Patents Examined by Guillermo J Egoavil
  • Patent number: 10342127
    Abstract: An electronic device including reinforced printed circuit board is provided. The electronic device includes the printed circuit board including a first area, and a second area that extends from a first end of the first area. A width of the second area is smaller than a width of the first area, and at least a portion of a surface of the second area is covered by a material layer that provides the second area with a specific strength.
    Type: Grant
    Filed: November 14, 2016
    Date of Patent: July 2, 2019
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Jung Hoon Park, Jin Woo Kim, Dae Kwang Kim
  • Patent number: 10325723
    Abstract: An electronic components includes: a multilayer capacitor including a capacitor body and a pair of external electrodes, an interposer including an interposer body and a pair of external terminals, and an adhesive; wherein the external terminal includes a bonding portion, a mounting portion, and a connection portion; wherein an adhesive is provided between the external electrode and the bonding portion, and falls along the connection portion of the external terminal; wherein 1.55?(L+T22)/T1 in which T2 is a height at which the adhesive falls along the connection portion of each of the external terminals, L is a length of the bonding portion, and T1 is a height of the electronic component.
    Type: Grant
    Filed: November 21, 2018
    Date of Patent: June 18, 2019
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ho Yoon Kim, Sang Soo Park, Woo Chul Shin
  • Patent number: 10325725
    Abstract: A multilayer capacitor includes a capacitor body including a plurality of first and second internal electrodes alternately stacked with dielectric layers interposed therebetween. A first via electrode penetrates through the plurality of first internal electrodes and is exposed at the first surface of the capacitor body. A second via electrode penetrates through the plurality of second internal electrodes, is exposed at the first surface of the capacitor body, and is spaced apart from the first via electrode. First and second external electrodes are on a first surface of the capacitor body, spaced apart from each other, and respectively connected to end portions of the first and second via electrodes. The first and second external electrodes each include a nickel (Ni) layer on the first surface of the capacitor body and a gold (Au) plating layer on the nickel layer.
    Type: Grant
    Filed: April 24, 2017
    Date of Patent: June 18, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yong Won Seo, Jin Kyung Joo, Ik Hwan Chang, Jin Woo Chun, Jin Man Jung
  • Patent number: 10320134
    Abstract: A connector brick for a cable communication system includes a connector frame including brick plates defining a frame space and cable connectors received in the frame space. The connector brick includes cable connector mounts coupled to the brick plates and extending across the frame space. The cable connector mounts sub-divide the frame space into cable connector openings receiving corresponding cable connectors. Each cable connector mount includes a brick spacer coupled to the brick plates and engaging corresponding cable connectors to secure the cable connectors in the frame space. Each cable connector mount includes a retainer clip snapably coupled to the brick spacer to secure the brick spacer to the brick plates.
    Type: Grant
    Filed: September 25, 2017
    Date of Patent: June 11, 2019
    Assignee: TE CONNECTIVITY CORPORATION
    Inventor: Christopher William Blackburn
  • Patent number: 10320169
    Abstract: A method and apparatus for wiring installations that is comprised of a universal electrical box that is made of a non-conductive block or hub that contains electrical conductors, which connect power from a building's electrical power source, to various electrical components. One design, can handle nine sheathed cables in a standard box, with five #14 wire and four #12 wire lines. Once installed, the current is redirected without physically moving the wires and will power up only if the electrical component and the wires are of the same amperage. All wires including the ground wires are always visible, while electrical components are installed and operating. Individual electrical lines are identifiable, dead-ended, and with the visibility of all wires, connecting the wires is now possible before the rough inspection. The lines can be energized while the walls are open, for troubleshooting.
    Type: Grant
    Filed: February 26, 2018
    Date of Patent: June 11, 2019
    Inventor: Alexander Ruggiero
  • Patent number: 10304619
    Abstract: An electronic component includes a circuit element, a body accommodating the circuit element therein, and a holder made of a metal plate and holding the circuit element. The circuit element includes an end portion extending out of the body from a side surface of the body. The end portion extends from the side surface of the body toward a bottom surface of the body. The holder has first and second side surface portions and a bottom surface portion facing the bottom surface of the body. The first and second side surface portions face the side surface of the body. The first and second side surface portions are disposed with respective gaps from the end portion of the circuit element such that the end portion of the circuit element is positioned between the first and second side surface portions. The bottom surface portion is connected to the first and second side surface portions. The end portion of the circuit element is fixed to the bottom surface portion.
    Type: Grant
    Filed: February 22, 2016
    Date of Patent: May 28, 2019
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventor: Mutsuyasu Ohtsubo
  • Patent number: 10297999
    Abstract: Electrical distribution systems and methods comprising a first cable-to-box connector which accepts electrical wires, a first electrical box having a first and a second coupler to connect to the cable-to-box connector; intra-box circuits built in one or more of a plurality of walls of the first electrical box and connecting the first and the second coupler; and a concavity defined by the plurality of walls of the first electrical box that receives a first electrical insert.
    Type: Grant
    Filed: February 19, 2018
    Date of Patent: May 21, 2019
    Inventor: Robert Holloway
  • Patent number: 10292289
    Abstract: An electrified wire containing a plurality of integrated hubs populated along the wire's span providing mechanical and electrical and data connectivity to an array of removable device platforms with IoT device assemblies whereas the devices assemblies operate in real time, are either networked or stand-alone, and can be placed where and when needed.
    Type: Grant
    Filed: September 1, 2017
    Date of Patent: May 14, 2019
    Inventor: Daniel S. Spiro
  • Patent number: 10290424
    Abstract: A multilayer ceramic capacitor includes: a multilayer chip having a parallelepiped shape in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked and are alternately exposed to two edge faces of the multilayer chip, a main component of the plurality of dielectric layers being a ceramic; and a pair of external electrodes that are formed on the two edge faces; wherein: the pair of external electrode have a structure in which a plated layer is formed on a ground layer; a main component of the ground layer is a metal or an alloy including at least one of Ni and Cu; and the ground layer includes Mo.
    Type: Grant
    Filed: December 8, 2017
    Date of Patent: May 14, 2019
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Atsuhiro Yanagisawa, Yoshinori Shibata, Mikio Tahara
  • Patent number: 10283236
    Abstract: A corrosion resistant conduit system that protects against corrosion and against electrical shortage. The corrosion resistant conduit system includes: a multilayer conduit having a metal layer disposed between two polymeric layers, a conduit fitting having an electrically conductive component and a body having one or more layers of polymeric material, and means for conductively coupling the metallic layer of the multilayer tube to the electrically conductive component of the fitting, which provides a continuous electrical path throughout the corrosion resistant conduit system.
    Type: Grant
    Filed: February 12, 2016
    Date of Patent: May 7, 2019
    Assignee: ABB Schweiz AG
    Inventors: Darren Dale Tremelling, Nikolaus Peter Zant, Yan Gao, Letisha McLaughlin Lam, Mark Drane, Cong Thanh Dinh, Ian Rubin de la Borbolla, Ronald White
  • Patent number: 10269496
    Abstract: A multilayer capacitor includes a body including dielectric layers, and first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween, first and second groove parts formed in external surfaces of the body in a first direction in which the dielectric layers are stacked, having at least one corner, and contacting the first and second internal electrodes, respectively, and first and second connection electrodes disposed in the first and second groove parts, respectively, and electrically connected to the first and second internal electrodes, respectively.
    Type: Grant
    Filed: April 11, 2017
    Date of Patent: April 23, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Won Young Lee, Sung Kwon An, Taek Jung Lee, Jin Kyung Joo, Hyo Youn Lee
  • Patent number: 10271427
    Abstract: A printed wiring board includes a first conductor layer including a first conductor circuit and a second conductor circuit formed adjacent to the first circuit, a resin insulating layer formed on the first conductor layer such that the insulating layer is filling space between the first and second conductor circuits, and a second conductor layer formed on the insulating layer such that distance (T) between the first and second conductor layers is in the range of 4.5 ?m to 10.5 ?m. The resin insulating layer includes inorganic particles having average particle diameter (D1) such that ratio (D1/S) of the diameter (D1) to distance (S) of the space is less than 0.25 and that ratio (D1/T) of the diameter (D1) to the distance (T) is less than 0.25, where the distance (S) of the space between the first and second conductor circuits is in the range of 4.5 ?m to 10.5.
    Type: Grant
    Filed: September 14, 2017
    Date of Patent: April 23, 2019
    Assignee: IBIDEN CO., LTD.
    Inventors: Hiroyasu Noto, Yoshinori Takenaka
  • Patent number: 10271426
    Abstract: A printed wiring board includes a first conductor layer including a first conductor circuit and a second conductor circuit formed adjacent to the first conductor circuit, a resin insulating layer formed on the first conductor layer such that the insulating layer is filling space between the first and second conductor circuits, and a second conductor layer formed on the insulating layer such that the insulating layer is interposed between the first and second conductor layers. The first conductor layer has thickness in the range of 1 ?m to 15 ?m and is formed such that the space between the first and second conductor circuits has width in the range of 2 ?m to 7 ?m, and the insulating layer includes inorganic particles having average particle diameter in the range of 0.05 ?m to 1.0 ?m and content in the range of 35 wt. % to 75 wt. % in the insulating layer.
    Type: Grant
    Filed: September 14, 2017
    Date of Patent: April 23, 2019
    Assignee: IBIDEN CO., LTD.
    Inventors: Hiroyasu Noto, Yoshinori Takenaka
  • Patent number: 10257965
    Abstract: The electromagnetic shielding of an enclosable building structure is provided by applying a shielded covering to overlay optical openings in the building structure. The shielded covering comprises a metal-coated woven substrate and a shielding coupling. The metal-coated woven substrate has a woven substrate and a metal coating. The woven substrate may be organic and comprise threads of intermingled fibers such as silk fibers. The metal-coated woven substrate may also have a protection feature such as transparent resin, of barriers of glass or transparent polymeric material. The shielded coupling connects the shielded covering to other shielding components of a shielded building structure to preserve shielding continuity over the interface between shielding components.
    Type: Grant
    Filed: June 30, 2017
    Date of Patent: April 9, 2019
    Assignee: Conductive Composites Company IP, LLC
    Inventors: George Clayton Hansen, Nathan D. Hansen
  • Patent number: 10249409
    Abstract: An assembly can include a housing that includes opposing ends, a longitudinal axis, an axial length defined between the opposing ends, a maximum transverse dimension that is less than the length and an interior space; circuitry disposed at least in part in the interior space; and a coated electrical conductor electrically coupled to the circuitry where the coated electrical conductor includes an electrical conductor that includes copper and a length defined by opposing ends, a polymeric electrical insulation layer disposed about at least a portion of the length of the electrical conductor, and a barrier layer disposed about at least a portion of the polymeric electrical insulation layer.
    Type: Grant
    Filed: June 21, 2016
    Date of Patent: April 2, 2019
    Assignee: SCHLUMBERGER TECHNOLOGY CORPORATION
    Inventors: Jushik Yun, Manuel Marya
  • Patent number: 10242768
    Abstract: A wire harness exterior member includes a flexible tube portion, an inflexible tube portion, and a post-attached part attached to a boundary between the flexible tube portion and the inflexible tube portion. The post-attached part is attached such that at least a portion of an attaching surface of a rigid attaching portion overlaps the flexible tube portion.
    Type: Grant
    Filed: January 2, 2015
    Date of Patent: March 26, 2019
    Assignee: YAZAKI CORPORATION
    Inventors: Shinichi Inao, Hideomi Adachi, Takeshi Ogue, Tatsuya Oga, Masaaki Suguro, Yoshiaki Ozaki, Hiroyuki Yoshida
  • Patent number: 10242797
    Abstract: A multilayer-ceramic-capacitor mounting structure includes a circuit board and a multilayer ceramic capacitor. First and second external electrodes include first and second conductive resin layers on surfaces of first and second base electrode layers, respectively. The circuit board includes a copper plate on a surface of a core, disposed as a wiring pattern, and including a predetermined thickness, and signal electrodes disposed on a surface of the copper plate. The first and second external electrodes are each electrically connected to the signal electrodes of the copper plate.
    Type: Grant
    Filed: April 10, 2017
    Date of Patent: March 26, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Yosuke Terashita
  • Patent number: 10231331
    Abstract: A multilayer wiring board includes: a multilayer body including a plurality of insulating layers; a lower outer electrode provided on a lower surface of the multilayer body; a first via conductor connected at one end to the lower outer electrode; a first in-plane conductor connected to another end of the first via conductor; a second via conductor provided within the multilayer body on a surface of the first in-plane conductor on the opposite side from a surface of the first in-plane conductor in a position distanced from the first via conductor viewed in a direction orthogonal to a layering direction of the multilayer body, one end of the second via conductor being connected to the first in-plane conductor; and a second in-plane conductor connected to another end of the second via conductor. A line width of the first in-plane conductor is narrower than that of the second in-plane conductor.
    Type: Grant
    Filed: May 20, 2016
    Date of Patent: March 12, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yoshihito Otsubo, Takayuki Tsukizawa
  • Patent number: 10188020
    Abstract: [Problem] Objects of the invention are to provide a cable assembly with reduced characteristic impedance at a protruding end portion of a first wire of a cable and configured for easy manufacture, and to provide a method for manufacturing the cable assembly. [Configuration] A cable assembly A1 includes a terminal 400a, a cable 100, and an electroconductive member 200. The cable 100 includes an outer insulator 100, a shield conductor 120 inside the outer insulator 110, and at least one first wire 130a being a signal wire inside the shield conductor 120. The first wire 130a includes a protruding portion Pa protruding in the Y-Y? direction from the shield conductor 120 and the outer insulator 110. The electroconductive member 200 is an electroconductive plate or electroconductive tape wound around at least a part in the Y-Y? direction of the protruding portion Pa.
    Type: Grant
    Filed: November 11, 2015
    Date of Patent: January 22, 2019
    Assignee: Hosiden Corporation
    Inventor: Hayato Kondo