Abstract: A thermal module (10) includes a fin assembly (14), a heat pipe (16) thermally contacting with a heat generating electronic component (60) disposed on a printed circuit board (50) and the fin assembly, and a resilient fastener (20) attaching an evaporation section (164) of the heat pipe to the heat generating electronic component. The fastener includes a mounting element (40) being attached to the printed circuit board, and an engaging element (30) embedded in the mounting element. The engaging element includes a base plate (32) having a first surface contacting with the evaporation section of the heat pipe and a second surface thermally contacting with the heat generating electronic component, and at least a resilient strip (34) sandwiched between the first surface of the base plate of the engaging element and the mounting element.

Abstract: A cooling apparatus comprising a cooling manifold assembly is disclosed. The cooling manifold assembly comprises a manifold inlet end cap, a manifold outlet end cap and at least one cooling manifold. Cooling fluid flows into the manifold inlet end cap, through the cooling manifold, and the exits from the manifold outlet end cap. The cooling manifold is configured to rotate from a closed position into an open position without breaking a fluid seal between the manifold inlet end cap, the cooling manifold, and the manifold outlet end cap.

Abstract: An information technology enclosure has a processing subsystem and infrastructure subsystem in separate shipping containers that cooperate to process information. The processing subsystem has increased information processing density by concentrating information handling systems in a first processing shipping container that is supported with infrastructure equipment in a second infrastructure shipping container. In one embodiment, the shipping containers are arranged in a stacked configuration so that cooled air and exhausted air are exchanged through aligned vents formed in the ceiling and floor of stacked shipping containers.

Abstract: A heat sink assembly comprises a base consisting of an aluminum casting and a copper base plate, a heat sink consisting of heat fins, and at least a heat guide pipe; the heat guide pipe has a heat dissipation section passing through the heat fins; the aluminum casting has a hollow receiving space accommodating the copper base plate, and an elongated recess is disposed at the top sides of the copper base plate and the casting for placing the heat conduction part of the heat guide pipe; the copper base plate keeps contact the heat source and the heat transmits to the heat guide pipe and then is dissipated with the heat sink via the base rapidly. In addition, the weight of the heat sink assembly is decreased, and the manufacturing cost is reduced.

Abstract: A cooling device including: a fan configured to rotate and produce airflow; a fan case accommodating the fan, the fan case having an outlet for discharging the airflow produced by the fan; a heat exchanger having an inlet disposed to oppose the outlet of the fan case, the inlet being configured to take in the airflow discharged from the outlet; a wire disposed between the heat exchanger and the fan case to stretch along an end face of the inlet of the heat exchanger, the wire having a first end being fixed to a fulcrum and a second end; and a wire driving mechanism configured to swing the wire about the fulcrum to scrape the end face of the inlet of the heat exchanger by the wire.

Abstract: A computer enclosure includes an absorber plate, a thermoelectric converter, and a refrigerator. The absorber plate is arranged in the computer enclosure to absorb heat generated in the computer enclosure. The thermoelectric converter is arranged in the computer enclosure to receive heat absorbed by the absorber plate, and then convert the absorbed heat to electrical energy. The refrigerator is arranged in the computer enclosure to receive the electrical energy generated by the thermoelectric converter, and then work to generate cold air to dissipating heat in the computer enclosure.

Abstract: A power supply assembly includes two brackets, a fan detachably mounted between the brackets, and a main body. Each bracket includes an elastic member extending from an end of the bracket. The main body includes a receiving space, and two opposite mounting walls bounding the receiving space. The brackets together with the fan can be detachably mounted to the main body via being received in the receiving space and the elastic members engaging with the mounting walls.

Abstract: A fixing apparatus is provided for retaining a heat sink to a circuit board. The fixing apparatus includes a mount fixed to the circuit board, two locking members attached to the mount, and a clip. The mount defines a receiving hole accommodating the heat sink. The clip includes a positioning portion abutting against the heat sink, and two retaining arms extending from opposite ends of the positioning portion. The positioning portion presses the heat sink against the circuit board in response to the retaining arms engaging with the locking members.

Abstract: An attachment assembly for mounting at least one electronic device is provided with a cradle (101) with a bottom part (109). Furthermore, the cradle (101) comprises a first arm (105) arranged such that the electronic device is fastened to the first arm (105) using the electronic device bottom fastening means, and a second arm (108) arranged such that the electronic device (150) is fastened to the second arm (108) using the electronic device side fastening means. To the cradle (101) can be mounted a fan (107) which can be placed under the electronic device and arranged between the first arm (105) and the second arm (108) of the cradle (101), such that air is blown towards the electronic device mounted to the cradle (101). To allow the air flowing from underneath of the cradle (101) to the fan (107), the cradle (101) has an opening (185) in the bottom part (109).

Abstract: A computer adapted for force-air cooling of a processor. The computer includes a board supporting the processor and a heat sink mounted such with its base plate contacting the processor. A primary mount supports the heat sink near the processor, and a portion of the heat sink base plate extends outward a distance or overhang length from the primary mount to an edge. The apparatus includes a secondary heat sink mounting assembly supported upon the processor board that includes a damping element with an resilient body positioned proximate to the edge of the base plate, whereby the body abuts the base plate during movement of the base plate toward the board, e.g., upon application of a dynamic or shock load that causes the overhanging portions of the base plate of the heat sink to vibrate or oscillate about the support locations of the primary mount.

Abstract: A blocking device adapted in a blade server and a blade server are provided. The blade server includes a chassis and a plurality of blocking devices. The chassis includes an opening, a plurality of connecting interfaces and a plurality of convection holes. The connecting interfaces are placed in parallel to connect respective CPU blades. Each convection hole corresponds to a connecting interface. Each of the blocking devices corresponds to a convection hole and includes two blocking plates and a pushing object. The two blocking plates block the convection hole and include a hinge and a torsion spring. When a CPU blade is connected to the connecting interface, the pushing object displaces to make the two blocking plates rotate about a respective hinge to expose the convection hole. When the CPU blade is removed, the torsion springs make the two blocking plates rotate back to block the convection hole.

Abstract: Cooling apparatuses and methods are provided for cooling an assembly including a planar support structure supporting multiple electronics components. The cooling apparatus includes: multiple discrete cold plates, each having a coolant inlet, coolant outlet and at least one coolant carrying channel disposed therebetween; and a manifold for distributing coolant to and exhausting coolant from the cold plates. The cooling apparatus also includes multiple flexible hoses connecting the coolant inlets of the cold plates to the manifold, as well as the coolant outlets to the manifold, with each hose segment being disposed between a respective cold plate and the manifold. A biasing mechanism biases the cold plates away from the manifold and towards the electronics components, and at least one fastener secures the manifold to the support structure, compressing the biasing mechanism, and thereby forcing the parallel coupled cold plates towards their respective electronics components to ensure good thermal interface.

Abstract: A computer system includes a chassis and a fan module attached to the chassis. The fan module includes a rotor, a side panel coaxial with the rotor, and a cylindrical cover extending from the side panel for encasing the rotor. One side of the rotor is covered and protected by the side panel, while another side of the rotor is bare. The chassis includes an air vent for exposing the bare side of the rotor. An airflow-guiding part inwardly protrudes from an edge of the air vent and abuts the cylindrical cover of the fan module.

Abstract: A heat dissipation device is disposed in an electronic device and performs thermal exchange with an electronic component of the electronic device. The heat dissipation device includes a heat sink and a plurality of fluttering slices. The heat sink is attached on the electronic component to conduct the thermal energy of the electronic component. The fluttering slices are disposed on the heat sink, and the fluttering slices are actuated to generate an airflow when the electronic device is moved, so as to disturb the air inside the electronic device, thereby achieving the purpose of improving the thermal dissipation performance.

Abstract: A retention assembly comprises a hinged load plate configured for rotational closure over a component and compression of a pre-compressed spring that distributes force of the spring across the component in tool-less retention of the component.

Abstract: A front-to-back cooling system allows cooling of an apparatus containing two orthogonal sets of modules. Each set of modules is independently cooled. A vertical set of modules is cooled with vertical air flow across the modules that enters from a front of the apparatus and exhausts from a back of the apparatus. A horizontal set of modules is cooled with horizontal front-to-back air flow. When the horizontal set of modules is at the front of the apparatus, a plenum extending exterior to the vertical set of modules allows exhausting horizontally flowing air to the rear of the apparatus. When the horizontal set of modules is at the rear of the apparatus, a plenum extending exterior to the vertical set of modules allows moving air from the front of the apparatus to a chamber holding the horizontal modules.

Abstract: An electronic apparatus that includes: a housing having two surfaces extending in parallel, and a side surface connecting edges of the two surfaces; a circuit board placed in the housing and extends in parallel with the two surfaces; a plate member that extends to face a first surface of the circuit board; and a fan provided on a second surface of the circuit board, wherein the circuit board has a heat-generating electronic component mounted on the first surface and an opening through which air flows to the second surface side, and the plate member includes a concave groove formed in the first surface; a convex line formed on the second surface facing the circuit board on a portion corresponding to a back surface of the concave groove; and a guiding inclined surface formed on the back of the convex line to guide air to the opening.

Abstract: There is provided a heatsink for radiating heat from a heat-producing device. The heatsink includes a heatsink body; a clip that has a pair of arms and is fitted to the heatsink body along a heat radiation surface of the heat-producing device such that the heat-radiation surface of the heat-producing device and the heatsink body closely contact with each other while being sandwiched between the pair of arms; and a guide plate integrally formed with the heatsink body. The guide plate is configured such that an interval between the guide plate and the heatsink body is smaller than an arm interval between the pair of arms of the clip on a front side in a fitting direction of the clip and is larger than the arm interval on a deep side in the fitting direction of the clip.

Abstract: A fastener includes a fastener post, a sleeve, a nut and an elastic element. The fastener post includes a shaft, a tapered portion and a threaded portion. The sleeve includes a smooth portion and a clamp portion having a number of resilient strips. The nut is threaded onto the threaded portion. The elastic element is disposed around the sleeve and compressed between the nut and an ear of a heat sink to generate a resilient force. The resilient force moves the tapered portion of the fastener post into the sleeve such that the strips of the clamp portion of the sleeve are tilted outwardly to tightly abut against a bottom of a printed circuit board on which the heat sink is mounted.

Abstract: The present invention relates to a method of cooling a static electronic power converter device including at least one electrical circuit including an assembly of active components and of passive components mounted in a closed radiator housing from which only the inlet and the outlet of the circuit communicate with the outside of the housing, in which the distribution of the heat energy given off by the active and passive components is made uniform throughout the inside volume of the housing, and the heat energy is transferred from the radiator housing by forced convection in substantially uniform manner over the entire inside surface of the walls of the housing by causing at least one fluid contained inside the leaktight housing to circulate in a closed circuit. The invention also provides a static electronic power converter device enabling the method to be implemented.