Abstract: A portable electronic device includes a casing, an electronic component disposed in the casing, and a thermal module for dissipating heat of the electronic component. The thermal module includes a heat pipe, a fin unit, and a transverse fan. The heat pipe includes an evaporating section thermally attached to the electronic component, and a condensing section thermally attached to the fin unit. The transverse fan is arranged in the casing for generating an airflow through the electronic component and the fin unit. The transverse fan includes a rotor, and a sidewall on a floor of the casing and surrounding the rotor. The sidewall defines an air inlet and an air outlet therein. The air outlet faces to the fin unit. The air inlet faces to the electronic component.

Abstract: A heat dissipation module is disclosed. The heat dissipation module includes fan and at least a heat sink. The fan includes a frame and an impeller. The frame includes a body and at least an extension. The extension protrudes from at least a side of the body. The extension or the body is connected with the circuit board. The impeller is disposed in the body. The heat sink is connected with the extension for dissipating heat produced from the electronic element.

Abstract: According to one embodiment, an electronic device includes a case, a heat generation body mounted in the case, a cooling member mounted in the case, and a heat conduction member. The heat conduction member includes a heat receiving section opposed to the heat generation body and thermally connected to the heat generation body, a heat radiation section opposed to the cooling member, and a section provided between the heat receiving section and the heat radiation section. The heat conduction member is formed by laminating a plurality of sheet members each having thermal conductivity. The plurality of sheet members are joined together in a portion of the heat conduction member.

Abstract: The electronic-component-mounting board according to the present invention includes: a high-heat-dissipation substrate including a metal plate and a circuit pattern formed on a upper surface of the metal plate; an electronic component which is mounted on the high-heat-dissipation substrate and is electrically connected to the circuit pattern; and one external connection terminal which is disposed on the high-heat-dissipation substrate and provides electrical connection between the electronic-component-mounting board and an external device. The external-connection terminal is formed of a material having a thermal conductivity less than that of the metal plate and has at least one external electrode to which a lead wire is soldered. Therefore, the lead wire can be connected by soldering even on the high-heat-dissipation substrate. Accordingly, the reliability of the electrical connection is improved, and reduction in size and thickness of the electronic-component-mounting board can be achieved.

Abstract: A cover assembly is provided for an enclosure, such as an electrical enclosure. The enclosure includes a panel member and a plurality of sides extending outwardly from the panel member to define an interior. The cover assembly includes an inner cover, at least one fastening mechanism fastening the inner cover to the enclosure, a trim member at least partially overlaying the inner cover, and at least one biasing assembly coupling the trim member to the inner cover. The at least one biasing assembly biases the trim member toward the inner cover, and is structured to bias the trim member toward an exterior surface of a structure, such as a building wall, to which the electrical enclosure is coupled.

Abstract: A fan assembly for an electronic device is provided. The assembly comprises a fan housing, at least one bracket member, and at least one retention peg. The fan housing defines a recess therein for directing heat away from a electrical components positioned within the electronic device. The bracket member supports the fan housing within the electronic device. The retention peg is disposed about the bracket member and includes a plurality of ribs for insertion into the recess to retain the bracket member to the fan housing.

Abstract: A heat sink and an electronic apparatus using the same are disclosed. The heat sink comprises a fin structure and a fastening assembly; the fastening assembly comprises an adjustable positioning member, an elastic member, and a hooking member, the elastic member being disposed between the hooking member and the fin structure such that the adjustable positioning member combines the hooking member, the elastic member, and the fin structure; wherein the hooking member may secure the heat sink onto an electronic component, and the adjustable positioning member may be used to adjust the tightness between the heat sink and the electronic component.

Abstract: A heat sink assembly includes a first heat dissipating plate, a second heat dissipating plate, at least one flat heat pipe horizontally positioned between the first heat dissipating plate and the second heat dissipating plate. The at least one flat heat pipe surrounds or defines an enclosed-space. The enclosed-space is closed by the first heat dissipating plate and the second heat dissipating plate. At least one through hole communicates with the enclosed-space and is defined in the second heat dissipating plate.

Abstract: The present disclosure describes swivel hinge assemblies for use in rotatably mounting two structures together, such that the structures are in fluid communication by way of fluid flow, as well as systems including such hinge assemblies. The swivel hinge assemblies generally comprise a fluid inlet port, a fluid outlet port, shafts surrounding the inlet and outlet ports and allowing for rotation about one or more axes, and attachment means which may be integrally formed with the shafts of the hinge assembly. In use, these assemblies eliminate the use for secondary hinges or secondary mounting hardware in attaching a door and a structure together in order to maintain fluid communication between an electronics rack and a heat exchanger mounted on the door of an electronics rack.

Abstract: A display device includes: a frame that holds a display panel having a thin member and a light source that irradiates the display panel with light; and a cover that covers the frame. The display device further includes: a heat sink situated in the central portion in the width direction of the display panel in the frame and extending in and out of the frame; and a heat dissipation component provided in the cover and being in contact with the heat sink at a position outside the frame.

Abstract: An electronic assembly including a first heat producing device mounted on a first outer surface of a first portion of a circuit board. The first portion can deflect upwardly and downwardly relative to other portions of the circuit board. A first force element urges the first heat producing device against a heat sink. The force exerted by the first force element is variable with respect to time.

Abstract: A mounting apparatus for mounting a heat sink on a board, includes a first locking hole defined in the heat sink, a second locking hole defined in the board, and a locking member. The locking member includes a base and a rod. The base defines a hole. A bottom of the base forms a pair of separated elastic claws around the hole. The elastic claws are inserted through the first and second locking holes. The rod includes an expanded portion. The rod slides in the hole of the base with the expanded portion located inbetween the claws to expand the claws outwards to be larger than the second locking hole to lock the locking member on the board and to mount the heat sink on the board.

Abstract: According to one embodiment, a heat sink includes first and second fin units. Fins of the first fin unit are provided with a through-hole part in which a heat pipe is inserted. Fins of the second fin unit are provided with a cutout part cut out to avoid the heat pipe. The fins of the second fin unit are inserted in spaces between the fins of the first fin unit. The fins of the second fin unit reach to a region in which the fins of the second fin unit overlap the heat pipe in the first fin unit.

Abstract: An information processing device includes a housing part; a heating part arranged in the housing part; a cooling unit configured to cool the heating part; an airflow supplying member configured to supply an airflow to the cooling unit; and an airflow limitation member configured to limit the airflow supplied by the airflow supplying member. A part of the cooling unit, the airflow limitation member, and the airflow supplying member are arranged in series. An air intake part is provided in one surface of the housing part so as to intake air into the airflow limitation member. An air discharge part is provided in another surface of the housing part so as to discharge air cooling the part of the cooling unit. An air discharge unit is provided at an air discharge opening provided at one side surface of the airflow limitation member.

Abstract: A fast terminal box includes a casing, a cover, plural wiring sockets, plural metal connection components and a plurality of wiring terminals. The wiring sockets are placed and distributed on a bottom plate of the casing one by one. The metal connection component is provided on the wiring socket for connection purpose. The casing and the cover are combined to each other. The wiring terminals are distributed at sidewall of the casing for receiving corresponding wiring plugs therein. The fast terminal box is characterized in heat sink metal fins are contained in a space around the wiring socket, and heat sink metal fins contact pins of a diode and the metal connection component respectively through corresponding connection portions thereof.

Abstract: An electronic component generates heat in an electronic apparatus. The heat of the electronic component is transferred to a thermal conductive plate of a heat receiver in a liquid cooling unit. The heat is transferred to coolant from the thermal conductive plate. The temperature of the coolant rises. The heat exchanger absorbs heat of the coolant. The coolant gets cooled. The heat of the electronic component is also transferred to the printed wiring board. The heat spreads over the printed wiring board through a wiring pattern in the printed wiring board. Since the tank or/and pump is placed at a position outside the printed wiring board, the heat cannot be transferred to the tank or/and the pump. This results in prevention of rise in the temperature of the coolant in the tank or/and the pump. The efficiency of heat radiation can thus be enhanced.

Abstract: A mount module for an inverter includes a housing element with a recess being open to the front face, for holding a single inverter. The upper face and the lower face of the housing element are complementary to one another, and/or the right side and the left side of the housing element are complementary to one another, and/or the rear face of the housing element is complementary to itself. The respective side or sides and face or faces of the housing element each have at least one connection device. A relatively large number of the mount modules can be disposed one above the other, alongside one another, and/or with their rear faces against one another and can be connected to one another in order, for example, to form a central inverter unit for large photovoltaic installations.

Abstract: Provided is an electronic control device, including: a housing (3) which includes opening portions at both end portions thereof and is made of insulating resin; a heat sink (5) attached to one of the end portions of the housing (3); a power device (2) provided to the heat sink (5); a circuit board (4) which is provided so as to be opposed to the heat sink (5) and formed with an electronic circuit including a control circuit for controlling the power device (2); and a plurality of first conductive plates (6) held in the housing (3), for electrically connecting the circuit board (4) with the power device (2), in which each of the plurality of first conductive plates (6) includes a press fit terminal (6bp) press-fitted into a through hole (4a) formed in the circuit board (4) to be bonded to the circuit board (4) on a surface opposed to the circuit board (4) and to be bonded to respective terminals of the power device (2) on a surface opposed to the heat sink (5).

Abstract: A heat dissipation device attached to a top surface of an electronic device mounted on a printed circuit board, includes a heat sink and a retainer securing the heat sink onto the electronic device. The retainer includes a frame, a plurality of baffle walls and protrusion posts extending downwardly from the frame. Lower ends of the baffle walls of the retainer extend downwardly through the heat sink and engage with engaging edges of the electronic device. The heat dissipation device is further provided with a plurality of elastic members which respectively surround the protrusion posts of the retainer and are compressed between the retainer and the heat sink, thereby pushing the heat sink downwardly toward the electronic device.

Abstract: A heat dissipating member, a heat dissipating mechanism, and an information processing apparatus capable of improving the cooling efficiency without increasing the size of the apparatus are disclosed. In the information processing apparatus, it becomes possible to effectively transfer heat from a unit such as a memory disposed in an inner space of the apparatus to the outside regardless of the layout position of the unit by using the heat dissipating mechanism fixed to a unit and a heat dissipation surface so that the heat is transferred from the unit to the heat dissipation surface.