Patents Examined by Guillermo J Egoavil
  • Patent number: 10434750
    Abstract: The present invention relates to a resin film for a flexible printed circuit board consisting of a resin composition containing: a long-chain alkyl bismaleimide resin having a main chain containing an alkylene chain having 10 or more carbon atoms and a side chain containing an alkyl group bonded to the alkylene chain; and a curing agent having two or more functional groups reacting with the long-chain alkyl bismaleimide resin.
    Type: Grant
    Filed: January 13, 2016
    Date of Patent: October 8, 2019
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Masaki Takeuchi, Yoshitsugu Matsuura, Yuta Nakano, Kazuhito Obata, Katsuhiko Yasu
  • Patent number: 10426055
    Abstract: A method for upgrading a portion of a process control system from a legacy programmable logic controller (PLC) to a non-PLC process controller is disclosed. A mounting rack sized to fit into a space occupied by legacy hardware is assembled and populated with replacement hardware that includes an I/O card, an I/O terminal block, and a custom interface module. The custom interface module is coupled to the I/O card via the I/O terminal block and to a plurality of process control field devices via a legacy wiring mechanism coupled to legacy wiring of the process control system, without requiring modification or re-termination of the legacy wiring. The legacy wiring mechanism is disconnected from the legacy hardware, the rack containing the legacy hardware is removed and replaced with the mounting rack, and the legacy wiring mechanism is coupled to the custom interface module.
    Type: Grant
    Filed: October 2, 2017
    Date of Patent: September 24, 2019
    Assignee: FISHER-ROSEMOUNT SYSTEMS, INC.
    Inventors: William Scott Ross, James Aaron Crews
  • Patent number: 10418748
    Abstract: A three-way splice assembly for splicing together a first cable, a second cable, and a third cable. The assembly includes an exterior enclosure, an interior enclosure positioned within the exterior enclosure, and an insulation layer positioned between the exterior enclosure and the interior enclosure. The assembly also includes a first port, a second port, and a third port, each extending from the exterior enclosure, through the insulation layer, and into the interior enclosure and each sized to receive one of the first cable, the second cable, and the third cable, respectively. The assembly further includes a terminal configured to electrically connect a respective conductor from the first cable, the second cable, and the third cable to form a three-way splice, and a fuse configured to be electrically connected between the terminal and one of the conductors of the first cable, the second cable, and the third cable.
    Type: Grant
    Filed: February 26, 2018
    Date of Patent: September 17, 2019
    Assignee: nVent Services GmbH
    Inventors: Jimmy Wang, Helene Raymond, Ryan Drury, Wesley Dong
  • Patent number: 10418178
    Abstract: A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and first and second internal electrodes disposed to face each other with respective dielectric layers interposed therebetween; and first and second external electrodes disposed on an external surface of the ceramic body, wherein the dielectric layer contains a barium titanate-based powder particle having a core-shell structure including a core and a shell around the core, the shell having a structure in which titanium is partially substituted with an element having the same oxidation number as that of the titanium in the barium titanate-based powder particle and having an ionic radius different from that of the titanium in the barium titanate-based powder particle, and the shell covers at least 30% of a surface of the core.
    Type: Grant
    Filed: August 23, 2017
    Date of Patent: September 17, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Woo Kim, Jong Ho Lee, Min Gi Sin, Hak Kwan Kim, Chin Mo Kim, Chi Hwa Lee, Hong Seok Kim, Woo Sup Kim, Chang Hwa Park
  • Patent number: 10410759
    Abstract: A conductive device to form electrical connections on the surface of a structure made of composite material. The device includes a thin interface layer having a face via which the device is fixed to the surface of the structure made of composite material. A conductive metal element is placed on the face of the interface layer opposite the face making contact with the surface of the structure. The conductive element is configured to be able to undergo tensile and compressive stresses without damage. A protective layer is configured to protect the conductive element from attack from the environment surrounding the structure. These various elements are arranged relative to one another such that the length of the conductive element can vary as a function of temperature variations independently of the amplitude of the variations undergone by the structure on which the device is mounted.
    Type: Grant
    Filed: November 19, 2015
    Date of Patent: September 10, 2019
    Assignee: AIRBUS
    Inventors: Didier Mesnage, Thierry Pelegrin
  • Patent number: 10405423
    Abstract: A multi-layer circuit board includes a first circuit board, conducting blocks, a second circuit board, and conducting recesses. The first circuit board has a first conductor layer mounted on the first circuit board. The conducting blocks are mounted on the first circuit board and electrically connected to the first conductor layer. The second circuit board has a second conductor layer mounted thereon and facing the first circuit board. The conducting recesses are formed in the second circuit board, electrically connected to the second conductor layer, and corresponding to the respective conducting blocks. The insulating layer is mounted between the first conductor layer and the second conductor layer. The second circuit board is on the first circuit board, the conducting blocks are respectively mounted in the conducting recesses to electrically connect the first conductor layer and the second conductor layer.
    Type: Grant
    Filed: January 5, 2018
    Date of Patent: September 3, 2019
    Assignee: KINSUS INTERCONNECT TECHNOLOGY CORP.
    Inventors: Ting-Hao Lin, Chiao-Cheng Chang, Yi-Nong Lin
  • Patent number: 10399312
    Abstract: The present invention provides an oxazine compound which contains a group having an aromatic ring structure and a plurality of specified carbon-carbon double bond structure so as to achieve an object. The present invention further provides a composition containing the oxazine compound of the present invention, a cured product containing the composition, and a laminate having the cured product layer. The present invention further still provides a composition for a heat-resistant material and a composition for an electronic material, which contain the composition containing the oxazine compound of the present invention so as to achieve an object.
    Type: Grant
    Filed: November 8, 2016
    Date of Patent: September 3, 2019
    Assignee: DIC Corporation
    Inventors: Masato Otsu, Tomohiro Shimono, Kazuo Arita, Junji Yamaguchi
  • Patent number: 10398873
    Abstract: A disclosed cable includes a roll of flexible substrate. The substrate has opposing first and second surfaces and the roll is structured around an axis. A plurality of electrically conductive wires are attached to the first surface of the substrate, and the roll of flexible substrate and attached plurality of wires have alternating layers of wires and substrate.
    Type: Grant
    Filed: July 20, 2018
    Date of Patent: September 3, 2019
    Assignee: Automated Assembly Corporation
    Inventors: Kimmo Kyllonen, David Neuman, Scott Lindblad
  • Patent number: 10395836
    Abstract: A multilayer ceramic electronic component includes a laminated body, a first external electrode, a pair of second external electrodes, and a pair of insulating coating portions. The pair of insulating coating portions extends in a laminating direction between each of the pair of second external electrodes and the first external electrode on a second principal surface, from the second principal surface to respective portions of a first side surface and a second side surface. As viewed from at least one direction in the laminating direction, an end of the pair of insulating coating portions, which is located closest to a first principal surface, is located closer to the first principal surface than an end of the first external electrode and pair of second external electrodes, which is located closest to the first principal surface.
    Type: Grant
    Filed: June 2, 2017
    Date of Patent: August 27, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Takashi Sawada, Yasuo Fujii, Takayuki Kayatani
  • Patent number: 10395844
    Abstract: A capacitor component includes multilayer ceramic capacitors and an interposer board on which the multilayer ceramic capacitors are mounted. The interposer board is provided with four or more lands that are electrically connected to the corresponding external electrodes of the multilayer ceramic capacitors, an input terminal, and an output terminal, and each of the four or more lands is electrically connected to one of the input terminal and the output terminal.
    Type: Grant
    Filed: October 4, 2017
    Date of Patent: August 27, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yoshitsugu Morita, Nagato Omori, Atsushi Sakuragi
  • Patent number: 10388428
    Abstract: An electric wire with a connector in which high adhesiveness can be ensured at both the interface between an insulator and a sealing layer and the interface between a connector housing and the sealing layer, and a wire harness using this electric wire with a connector are provided. The electric wire with a connector includes an insulated electric wire including a conductor and an insulator containing silicone with which the outer circumference of the conductor is coated, a connector terminal connected to a portion of the conductor exposed by stripping a portion of the insulator, a connector housing made of a resin in which an end of the insulated electric wire and a portion of the connector terminal are embedded, and a sealing layer provided between the surface of the insulator and the connector housing covering the outer circumference of the surface of the insulator at the end of the insulated electric wire. The sealing layer is constituted by a sticky adhesive.
    Type: Grant
    Filed: July 20, 2016
    Date of Patent: August 20, 2019
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Kazuo Nakashima, Katsufumi Matsui, Takaaki Hamaguchi, Koki Murata
  • Patent number: 10377109
    Abstract: The invention discloses electric conductor combined by composite conductor and its manufacturing method; the electric conductor forms interface with same or different characteristics among each layer contact surfaces with same or different properties, such as mixture, crystals, alloy, oxysome, etc. When it is electrified, it produces kinds of same or different current effect, such as skin effect, eddy current, ring current, magnetic effect, heat effect, crowding effect, or combined effect which combines each above-mentioned effect; it will play special role and effect if applied on reserved equipment.
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: August 13, 2019
    Inventor: Jeng-Shyong Wu
  • Patent number: 10373761
    Abstract: A multi-layer ceramic capacitor includes a multi-layer unit and a side margin. The multi-layer unit includes a capacitance forming unit and a cover. The capacitance forming unit includes ceramic layers laminated in a first direction and internal electrodes disposed between the ceramic layers and mainly containing nickel. The cover covers the capacitance forming unit from the first direction. The side margin covers the multi-layer unit from a second direction orthogonal to the first direction. The internal electrodes each include an oxidized area adjacent to the side margin and intensively including a metal element that forms an oxide together with nickel. The capacitance forming unit includes a first portion adjacent to the cover and a second portion adjacent to the first portion in the first direction and including the oxidized area having a smaller dimension in the second direction than that of the oxidized area of the first portion.
    Type: Grant
    Filed: August 16, 2017
    Date of Patent: August 6, 2019
    Assignee: Taiyo Yuden Co., Ltd.
    Inventor: Kotaro Mizuno
  • Patent number: 10373740
    Abstract: A communications cable having a plurality of twisted pairs of conductors and various embodiments of a metal foil tapes between the twisted pairs and a cable jacket is disclosed. In some embodiments, a metal foil tape includes a discontinuous metal layer and a polymer layer bonded to the metal layer. Portions of the metal layer and the polymer layer are deformed to form a plurality of dimples, the dimples forming air gaps between the polymer layer and the cable core or a barrier layer if used. The air gaps lower the overall dielectric constant between the metal layer and the cable core, thereby lowering the alien capacitance of the communications cable.
    Type: Grant
    Filed: August 7, 2018
    Date of Patent: August 6, 2019
    Assignee: Panduit Corp.
    Inventors: Royal O. Jenner, Masud Bolouri-Saransar, Ronald A. Nordin, Paul W. Wachtel, Stephen A. Thwaites, Roy B. Kusuma, James D. Malkemus, Scott M. Brown
  • Patent number: 10367336
    Abstract: A frame for a switchgear cabinet has a plurality of interconnected frame profiled elements, and a method produces such a switchgear cabinet. At least two holders vertically spaced apart from one other and having cutouts for distribution busbars are arranged within the outer contour formed by the profiles. In an operating position, the holders are oriented along a vertical axis. The at least two holders are also movable, in particular rotatable, into a fitting position, however, in which the axis is at an angle to the vertical.
    Type: Grant
    Filed: December 5, 2014
    Date of Patent: July 30, 2019
    Assignee: EATON INTELLIGENT POWER LIMITED
    Inventors: Martin Scherzer, Thomas Berger, Guenter Doleschal
  • Patent number: 10366811
    Abstract: A parallel pair cable includes a pair of insulated wires arranged to be in contact with each other, parallel to each other and not twisted, a first resin tape wrapped around the pair of insulated wires, and a shield tape longitudinally folded on the outside of the first resin tape and comprising a metal layer.
    Type: Grant
    Filed: September 14, 2017
    Date of Patent: July 30, 2019
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventor: Yuto Kobayashi
  • Patent number: 10361542
    Abstract: The present disclosure relates to a high-pressure feedthrough for feeding through a coaxial cable from a low-pressure zone into a high-pressure zone, wherein the high-pressure feedthrough has a support structure having at least one elongate bore that extends from a low-pressure side of the support structure up to a high-pressure side of the support structure; wherein the elongate bore is suitable for receiving at least the inner conductor of a coaxial cable that can be continuously fed through the elongate bore from the low-pressure side to the high-pressure side; and wherein the high-pressure feedthrough has one or more components that serve in the axial direction of the elongate bore as an outer conductor and/or dielectric of the inner conductor of the coaxial cable fed through the elongate bore.
    Type: Grant
    Filed: January 16, 2018
    Date of Patent: July 23, 2019
    Assignee: Liebherr-Elektronik GmbH
    Inventors: Paolo Leutenegger, Tobias Zinner, Michael Scheidt, Michael Stucke
  • Patent number: 10356935
    Abstract: A cabinet installed in a data center is secured to the floor in the data center by a seismic kit to eliminate excessive deflection of the cabinet during a seismic event. The seismic kit includes a bracket and leveling leg clamps. The bracket is secured to the cabinet frame. The bracket has a first member and a second member with the second member extending upwards from the first member. The leveling leg clamps are secured to the first member of the bracket. The leveling leg clamps have a rectangular member with a cutout to receive leveling legs of the cabinet.
    Type: Grant
    Filed: May 10, 2018
    Date of Patent: July 16, 2019
    Assignee: Panduit Corp.
    Inventors: Roger D. Segroves, Alex C. Brouwer
  • Patent number: 10354778
    Abstract: The present invention relates to a high speed transmission cable that includes a first conductor set, a dielectric film at least partially concentrically disposed around the first conductor set and a pinched portion forming an insulating envelope around the first conductor set. The dielectric film includes a base layer having a plurality of first protrusions formed on a first major surface of the base layer, wherein the dielectric film is disposed such that the base layer is partially concentric with the conductor set and wherein a portion of the first protrusions is disposed between the first conductor set and the base layer in a region where the base layer is concentric with the first conductor set.
    Type: Grant
    Filed: September 18, 2017
    Date of Patent: July 16, 2019
    Assignee: 3M Innovative Properties Company
    Inventor: Douglas B. Gundel
  • Patent number: 10347430
    Abstract: A multilayer ceramic electronic component includes a body with a plurality of first and second internal electrodes alternately arranged with dielectric layers interposed therebetween. There may be M each of third and fourth external electrodes on opposing sides of the body, where M is greater than or equal to 3 and all external electrodes have different polarities than the adjacent external electrodes. There may be N via electrodes penetrating through the body, where N is greater than or equal to 3 and the via electrodes are connected to either of the first or second internal electrodes. The multilayer ceramic electronic component may achieve low equivalent series inductance (ESL) characteristics and may reduce the mounting area on the circuit board.
    Type: Grant
    Filed: July 17, 2017
    Date of Patent: July 9, 2019
    Assignee: Samsung EIectro-Mechanics Co., Ltd.
    Inventors: Sang Soo Park, Young Ghyu Ahn, Hwi Dae Kim