Abstract: A method and apparatus (10) for breaking a wafer (24) into die (26) having a high aspect ratio. In one embodiment, a multi-radii dome (12) is utilized to controllably break the wafer in two directions. The two different dome curvatures (R1, R2) provide an even, controlled, force along the kerfs in both the X-direction and the Y-direction. In another embodiment, a cylindrical dome (80) being curved (R3) in the Y-direction and flat in the X-direction is used to break a wafer into die having exceptionally high aspect ratios. The present invention reduces the likelihood of die fracture in the long dimension during the wafer break process. The wafer (24) is mounted on stretchable wafer tape (18) during the break process to prevent the die edges from contacting and rubbing with one another after the break process. The present invention allows separation of die of exceptionally large aspect ratios such as those having a 1:25 aspect ratio.