Abstract: An electrified wire containing a plurality of integrated hubs populated along the wire's span providing mechanical and electrical and data connectivity to an array of removable device platforms with IoT device assemblies whereas the devices assemblies operate in real time, are either networked or stand-alone, and can be placed where and when needed.

Abstract: Highly uniform and thin silver nanowires are described having average diameters below 20 nm and a small standard deviation of the diameters. The silver nanowires have a high aspect ratio. The silver nanowires can be characterized by a small number of nanowires having a diameter greater than 18 nm as well as with a blue shifted narrow absorption spectrum in a dilute solution. Methods are described to allow for the synthesis of the narrow uniform silver nanowires. Transparent conductive films formed from the thin, uniform silver nanowires can have very low levels of haze and low values of ?L*, the diffusive luminosity, such that the transparent conductive films can provide little alteration of the appearance of a black background.

Abstract: A multilayer ceramic capacitor includes a laminated body and first and second external electrodes respectively on both end surfaces of the laminated body. When regions where first internal electrodes or second internal electrodes are not present are regarded as side margin portions in a cross section of the laminated body as viewed from the laminating direction, the side margin portions include multiple side margin layers, and the content of Si in the side margin layer closest to the internal electrode is lower than that in the side margin layer other than the side margin layer closest to the internal electrode.

Abstract: An electronic component includes: a plurality of multilayer capacitors stacked in multiple rows and columns and each having external electrodes on both ends thereof in a first direction; and a board including a body and a connection portion. The connection portion includes: a plurality of positive electrode land patterns; a plurality of negative electrode land patterns; positive and negative electrode terminal patterns formed on a lower surface of the body to be spaced apart from each other in the first direction; a positive electrode connection portion connecting the plurality of positive electrode land patterns to the positive electrode terminal pattern; and a negative electrode connection portion connecting the plurality of negative electrode land patterns to the negative electrode terminal pattern.

Abstract: A wire harness that includes a plurality of electrical wires; a relay connector provided with a common single tube having conductivity and through which the plurality of electrical wires are inserted; a plurality of braids respectively covering the plurality of electrical wires; and a coupler that couples the plurality of braids to the common single tube, in a state where ends of the plurality of braids are stacked in a layered manner around an entire circumference of the common single tube in a circumferential direction, wherein insertion holes that guide the plurality of electrical wires inside all of the braids are formed in the ends of the braids, and the plurality of electrical wires are electrically connected inside the relay connector.

Abstract: A multilayer ceramic electronic component includes a body with a plurality of first and second internal electrodes alternately arranged with dielectric layers interposed therebetween. There may be M each of third and fourth external electrodes on opposing sides of the body, where M is greater than or equal to 3 and all external electrodes have different polarities than the adjacent external electrodes. There may be N via electrodes penetrating through the body, where N is greater than or equal to 3 and the via electrodes are connected to either of the first or second internal electrodes. The multilayer ceramic electronic component may achieve low equivalent series inductance (ESL) characteristics and may reduce the mounting area on the circuit board.

Abstract: An enclosure for electronics includes a base, a base cover, a gasket, and an enclosure cover. The base receives one or more electronic elements. The base cover is mounted over the first base to secure the electronic elements within the base and form a unit having a groove in at least a part of the periphery of the unit. The gasket resides within the groove of the first unit. The enclosure cover is mounted over the first unit and the gasket and applies a compressive force to the gasket such that the gasket (i) forms a seal for the enclosure and (ii) applies force that secures at least a part of the periphery of the first base cover to at least a part of the periphery of the first base. In a single-unit assembly, the enclosure cover is an assembly cover that attaches to the unit. In a dual-unit assembly, each unit functions as the enclosure cover for the other unit in a clam-shell configuration.

Abstract: A surface-treated copper foil of the present disclosure includes a copper foil substrate, at least one surface of which has a surface treatment coat including at least a roughening-treated surface on which roughening particles are formed. Observation of a cross-section of the surface-treated copper foil with a scanning electron microscope shows that on a surface of the surface treatment coat, a standard deviation of the particle height of the roughening particles is 0.16 ?m or more and 0.30 ?m or less, and an average value of the ratio of the particle height to the particle width (particle height/particle width) of the roughening particles is 2.30 or more and 4.00 or less.

Abstract: A sheath-bonding link box is provided, the sheath-bonding link box including a housing defining a sealed interior space, and a set of electrically conductive connectors extending through the housing between an exterior of the enclosure and the interior space. The set of connectors each has an internal portion positioned inside of the interior space and an external portion positioned outside of the housing. The internal portion of the connectors is electrically connectable to a functional link in the interior space, and the external portion of the connectors is dimensioned to be electrically connectable to a sheath-bonding lead.

Abstract: Ultra-conductive wires having enhanced electrical conductivity are disclosed. The conductivity of an ultra-conductive wire is enhanced using cold wire drawing and annealing. Methods of making the ultra-conductive wires are further disclosed.

Abstract: The invention relates to an apparatus for carrying a cable, wherein the cable comprises a conductor, a shield braid surrounding the conductor, a protective coat; the protective coat is removed along a part of its length, so that the shield braid is exposed; a housing surrounding the cable; an electrical connection in order to establish a conductive connection between the shield braid and the housing; a hinged sleeve is provided, which encloses the cable in the longitudinal section of the exposed shield braid; the hinged sleeve consists of an electrically conductive material which is connected to the housing in a conductive manner.

Abstract: A plurality of first and second capacitor parts and second capacitor parts are formed on opposed main surfaces of a foil shaped conductive substrate to sandwich the conductive substrate. The first and second capacitor parts are respectively coated with insulative protection layers. Terminal electrodes are respectively formed on main surfaces of the protection layers. The terminal electrodes and conductive parts of the first and second capacitor parts are respectively electrically connected via first via conductors and the terminal electrodes and the conductive substrate 1 are electrically connected to second via conductors.

Abstract: The electromagnetic shielding of an enclosable building structure is provided by applying a shielded covering to overlay optical openings in the building structure. The shielded covering comprises a metal-coated woven substrate and a shielding coupling. The metal-coated woven substrate has a woven substrate and a metal coating. The woven substrate may be organic and comprise threads of intermingled fibers such as silk fibers. The metal-coated woven substrate may also have a protection feature such as transparent resin, of barriers of glass or transparent polymeric material. The shielded coupling connects the shielded covering to other shielding components of a shielded building structure to preserve shielding continuity over the interface between shielding components.

Abstract: Provided is a large-sized silicon nitride sintered substrate and a method for producing the same. The silicon nitride sintered substrate has a main surface 101a of a shape larger than a square having a side of a length of 120 mm. A ratio dc/de of the density dc of the central area and the density de of the end area of the main surface 101a is 0.98 or higher. The void fraction vc of the central area of the main surface 101a is 1.80% or lower, and the void fraction ve of the end area is 1.00% or lower. It is preferred that the density dc of the central area is 3.120 g/cm3 or higher, the density de of the end area is 3.160 g/cm3 or higher, and a ratio ve/vc of the void fraction vc of the central area and the void fraction ve of the end area is 0.50 or higher.

Abstract: The electromagnetic shielding of an enclosable building structure is provided by applying a shielded covering to overlay optical openings in the building structure. The shielded covering comprises a metal-coated woven substrate and a shielding coupling. The metal-coated woven substrate has a woven substrate and a metal coating. The woven substrate may be organic and comprise threads of intermingled fibers such as silk fibers. The metal-coated woven substrate may also have a protection feature such as transparent resin, of barriers of glass or transparent polymeric material. The shielded coupling connects the shielded covering to other shielding components of a shielded building structure to preserve shielding continuity over the interface between shielding components.

Abstract: A power conversion apparatus includes: a busbar; a magnetic core disposed to surround the busbar; and a fixing member that supports the magnetic core and is secured to the busbar. A noise filter includes: a magnetic core disposed to surround a busbar of a power conversion apparatus, and a fixing member that supports the magnetic core and is secured to the busbar.

Abstract: An electromagnetic shielding module and a display device are disclosed. The electromagnetic shielding module includes an electromagnetic shielding film and a temperature adjusting circuit, and the temperature adjusting circuit is configured for adjusting a temperature of the electromagnetic shielding film.

Abstract: A thermal connector comprising an electrically insulating beam having a first end face at a first end and a second end face at a second end is provided. The second end face may be opposite the first end face in an X direction. The beam may have a width in a Y direction perpendicular to the X direction. The beam may also have a top face and a bottom face offset from the top face in a Z direction. The thermal connector may include a first terminal attached to the bottom face and adjacent the first end and a second terminal attached to the top face and adjacent the first end. The connector may have an overall thickness in the Z direction, which includes the first and second terminals and is greater than 1.27 mm and less than 3.81 mm.

Abstract: Various examples are provided for superlattice conductors. In one example, a planar conductor includes a plurality of stacked layers including copper thin film layers and nickel thin film layers, where adjacent copper thin film layers of the copper thin film layers are separated by a nickel thin film layer of the plurality of nickel thin film layers. In another example, a conductor includes a plurality of radially distributed layers including a non-ferromagnetic core; a nickel layer disposed about and encircling the non-ferromagnetic core; and a copper layer disposed on and encircling the nickel layer. In another example, a hybrid conductor includes a core; and a plurality of radially distributed layers disposed about a portion of an outer surface of the core, the plurality of radially distributed layers include alternating ferromagnetic and non-ferromagnetic layers. In other hybrid conductors, the radially distributed layers can utilize magnetic and non-magnetic materials.

Abstract: Both deformation of a cross-sectional shape of the entire composite cable and deformation of a cross-sectional shape of an electric wire included in the composite cable are suppressed. The composite cable includes: a plurality of first electric wires; a shield electric wire in which a shield layer 33 is formed around a twist pair wire 32 obtained by intertwining a plurality of second electric wires; a sheath formed around an electric wire assembly obtained by intertwining the first electric wires and the shield electric wire; a first line filler filled between the twist pair wire and the shield layer; and a second line filler filled between the electric wire assembly and the sheath. While the first electric wires and the shield electric wire are intertwined in a first direction, the second electric wires are intertwined in a second direction that is opposite to the first direction.