Abstract: An electronic component includes a multilayer capacitor, including a capacitor body and first and second external electrodes disposed on both ends of the capacitor body, respectively, in a first direction, and a interposer including an interposer body and first and second external terminals in a second direction. The capacitor body includes a plurality of dielectric layers and a plurality of first and second internal electrodes exposed through the both ends of the capacitor body, respectively. The first and second external terminals each include a first layer including CuNi, a second layer covering the first layer and including copper (Cu), a third layer covering the second layer and including nickel (Ni), and a fourth layer covering the third layer and including tin (Sn), which are sequentially disposed from a respective inner side of the first and second external terminals.

Abstract: A multilayer ceramic capacitor that includes a ceramic body including a stack of a plurality of dielectric layers and a plurality of first and second internal electrodes; and first and second external electrodes provided at each of both end faces of the ceramic body. Each of the plurality of dielectric layers contain Ba, Ti, P and Si. The plurality of dielectric layers include an outer dielectric layer located on an outermost side in the stacking direction; an inner dielectric layer located between the first and second internal electrodes; and a side margin portion in a region where the first and second internal electrodes do not exist. In at least one of the outer dielectric layer, the inner dielectric layer and the side margin portion, the P and the Si segregate in at least one of grain-boundary triple points of three ceramic particles.

Abstract: A wiring board includes an insulating substrate and a wiring conductor. The insulating substrate includes a first layer having an upper surface and a lower surface and having a first content of aluminum oxide and containing mullite and a second layer stacked on the upper surface and/or the lower surface of the first layer and having a second content of aluminum oxide greater than the first content. The wiring conductor is located inside the first layer and contains a manganese compound and/or a molybdenum compound. A manganese silicate phase and/or a magnesium silicate phase in an interface area between the insulating substrate and the wiring conductor.

Abstract: An object of the present invention is to ensure the reliability of a capacitor element by appropriately securing a heat path around the capacitor element. A power converter according to the present invention includes: a power semiconductor circuit unit that converts DC power into AC power; a capacitor element that smooths the DC power; a DC-side bus bar that transmits the DC power; a capacitor terminal that is connected to an electrode surface of the capacitor element and to the DC-side bus bar; and a case that forms a capacitor housing portion for housing the capacitor element, in which the DC-side bus bar has: a power supply-side terminal; a main body portion that is arranged at a position facing a bottom of the capacitor housing portion with the capacitor element interposed therebetween; and an extending member that is formed between the case and the capacitor element and formed from the main body portion toward the bottom of the capacitor housing portion, and that does not contact the electrode surface.

Abstract: A busbar applied in electrical cabinet disclosing an electrical cabinet set containing main busbars and secondary busbars built in a closed tubular shape, assembled in the referred electrical cabinet, which also presents insulators and secondary insulators, protection system in the main busbar systems, extension set and finally derivation connectors.

Abstract: The capacitor includes a capacitor element, a busbar connected to an electrode of the capacitor element, a case housing the capacitor element, and a filling resin filled in the case. The case has a through-hole penetrating from an inner surface of the case to an outer surface of the case. The busbar includes a connection terminal part led out through the through-hole to the outside of the case. The capacitor further includes a sealing member that has a ring shape surrounding the connection terminal part and attaches to the connection terminal part. The sealing member abuts on a first region of the inner surface of the case to seal the through-hole, the first region surrounding the through-hole.

Abstract: A protection relay connection assembly (10) for connecting a current transformer (14) and/or a voltage transformer (16) of an electrical network (12) to a protection relay (18) is provided. The protection relay connection assembly (10) includes a protection relay data acquisition board (20) and a protection relay connector (22). The protection relay data acquisition board (20) includes a first current mating member (24) connectable to a current measurement sensor (28), the current measurement sensor (28) being connectable in use to the protection relay (18) and/or a first voltage mating member (26) connectable to a voltage measurement sensor (30), the voltage measurement sensor (30) being connectable in use to the protection relay (18). The protection relay connector (22) includes a second current mating member (36) connectable to the current transformer (14) and/or a second voltage mating member (38) connectable to the voltage transformer (16).

Abstract: An electronic component includes an element body and an external electrode disposed on the element body. The element body includes a principal surface arranged to constitute a mounting surface and an end surface adjacent to the principal surface. The external electrode includes a conductive resin layer disposed to continuously cover a part of the principal surface and a part of the end surface, and a plating layer covering the conductive resin layer. The conductive resin layer includes a first region positioned on the end surface and a second region positioned on the principal surface. A maximum thickness of the second region is larger than a maximum thickness of the first region.

Abstract: Providing an outer cover body for electrical wires that can improve the degree of freedom of design while preventing anisotropy in mechanical properties and also make it possible to form even a compact outer cover body for electrical wires. An outer cover body for electrical wires that is to be attached to the outer periphery of an electrical wire, the outer cover body for electrical wires being formed of a bent thermoplastic resin foam sheet having a density of not less than 200 Kg/m3 and not more than 700 Kg/m3.

Abstract: Provided is an electronic module with which electrical connection with an electronic component attached to the electronic module can be stabilized. A vehicle electronic module including a casing that includes a ceiling plate to which an electronic components is to be attached and a bottom plate that is located opposite to the ceiling plate includes a bus bar configured to be electrically connected to a relay terminal of the electronic component inserted into the casing, and the bus bar is movable together with the electronic component in the opposing direction of the ceiling plate and the bottom plate.

Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode including an electrode layer disposed on the body and connected to the internal electrode and a conductive resin layer disposed on the electrode layer, and the conductive resin layer includes a metal wire, a conductive metal, and a base resin.

Abstract: A female welding lead connector including a safety cover hingedly connected to a main body of the female welding lead connector. The safety cover preferably includes a fastener for fastening the cover to a closed position, shielding a female welding lead receptacle inside the main body of the female welding lead connector.

Abstract: The invention relates to a housing having at least one current passage that is impervious to high pressure acting from the exterior, e.g. of at least 1000 bar, e.g. up to 8000 bar. The housing has a first housing part and a second housing part that by spaced-apart bearing surfaces that are facing one another, between which at least one insulator is arranged, with the at least one insulator imperviously encompass an inner volume. The housing is opened easily by spacing apart the first housing part from the second one. Generally, the housing parts are electrically insulated from one another by the insulator.

Abstract: A dielectric ceramic composition includes, as a main component, a perovskite compound containing Sr and Zr and may contain Ca and/or Ti, further contains Li and Si, and may contain Mn. When a total content of Zr and Ti is 100 parts by mol, a total content (100×m) of parts by mol of Sr and Ca is 0.8?m?1.3, a content a of parts by mol of Mn is 0?a?10, a content b of parts by mol of Li is 5?b?15, a content c of parts by mol of Si is 20?c?40, a molar ratio x of Ca/(Sr+Ca) is 0?x?0.8, and a molar ratio y of Ti/(Zr+Ti) is 0?y?0.5.

Abstract: A terminal-equipped wire in which a terminal fitting and a wire obtained by covering an outer periphery of a conductor with an insulating covering are electrically connected to each other at an electric connection, the terminal-equipped wire including a resin covering that is made of a resin material, and covers the electric connection, wherein: the resin covering includes, in a region that covers at least part of the terminal fitting, a first covering layer that is in contact with a surface of the terminal fitting and a second covering layer that covers at least part of the first covering layer, and the first covering layer has a recess, and the recess is covered by the second covering layer.

Abstract: A header for a semiconductor device, includes a main body section having an upper surface, and a cavity formed in the upper surface, a heat dissipation section provided on the upper surface of the main body section, and a wiring board provided inside the cavity. The wiring board includes a substrate having a first principal surface, and a second principal surface provided on an opposite side from the first principal surface, a first conductor pattern provided on the first principal surface, and having a mounting section on which a semiconductor element is mounted, and a second conductor pattern provided on the second principal surface, and bonded to an inner wall surface of the cavity and the heat dissipation section. A portion of the first conductor pattern extends beyond the heat dissipation section when viewed in a thickness direction of the wiring board.

Abstract: A shielded flat cable includes a plurality of flat conductors arranged in parallel, a pair of resin insulating layers sandwiching the flat conductors from both sides of a parallel surface of the flat conductors, and covering portions other than end portions of the flat conductors in a length direction, a pair of shield layers in contact with an outer surface of at least one resin insulating layer of the pair of resin insulating layers, and a pair of first resin films with an adhesive covering an outer surface of the pair of resin insulating layers or the shield layer. A dielectric loss tangent of the resin insulating layer, of the pair of resin insulating layers, in contact with the shield layer is 0.001 or less at 10 GHz, and the adhesive or the pair of first resin films is made of a flame retardant material.

Abstract: An electronic device includes chip components, a terminal connection body, conductive terminals, and a support member. Each of the chip components has a pair of end surfaces on which terminal electrodes are formed. The terminal connection body connects the terminal electrodes on one side of the chip components arranged next to each other in a parallel direction to the end surfaces. Each of the conductive terminals includes a connection part and a mount part. The connection part is connected with the terminal electrode of either of the chip components located on both ends of the chip components connected in series via the terminal connection body. The mount part faces the connection part and is connected with a mount board. The support member is disposed between the connection parts and the mount parts. The chip components are arranged so that the end surfaces face the mount board.

Abstract: A conductive member includes (i) a conductive pipe and (ii) a conductor that is inserted into the pipe and is brought into electro-conductive contact with an inner surface of the pipe. The pipe is provided with a stopper section that abuts against and stops the conductor and thereby regulates an insertion amount of the conductor. The conductor includes an insulation coating surrounding a conductor section, the conductor section is exposed at an end portion, and an end of the insulation coating forms a step with respect to the conductor section and creates a stopped section that abuts against and is stopped by the stopper section.

Abstract: A method for manufacturing a dual conductor laminated substrate includes providing a first laminate including a first insulating layer and a first conductive layer; defining a first trace pattern including one or more traces in the first laminate; providing a second laminate including a second insulating layer and a second conductive layer; defining a second trace pattern including one or more traces in the second laminate; defining access holes in the second insulating layer; at least one of depositing and stenciling a conductive material in the access holes of the second insulating layer; and aligning and attaching the first laminate to the second laminate to create a laminated substrate.