outlet cavity. The inlet cover and outlet cover respectively seal the inlet cavity and the outlet cavity, communicate the inlet cavity and the outlet cavity with the lower casing to allow the air to flow inside the casing and to keep the water from flowing in the inlet cavity and the outlet cavity. Structure of the waterproof casing is simplified, so benefits manufacturing.

Abstract: Systems and methods for Venturi fan-assisted cooling of electrical equipment are provided. In one embodiment, a cooling unit for an enclosure housing electronics is provided. The cooling unit comprises: a fan shroud having at least one electrical fan; and a Venturi chamber having a first inlet for receiving a heated airflow from a heatsink, a second inlet for receiving an airflow from a surrounding environment, and an outlet coupled to the fan shroud, the fan drawing air from the Venturi chamber via the outlet when the fan is on. The Venturi chamber comprises a wall for directing the airflow air from the surrounding environment in from the second inlet and across the heated airflow from the heatsink in a manner to as to draw the heated airflow through the heatsink using a Venturi effect, when the fan is on.

Abstract: A cooling fan module is disclosed. The cooling fan module includes a module housing, a fan assembly, a fan control circuit board, and an electrical connector. The fan assembly is disposed within the module housing and includes a fan housing, a motor disposed within the fan housing, and a blade assembly coupled to the motor. The fan control circuit board is disposed between the module housing and the fan housing, and is coupled to the motor. The electrical connector is coupled to the fan control circuit board and projects outside of the module housing.

Abstract: A mounting device for chips has a heat sink and at least one clamp. The heat sink has at least one conductive side, two ends, multiple chip units and two connecting bases. The chip units are arranged on the at least one conductive side. The connecting bases are formed on the ends of the heat sink. The at least one clamp is mounted across the at least one conductive side of the heat sink and has two ends, a middle sheet, multiple pressing tabs and two connecting arms. The pressing tabs extend from the middle sheet to press the chip units against the conductive side of the heat sink. The connecting arms are formed respectively on the ends of the clamp and are mounted respectively on the connecting bases.

Abstract: According to one embodiment, an electronic device includes a casing at least a part of which is made of metal, an in-casing member which is housed in the casing and becomes warm when the electronic device is in operation, and a boss member formed separately from the casing and made of resin. The boss member is attached to the metal part of the casing and is interposed between the casing and the in-casing member.

Abstract: A heat exchanger allows establishment of a flat space between first and second plates. The heat exchanger is inserted in a closed circulating loop for coolant. The flat space is allowed to have a cross-section larger than that of a cylindrical duct of the closed circulating loop. The flat space serves as a flow passage. An increased cross-section enables a reduction in the flow speed of the coolant. The coolant is allowed to slowly flow through the flat space. The coolant thus contacts with the first and second plates for a longer time. The heat of the coolant is sufficiently transferred to the first and second plates. The efficiency of heat radiation is enhanced.

Abstract: An electronic circuit apparatus for a compressor includes a board and a case. One corner of the board is fixed to case such that the board cannot move in the thickness direction and is movable in the flattening direction. According to this structure, even when an electronic part generates heat or outside air temperature of the case varies, the expansion or contraction of the board in the flattening direction is not affected by the expansion or contraction of the case in the flattening direction. Therefore, it is possible to prevent the deformation of the board and stress from being repeatedly applied to a soldering portion of the electronic part. As a result, it is possible to ensure the reliability of soldering strength for a long time.

Abstract: According to one embodiment, an electronic apparatus has a housing, a first heat emitter and a second heat emitter which are accommodated in the housing, and a cooling device accommodated in the housing. The cooling device includes a heat sink to cool the first heat emitter, a first heat pipe which thermally connects the first heat emitter with the heat sink, a second heat pipe, and a fan unit which cools the heat sink and the second heat pipe. The second heat pipe has a first end portion which is thermally connected to the second heat emitter, and a second end portion which is located near the heat sink.

Abstract: An electronic apparatus includes an enclosure enclosing a liquid cooling unit. The liquid cooling unit includes a heat receiver received on an electronic component. Heat of the electronic component is transferred to the heat receiver. The heat of the heat receiver is transferred to the coolant flowing through the flow passage of the heat receiver. The electronic component gets cooled. The coolant flows into a tank in the liquid cooling unit. The tank stores the coolant and air. The air inlet is formed in the enclosure. Fresh air is introduced into the enclosure through the air inlet. Since the tank is opposed to the air inlet, the tank is exposed to the fresh air. The heat of the coolant in the tank is thus radiated into the air. The coolant gets cooled in an efficient manner. The efficiency of heat radiation is enhanced in this manner.

Abstract: A heat sink assembly includes a base, a fin group located above a top of the base, a mounting bracket, and a fan mounted on a lateral side of the mounting bracket. The mounting bracket is integrally formed by a metal sheet. The mounting bracket includes a pedestal is located at a top of the base and connects with the base, and two sidewalls extending upwardly from opposite ends of the pedestal and sandwiching the fin group therebetween. The fan is mounted on a lateral side of the sidewalls of the mounting bracket. The pedestal integrally forms four mounting arms. Four fasteners extend through the mounting arms for securing the heat sink assembly to a printed circuit board.

Abstract: The invention relates to an improved aircraft electronics cooling system for an aircraft having a liquid cooling system (2), the aircraft electronics cooling system providing a thermal coupling between an electronic device (40a, 40b, 40c, 40d, 42, 44) to be cooled and the liquid cooling system (2) of the aircraft. A coolant delivered by the liquid cooling system (2) may flow through a board of the electronic device (40a, 40b, 40c, 40d), through a heat sink on which the electronic device (42) is arranged and/or through a housing in which the electronic device (44) is arranged. The coolant may be permanently in the liquid state in a cooling circuit. The coolant may vaporize at least partially while cooling the electronic device.

Abstract: Apparatus and method for securing a heat sink to a heat-generating device on a circuit board. The apparatus clamps onto the heating-generating device and the circuit board in a manner that avoids bending of the circuit board. The apparatus includes a retention module having a plurality of retention features that extend through openings in the circuit board disposed about the perimeter of the heat-generating device, such as a processor. The apparatus also includes a heat sink having a heat sink base for contacting the heat-generating device in order to dissipate heat produced by the device. The heat sink is selectively securable to the retention features of the retention module using levers, such as a wire module, having a spring clip to engage the retention features and clamp the heat sink and retention module together.