Abstract: A method for densifying one or more porous substrates with pyrolytic carbon by chemical vapour infiltration, includes admitting, at the inlet of the densification furnace, a reactive gaseous phase including at least one pyrolytic carbon precursor; reacting at least a fraction of the reactive gaseous phase with the porous substrate or substrates; extracting, at the outlet of the densification furnace, gaseous effluents originating from the reactive gaseous phase; reintroducing, with the reactive gaseous phase admitted at the inlet of the densification furnace, at least a fraction of the gaseous effluents extracted at the outlet of the furnace, wherein the fraction of the gaseous effluents introduced with the reactive gaseous phase includes at least one polyaromatic hydrocarbon compound.

Abstract: Polycrystalline silicon is produced in a chemical vapour deposition reactor, wherein, outside the reactor at at least one position on at least one reactor component, vibrations of the reactor are measured using a measurement device and optionally recorded. The vibrations may be used to identify rod fall over and other events occurring within the reactor.

Abstract: Zeolites are industrially important materials possessing high Bronsted acidity and shape-selectivity. However, their inherently small pores restrict application for catalytic conversion of bulky molecules. A method of synthesis of ‘artificial’ zeolites. The artificial zeolites have well-tailored Bronsted and Lewis acid sites prepared on mesostructured silica to circumvent this limitation. This novel approach utilizes atomic layer deposition to tailor both porosity and acid speciation, providing exquisite control over catalytic behavior and enabling systematic studies.

Abstract: A method for the production of a graphene layer structure, the method comprising providing a substrate on a heated susceptor in a reaction chamber, the chamber having a plurality of cooled inlets arranged so that, in use, the inlets are distributed across the substrate and have a constant separation from the substrate, rotating the heated susceptor at a rotation rate of at least 300 rpm, supplying a flow comprising a precursor compound through the inlets and into the reaction chamber to thereby decompose the precursor compound and form graphene on the substrate, wherein the inlets are cooled to less than 100° C., preferably 50 to 60° C., and the susceptor is heated to a temperature of at least 50° C. in excess of a decomposition temperature of the precursor, wherein the constant separation is at least 12 cm and preferably from 12 to 20 cm.

Abstract: Described herein are low temperature processed high quality silicon containing films. Also disclosed are methods of forming silicon containing films at low temperatures. In one aspect, there are provided silicon-containing film having a thickness of about 2 nm to about 200 nm and a density of about 2.2 g/cm3 or greater wherein the silicon-containing thin film is deposited by a deposition process selected from a group consisting of chemical vapor deposition (CVD), plasma enhanced chemical vapor deposition (PECVD), cyclic chemical vapor deposition (CCVD), plasma enhanced cyclic chemical vapor deposition (PECCVD, atomic layer deposition (ALD), and plasma enhanced atomic layer deposition (PEALD), and the vapor deposition is conducted at one or more temperatures ranging from about 25° C. to about 400° C. using an alkylsilane precursor selected from the group consisting of diethylsilane, triethylsilane, and combinations thereof.

Abstract: A method and system for producing graphene on a copper substrate by modified chemical vapor deposition (AP-CVD), comprising arranging two copper sheets (40) in a parallel manner and separated by a ceramic material (30, placing said two copper sheets (40) inside an open chamber consisting of a glass chamber (10), heating the two copper sheets (40) to a predetermined temperature by using an electromagnetic induction heater (20), supply a mixture of methane and argon flows to the upper face (18) of said glass cylindrical chamber (10), continually monitoring the temperature of the two copper sheets (40), heating to about 1,000° C. for a predetermined period of time using the electromagnetic induction heater (20), and cooling to room temperature under the same methane and argon flows.

Abstract: A system and method for enhancing a diffusion limited CVI/CVD process is provided. The system may densify a porous structure by flowing a reactant gas around the porous structure. A mass flow controller may be configured to pulse the flow rate of the reactant gas around the porous structure. The mass flow controller may pulse the flow rate from a nominal flow rate to a first flow rate. The mass flow controller may pulse the first flow rate back to the nominal flow rate or to a second flow rate. The mass flow controller may pulse the flow rate between the nominal flow rate, the first flow rate, and the second flow rate, as desired.

Abstract: Methods and apparatus for preparing a protective coating are described. In one example aspect, an apparatus for preparing a protective coating includes a chamber, a substrate positioned within the chamber configured to hold at least a target object, an inlet pipe configured to direct a monomer vapor into the chamber, and one or more electrodes configured to perform a chemical vapor deposition process to produce a multi-layer coating. The chemical vapor deposition process comprises multiple cycles, each cycle comprising a pretreatment phase and a coating phase to produce a layer of the multi-layer coating.

Abstract: Embodiments of the present disclosure provide for methods and systems for making structures using an electrospray system while under vacuum. In particular, embodiments of the present disclosure provide for methods and systems for ultra-fast growth of high aspect ratio nano/meso/micro-structures with three dimensional topological complexity and control of phase and composition of the structure formed.

Abstract: Described are vapor deposition methods for depositing molybdenum materials onto a substrate by the use of bis(alkyl-arene) molybdenum, also referred to herein as (alkyl-arene)2Mo, for example bis(ethyl-benzene) molybdenum ((EtBz)2Mo), as a precursor for such deposition, as well as structures that contain the deposited material.

Abstract: A simple short-time method for modifying a fluorine resin film so that hydrophilicity is not likely to deteriorate over time. The method for modifying a fluorine resin film is characterized in that the surface of the fluorine resin film is provided with hydrophilicity by bringing the fluorine resin film into contact with a process gas, which contains gas containing fluorine atoms and at least one of gas containing oxygen atoms or inert gas.

Abstract: Methods for the formation of films comprising Si, C, O and N are provided. Certain methods involve sequential exposures of a hydroxide terminated substrate surface to a silicon precursor and an alcohol-amine to form a film with hydroxide terminations. Certain methods involved sequential exposures of hydroxide terminated substrate surface to a silicon precursor and a diamine to form a film with an amine terminated surface, followed by sequential exposures to a silicon precursor and a diol to form a film with a hydroxide terminated surface.

Abstract: Provided is a chamber system for solid free form fabrication, the chamber system having a deposition chamber, a service chamber and one or more loading/unloading chambers. The chamber system allows for a more efficient and cost effective process to service the deposition apparatus, load holding substrates, and unload workpieces without requiring having to adjust the atmosphere in the deposition chamber.

Abstract: Apparatus and methods for processing a substrate including an injector unit, comprising a leading reactive gas port extending along a length of the injector unit, a trailing reactive gas port extending along the length of the injector unit, and a merge vacuum port forming a boundary around and enclosing the leading reactive gas port and the trailing reactive gas port.

Abstract: Embodiments of the present disclosure generally relate to protective coatings on various substrates including aerospace components and methods for depositing the protective coatings. In one or more embodiments, a method of forming a protective coating on an aerospace component includes forming an aluminum oxide layer on a surface of the aerospace component and depositing a boron nitride layer on or over the aluminum oxide layer during a vapor deposition process. In some examples, the method includes depositing a metal-containing catalytic layer on the aluminum oxide layer before depositing the boron nitride layer. The boron nitride layer can include hexagonal boron nitride (hBN).

Abstract: A method of infiltrating a fiber preform comprises positioning an assembly in a process chamber, where the assembly includes a tool comprising through-holes, a fiber preform constrained within the tool, and a sacrificial preform disposed between the fiber preform and the tool. The sacrificial preform is gas permeable. The process chamber is heated, and gaseous reactants are delivered into the process chamber during the heating. The gaseous reactants penetrate the through-holes of the tool and infiltrate the sacrificial preform and the fiber preform. Deposition of reaction products occurs on exposed surfaces of the fiber preform and the sacrificial preform, and a coating is formed thereon. In addition, the sacrificial preform accumulates excess coating material formed from increased reactions at short diffusion depths. Accordingly, the coating formed on the fiber preform exhibits a thickness variation of about 10% or less throughout a volume of the fiber preform.

Abstract: A component includes a substrate at least a portion of which adjacent to a surface of the substrate is made of a material including silicon; a bond coat located on the surface of the substrate and including silicon, an environmental barrier which includes an outer layer of ceramic material covering the bond coat, wherein the environmental barrier further includes a self-healing inner layer located between the bond coat and the outer layer, the inner layer including a matrix in which silico-forming particles are dispersed, these particles being capable of generating a matrix crack healing phase in the presence of oxygen.

Abstract: A system and method for depositing a coating may comprise a coating chemical reactor, surface activation component, and a deposition component. A target surface may be prepared for deposition with the surface activation component. The coating chemical reactor may comprise a coating chemical dispenser and a coating chemical verifier that prepares the coating chemical for deposition. The coating chemical verifier may utilize an optical excitation source and at least one optical detector, wherein chemical substances are identified by unique signatures composed of binary code. The coating chemical may be received by the deposition component to depositing the coating chemical on the target surface.

Abstract: The present invention relates to granular composite density enhancement, and related methods and compositions. The application where the properties are valuable include but are not limited to: 1) additive manufacturing (“3D printing”) involving metallic, ceramic, cermet, polymer, plastic, or other dry or solvent-suspended powders or gels, 2) concrete materials, 3) solid propellant materials, 4) cermet materials, 5) granular armors, 6) glass-metal and glass-plastic mixtures, and 7) ceramics comprising (or manufactured using) granular composites.

Abstract: A system and method for providing a ceramic-based separator onto an electrode is disclosed. A separator is formed on the electrode via a dry, solvent-free application of a ceramic-based separator to the electrode. An electrode is provided to an application area via a feed mechanism and a separator layer is then applied to the electrode that is comprised of a binder including at least one of a thermoplastic material and a thermoset material and an electrically non-conductive separator material, with the separator layer being applied to the electrode via a dry dispersion application.