Patents Examined by Guillermo J Egoavil
  • Patent number: 10636543
    Abstract: Both deformation of a cross-sectional shape of the entire composite cable and deformation of a cross-sectional shape of an electric wire included in the composite cable are suppressed. The composite cable includes: a plurality of first electric wires; a shield electric wire in which a shield layer 33 is formed around a twist pair wire 32 obtained by intertwining a plurality of second electric wires; a sheath formed around an electric wire assembly obtained by intertwining the first electric wires and the shield electric wire; a first line filler filled between the twist pair wire and the shield layer; and a second line filler filled between the electric wire assembly and the sheath. The first electric wires and the shield electric wire are intertwined in a first direction, and the second electric wires are also intertwined in the first direction.
    Type: Grant
    Filed: July 2, 2019
    Date of Patent: April 28, 2020
    Assignee: Hitachi Metals, Ltd.
    Inventors: Hirotaka Eshima, Yoshikazu Hayakawa, Tomoyuki Murayama
  • Patent number: 10629372
    Abstract: A laminated electronic component includes a laminate including internal electrodes and dielectric layers laminated alternately and a first main surface, an external electrode that continuously covers at least one end surface of the laminate in a longitudinal direction and a portion of the first main surface adjacent to the one end surface, and a conductive elastic structure connected to the external electrode at at least corner portions of the first main surface in a portion where the external electrode covers the first main surface. The elastic structure includes a base portion connected to the external electrode to extend along the first main surface, and a branch portion branched from the base portion and extending at a position spaced from the first main surface to connect to another electrode, and having elasticity.
    Type: Grant
    Filed: March 10, 2014
    Date of Patent: April 21, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Yasuo Fujii
  • Patent number: 10622146
    Abstract: A multilayer capacitor includes an element assembly, a first external electrode, a second external electrode, and a plurality of internal electrodes which are disposed at the inside of the element assembly. The plurality of internal electrodes include a first internal electrode that is electrically connected to the first external electrode, a second internal electrode that is electrically connected to the second external electrode, and a plurality of third internal electrodes. The plurality of third internal electrodes are electrically connected to each other by a first connection conductor and a second connection conductor, a first capacitance portion is constituted by the first internal electrode and the third internal electrodes, a second capacitance portion is constituted by the second internal electrode and the third internal electrodes, and the first capacitance portion and the second capacitance portion are electrically connected in series.
    Type: Grant
    Filed: January 23, 2019
    Date of Patent: April 14, 2020
    Assignee: TDK CORPORATION
    Inventors: Takeru Yoshida, Takuya Imaeda, Shogo Murosawa, Hideki Kamo, Naoto Imaizumi, Keiichi Takizawa
  • Patent number: 10622151
    Abstract: In an exemplary embodiment, a multilayer ceramic capacitor has, at two opposing respective end parts of a capacitor body 11 of roughly rectangular solid shape, external electrodes 12 that each have a conductive resin layer F3 inside. Each of the external electrodes 12 continuously has an end face part 12a corresponding to one face, and a wraparound part 12b corresponding to four faces surrounding the one face, of the capacitor body 11. Also, the end face part 12a of each of the external electrodes 12 has a bulging part 12a1 on the outer face of the end face part 12a. An electronic component using the multilayer ceramic capacitor can maximally prevent the Manhattan phenomenon that may otherwise occur when the electronic component is mounted on a circuit board, even though its external electrodes have the conductive resin layer inside.
    Type: Grant
    Filed: November 7, 2018
    Date of Patent: April 14, 2020
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Satoshi Kobayashi, Takahisa Fukuda, Tomoaki Nakamura, Mikio Tahara
  • Patent number: 10615553
    Abstract: A busbar system comprises an electrically conductive busbar having multiple ridges that project from a first side of the busbar. Each ridge defines a channel having an opening on a second side of the busbar. Interior facing surfaces of each ridge that define the channel are substantially smooth and/or free of protrusions or teeth prior to the ridge being externally crimped. The busbar system further comprises multiple electrically conductive electrical contacts having a substantially broad and thin configuration, wherein one or more of the electrical contacts are secured within each channel of the busbar by the ridge being externally crimped by a tool having surfaces that include one or more protrusions.
    Type: Grant
    Filed: July 31, 2018
    Date of Patent: April 7, 2020
    Assignee: ARCIMOTO, INC.
    Inventors: James Jordan, David Boyd, Jove Lachman-Curl
  • Patent number: 10611666
    Abstract: Methods are disclosed directed to a controlled crystallization (ceramic particle growth) of a shaped glass ceramic workpiece. The physical and chemical properties of the shaped glass ceramic of the present invention may be specified or tailored by shaping or machining the workpiece during or in combination with a controlled crystallization process that nucleates (precipitates) ceramic particles from a glass material. For example, in one embodiment, a non-crystalline amorphous solid may be heated above a transition temperature and shaped (e.g., molded, pressed, or the like). Ceramic particles may be precipitated within the solid during at least one of the heating or the shaping, thereby forming a shaped glass ceramic.
    Type: Grant
    Filed: June 13, 2018
    Date of Patent: April 7, 2020
    Assignee: APPLE INC.
    Inventors: Christopher D. Jones, Dale N. Memering
  • Patent number: 10615111
    Abstract: An interposer for vertically separating device die is disclosed. The interposer includes a compliant layer comprising a plurality of thermally conductive plugs that are physically disconnected within the plane of the compliant layer, where the space between the plugs is filled with a compliant medium. In some embodiments, at least one of the top and bottom surfaces of the compliant layer is coated with a thin layer of electrically insulating material.
    Type: Grant
    Filed: November 2, 2015
    Date of Patent: April 7, 2020
    Assignee: The Board of Trustees of the Leland Stanford Junior University
    Inventors: Arunava Majumdar, Seid H. Sadat, Dusan Coso
  • Patent number: 10609831
    Abstract: Entry of water from the terminal portion side to the electronic component side is inhibited. A circuit unit includes: a circuit section including a terminal portion that can be connected to an external terminal, and a body portion to which an electronic component is mounted; a first waterproofing portion that is in intimate contact with a portion to be waterproofed located between the body portion and the terminal portion of the circuit section, and that includes a resin containing an adhesive component; and a second waterproofing portion that is in intimate contact with an outer surface of each of the circuit section and the first waterproofing portion, and that is made of a resin.
    Type: Grant
    Filed: June 6, 2019
    Date of Patent: March 31, 2020
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Yoshikazu Sasaki, Jun Ikeda
  • Patent number: 10607926
    Abstract: A preformed lead frame device includes multiple spaced-apart longitudinal sections, multiple spaced-apart transverse sections intersecting the longitudinal sections, and multiple preformed lead frame units each surrounded by two adjacent ones of the longitudinal sections and two adjacent ones of the transverse sections. Each of the preformed lead frame units includes a die pad sub-unit including a die pad portion, multiple pillar portions, and a first gap formed among the die pad portion and the pillar portions, a lead sub-unit including leads and a second gap formed among the die pad sub-unit and the leads, an adhesion-strengthening layer disposed in the first and second gaps, and a molding layer filling the first and second gaps to cover the adhesion-strengthening layer.
    Type: Grant
    Filed: July 3, 2019
    Date of Patent: March 31, 2020
    Assignee: CHANG WAH TECHNOLOGY CO., LTD.
    Inventor: Chia-Neng Huang
  • Patent number: 10600728
    Abstract: A method of manufacturing a through-hole electrode substrate includes forming a plurality of through-holes in a substrate, forming a plurality of through-hole electrodes by filling a conductive material into the plurality of through-holes, forming a first insulation layer on one surface of the substrate, forming a plurality of first openings which expose the plurality of through-hole electrodes corresponding to each of the plurality of through-hole electrodes, on the first insulation layer and correcting a position of the plurality of first openings using the relationship between a misalignment amount of a measured distance value of an open position of a leaning through-hole among the plurality of through-holes and of a design distance value of the open position of the leaning through-hole among the plurality of through-holes with respect to a center position of the substrate.
    Type: Grant
    Filed: May 31, 2018
    Date of Patent: March 24, 2020
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventor: Takamasa Takano
  • Patent number: 10600533
    Abstract: A multi-member cable includes at least a first cable element and a second cable element. The first and second cable elements twist around a center axis of the cable in a counterclockwise direction multiple times to a first reversal point, then twist about the center axis of the cable in a clockwise direction multiple times until a second reversal point, with this pattern repeating along a length of the cable. Adhesion points are formed at intervals along a length of the cable to connect the first and second cable elements. The adhesion points may be spaced apart at an interval equal to a distance between the first and second reversal points. An outer surface of a jacket of the cable may include indications at the first and/or second reversal points, such as physical bumps or markings.
    Type: Grant
    Filed: March 13, 2017
    Date of Patent: March 24, 2020
    Assignee: CommScope, Inc. of North Carolina
    Inventor: Daniel J. Parke
  • Patent number: 10600572
    Abstract: A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and first and second internal electrodes disposed to face each other with respective dielectric layers interposed therebetween; and first and second external electrodes disposed on an external surface of the ceramic body, wherein the dielectric layer contains a barium titanate-based powder particle having a core-shell structure including a core and a shell around the core, the shell having a structure in which titanium is partially substituted with an element having the same oxidation number as that of the titanium in the barium titanate-based powder particle and having an ionic radius different from that of the titanium in the barium titanate-based powder particle, and the shell covers at least 30% of a surface of the core.
    Type: Grant
    Filed: August 23, 2017
    Date of Patent: March 24, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Woo Kim, Jong Ho Lee, Min Gi Sin, Hak Kwan Kim, Chin Mo Kim, Chi Hwa Lee, Hong Seok Kim, Woo Sup Kim, Chang Hwa Park
  • Patent number: 10600575
    Abstract: A multilayer ceramic capacitor includes a laminated body and first and second external electrodes respectively on both end surfaces of the laminated body. When regions where first internal electrodes or second internal electrodes are not present are regarded as side margin portions in a cross section of the laminated body as viewed from the laminating direction, the side margin portions include multiple side margin layers, and the content of Si in the side margin layer closest to the internal electrode is lower than that in the side margin layer other than the side margin layer closest to the internal electrode.
    Type: Grant
    Filed: February 26, 2019
    Date of Patent: March 24, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hideaki Tanaka, Daiki Fukunaga, Koji Moriyama
  • Patent number: 10593484
    Abstract: An electronic component includes: a plurality of multilayer capacitors stacked in multiple rows and columns and each having external electrodes on both ends thereof in a first direction; and a board including a body and a connection portion. The connection portion includes: a plurality of positive electrode land patterns; a plurality of negative electrode land patterns; positive and negative electrode terminal patterns formed on a lower surface of the body to be spaced apart from each other in the first direction; a positive electrode connection portion connecting the plurality of positive electrode land patterns to the positive electrode terminal pattern; and a negative electrode connection portion connecting the plurality of negative electrode land patterns to the negative electrode terminal pattern.
    Type: Grant
    Filed: October 9, 2018
    Date of Patent: March 17, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ho Yoon Kim, Jae Yeol Choi, Soo Hwan Son
  • Patent number: 10586630
    Abstract: A wire harness that allows branched locations to be defined and can be manufactured inexpensively. A wire harness includes a tubular bendable pipe through which a wire is inserted. The pipe includes pull-out ports of the wire at positions corresponding to branching locations of the wire. The pull-out ports are configured to open on the respective mating surfaces of a first divided segment and a second divided segment obtained by circumferentially dividing the pipe into two. Bushes serving as protection portions that protect the wire are provided at rims of the pull-out ports.
    Type: Grant
    Filed: December 11, 2017
    Date of Patent: March 10, 2020
    Assignee: Sumitomo Wiring Systems, LTD.
    Inventor: Hidetoshi Sugino
  • Patent number: 10581230
    Abstract: A method of manufacturing a cold shrinkable termination for an electric power cable that includes an insulation tube and stress control glue. An electric power cable is provided having an exposed end including: a conductor core having an exposed portion and an unexposed portion; an insulation layer having an exposed portion and an unexposed portion covering the unexposed portion of conductor core; a semi-conductive shield layer having an exposed portion and an unexposed portion covering the unexposed portion of the insulation layer; a metal shield layer having an exposed portion and an unexposed portion covering the unexposed portion of the semi-conductive shield layer; and an outer protection layer covering the unexposed portion of the metal shield layer. A cold shrinkable termination is provided including: an insulation tube; a stress control glue; and, a support tube. The stress control glue is coated along a selected segment of an inner wall of the insulation tube.
    Type: Grant
    Filed: September 26, 2018
    Date of Patent: March 3, 2020
    Assignee: Tyco Electronics (Shanghai) Co. Ltd.
    Inventors: Yugang Li, Lizhang Yang, Haowei Yang, Peng Li, Song Xue
  • Patent number: 10580575
    Abstract: A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and first and second internal electrodes disposed to face each other with respective dielectric layers interposed therebetween; and first and second external electrodes disposed on an external surface of the ceramic body, wherein the dielectric layer contains a barium titanate-based powder particle having a core-shell structure including a core and a shell around the core, the shell having a structure in which titanium is partially substituted with an element having the same oxidation number as that of the titanium in the barium titanate-based powder particle and having an ionic radius different from that of the titanium in the barium titanate-based powder particle, and the shell covers at least 30% of a surface of the core.
    Type: Grant
    Filed: February 5, 2019
    Date of Patent: March 3, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Woo Kim, Jong Ho Lee, Min Gi Sin, Hak Kwan Kim, Chin Mo Kim, Chi Hwa Lee, Hong Seok Kim, Woo Sup Kim, Chang Hwa Park
  • Patent number: 10573461
    Abstract: An element body of a rectangular parallelepiped shape includes a first principal surface arranged to constitute a mounting surface, a second principal surface opposing the first principal surface in a first direction, a pair of side surfaces opposing each other in a second direction, and a pair of end surfaces opposing each other in a third direction. An external electrode is disposed at an end portion of the element body in the third direction. The external electrode includes a conductive resin layer. The conductive resin layer covers a region near the first principal surface of the end surface. A height of the conductive resin layer in the first direction is larger at an end portion in the second direction than at a center in the second direction, when viewed from the third direction.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: February 25, 2020
    Assignee: TDK CORPORATION
    Inventors: Shinya Onodera, Takehisa Tamura, Atsushi Takeda, Ken Morita
  • Patent number: 10559424
    Abstract: A multilayer capacitor and a board having the same provide high capacitance and low equivalent series inductance (ESL). The multilayer capacitor includes a capacitor body including an active region, including first and second internal electrodes, and first and second cover regions. Third and fourth internal electrodes are alternately disposed in the cover region adjacent to a mounting surface. First and second external electrodes respectively contact the first and second internal electrodes to provide capacitance. First and second via electrodes are disposed in the cover region, where the first via electrode connects the third internal electrode and a first band portion of the first external electrode to each other, and where the second via electrode connects the fourth internal electrode and a second band portion of the second external electrode to each other.
    Type: Grant
    Filed: June 11, 2018
    Date of Patent: February 11, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jong Pil Lee, Hyo Youn Lee, Sung Kwon An, Seung Woo Song, Taek Jung Lee, Jin Kyung Joo
  • Patent number: 10559423
    Abstract: A multilayer ceramic electronic device includes a laminated body having alternately laminated internal electrode layers and dielectric layers. The dielectric layer has a thickness of 0.5 ?m or less. The internal electrode layers contain ceramic particles. A content ratio of the ceramic particles contained in the internal electrode layer is 2 to 15% by representation of cross sectional area.
    Type: Grant
    Filed: December 26, 2017
    Date of Patent: February 11, 2020
    Assignee: TDK CORPORATION
    Inventors: Nobuyuki Koide, Toshihiko Kaneko, Yasushi Tanaka