Patents Examined by John T. Haran
  • Patent number: 7150895
    Abstract: A perpendicular magnetic recording medium has a magnetic recording layer with ferromagnetic crystalline grains and nonmagnetic and nonmetallic grain boundary region surrounding the grains. The surface of its underlayer, before forming the magnetic recording layer, is exposed to an O2 or N2 atmosphere or an atmosphere of rare gas and O2 or N2, to attach the O2 or N2 as nucleation sites for promoting growth of the nonmagnetic and nonmetallic region. By forming the magnetic recording layer thereafter, both ferromagnetic crystalline grains and the nonmagnetic and nonmetallic grain boundary region are formed from the initial stage of the growth of the magnetic recording layer. Thus, a magnetic recording layer having excellent segregation structure can be formed.
    Type: Grant
    Filed: March 17, 2003
    Date of Patent: December 19, 2006
    Assignee: Fuji Electric Co., Ltd.
    Inventors: Sadayuki Watanabe, Yasushi Sakai
  • Patent number: 7037392
    Abstract: The invention relates to a process for manufacturing a conductor bar comprising a number of partial conductors, with the following steps: A: manufacturing the partial conductors, B: applying at least one insulating layer to the partial conductors, in each case with the following substeps: B1: coating the regions to be insulated of the partial conductor with a plastics powder, B2: sintering this powder layer by melting the plastic and at least partially curing the plastic to form an insulating layer, the sintering being carried out in such a way that at least one outer insulating layer is not completely cured, C: assembling a number of insulated partial conductors to form a conductor bar, D: sintering the insulating layers of the partial conductors while simultaneously pressing the partial conductors against one another in the assembled conductor bar, the plastic in the case of the not completely cured insulating layers at least partially melting and being squeezed out between the partial conductors, and the
    Type: Grant
    Filed: March 15, 2002
    Date of Patent: May 2, 2006
    Assignee: ALSTOM Technology LTD
    Inventors: Thomas Baumann, Thomas Klamt, Hans-Christoph Nienburg
  • Patent number: 7022199
    Abstract: A method for fabricating an LCD includes the steps of loading a first substrate having liquid crystal dropped thereon and a second substrate having sealant coated thereon on a bonding chamber, aligning the first and second substrates, bonding the first and second substrates with a varied pressure applied thereto, and unloading the bonded first and second substrates.
    Type: Grant
    Filed: June 28, 2002
    Date of Patent: April 4, 2006
    Assignee: LG.Philips LCD Co., Ltd.
    Inventors: Sang Seok Lee, Sang Ho Park
  • Patent number: 7008502
    Abstract: In order to reduce cycle times for assembling at least two substrates (3,4) in order to form an optical data carrier in a low-pressure chamber (8), a method and a device are disclosed wherein an opening (11) of the low-pressure chamber is sealed in relation to the surrounding environment, the low-pressure chamber is pumped out, a transfer chamber (64) is formed between a first handling device (16) arranged in the low-pressure chamber and a second handling device (24) arranged outside the low-pressure chamber by respectively sealing the opening (11) of the low-pressure chamber (8).
    Type: Grant
    Filed: December 13, 2001
    Date of Patent: March 7, 2006
    Assignee: STEAG HamaTech AG
    Inventors: Ulrich Speer, Roland Wagner, Stephan Leonhardt
  • Patent number: 7008493
    Abstract: A method is described for applying an integrated circuit to a carrier element. In which a curable compensating layer of initially paste-like consistency is coated substantially with full coverage onto a lower contact area of the integrated circuit. Whereupon the integrated circuit is joined together, by the compensating layer, with the carrier element after a relative alignment in order then to produce an electrical connection between the integrated circuit and conductor tracks of the carrier element via electrical lines surmounting the thickness of the compensating layer. Whereupon the compensating layer is cured resulting in an increased volume of the compensating layer.
    Type: Grant
    Filed: October 14, 2003
    Date of Patent: March 7, 2006
    Assignee: Infineon Technologies AG
    Inventors: Johann Winderl, Christian Hauser, Martin Reiss
  • Patent number: 7005029
    Abstract: A method of making a multi-well test plate including an upper frame portion and a glass panel secured to a lower side of the upper frame portion with a layer of light-curable adhesive. The upper frame portion includes a plurality of walls defining adjacent wells for receiving assay samples. The adhesive has various properties, such as high viscosity, thixotropicity, transparency, water insolubility, non-autofluorescence, and non-toxicity, as well as others that are advantageous when constructing and using the multi-well test plate. The adhesive is preferably applied by a screen transfer process that takes advantage of the adhesive properties.
    Type: Grant
    Filed: July 29, 2003
    Date of Patent: February 28, 2006
    Assignee: Nalge Nunc International Corporation
    Inventors: Abdul Wahid Khan, Wendy Kay Scholz, Erika Lynn Tracy, Margaret Maria Kelly
  • Patent number: 7005033
    Abstract: The present invention relates to an apparatus and method for laminating a dry film using a microwave which are capable of quickly transforming a photosensitive substance of a dry film to a semi-liquid state by vibrating a water or acryl group copolymer molecular in a dry film for thereby implementing a laminating operation. The apparatus for laminating a dry film includes a microwave oscillating apparatus which includes an interior surrounded by a reflection film, for thereby heat-oscillating a water and acryl group copolymer molecular in a dry film, a caterpillar belt clean apparatus for removing foreign substances formed after pressurizing the film heated by the oscillating apparatus, a frame for performing a laminating work with respect to the substrate fed by the feeding apparatus, and a discharging apparatus for discharging the PCB photosensitive-processed by the microwave oscillating apparatus.
    Type: Grant
    Filed: May 22, 2002
    Date of Patent: February 28, 2006
    Inventor: Kang Lee
  • Patent number: 7005025
    Abstract: A welded item is shown having an extruded weld bead with a high tensile strength relative to the layers from which it is formed. A valve with an insert is shown. A ball with an internal plenum is shown.
    Type: Grant
    Filed: June 20, 2003
    Date of Patent: February 28, 2006
    Assignee: TBDC, LLC
    Inventor: Wade Summers
  • Patent number: 7001474
    Abstract: A method for manufacturing an optical disc and a method for transporting a multi-layered optical disc are provided. When adhering the sheet and the disc substrate, after the adhesive is supplied to the outer side of the groove on the disc substrate, the sheet is loaded on the disc substrate. The adhesive is pressed to extend to the groove. At this timer, because the surplus adhesive is blocked when flowing into the groove, the surplus adhesive does not overflow easily toward the inner side of the groove. In addition, even if the adhesive overflows toward the inner side of the groove the adhesive is kept between the non-adhered portion of the sheet and the disc substrate, preventing the adhesive from moving to the disc surface. The non-adhered portion is cut by the cutting blade after the adhesive is completely cured, and then removed from the disc substrate.
    Type: Grant
    Filed: June 7, 2002
    Date of Patent: February 21, 2006
    Assignee: Fuji Photo Film Co., Ltd.
    Inventors: Kazutoshi Katayama, Yoshihisa Usami
  • Patent number: 6998000
    Abstract: A method of adhesion inhibiting generation of bubbles is provided. Heating, evacuation and centrifugal degassing are performed on an adhesive 37 disposed in an adhesive container 30 to semi-harden the adhesive 37, then a semi-hardened adhesive is discharged as disposed in the adhesive container 30 to mount a chip. Removal of bubbles is efficiently performed since semi-hardening and degassing are simultaneously performed. Further, no defective product is produced even if a working process is stopped since no process for semi-hardening a discharged adhesive exists.
    Type: Grant
    Filed: February 21, 2003
    Date of Patent: February 14, 2006
    Assignees: Sony Corporation, Sony Chemicals
    Inventor: Satoshi Yamamoto
  • Patent number: 6996957
    Abstract: An induction device for heat-shrinking a heat-shrinking film onto a product comprising induction means for causing the heat-shrinking plastic layer of the heat-shrinking film to heat-shrink onto the product, and supply and control means for the induction means connected to the induction means, where the induction means comprises at least one induction ring within which the product passes while the heat-shrinking film heat-shrinks onto the product.
    Type: Grant
    Filed: October 3, 2001
    Date of Patent: February 14, 2006
    Assignee: Minipack-Torre S.p.A.
    Inventor: Torre Francesco
  • Patent number: 6998007
    Abstract: Disclosed is an intercrosslinked multilayer polymeric article having at least one thermoplastic polymer layer intercrosslinked by UV radiation at the interface with a core layer of a crosslinkable polymer. The selection of the thermoplastic polymer and the crosslinkable polymer is such that a coextruded composite product of these materials has poor interlayer adhesion prior to radiation treatment. However, the interfacial intercrosslinking provides superior bonding between the layers. The same UV radiation for intercrosslinking typically can also cure the crosslinkable polymer to give the multilayer article excellent structural integrity. Also disclosed is a method for preparing an intercrosslinked multilayer polymeric article.
    Type: Grant
    Filed: September 16, 2003
    Date of Patent: February 14, 2006
    Assignee: Saint-Gobain Performance Plastics Corporation
    Inventors: Alexander Tukachinsky, Michael L. Friedman, Paul W. Ortiz
  • Patent number: 6998008
    Abstract: An apparatus for a laser transmission welding process for attaching a synthetic filter material to a filter tower frame in an ink jet printer cartridge. The apparatus includes a laser beam source and a filter clamping fixture containing a base, slide rods attached on first ends thereof to the base, an optics support plate attached to second ends of the slide rods, a movable platform for holding an ink cartridge slidably disposed on the slide rods between the base and the optics support plate, a platform moving device for translating the platform to and from a laser welding position, a laser beam transparent plate suspended by support legs from the optics support plate to a position between the movable platform and the optics support plate. The apparatus greatly improves synthetic filter attachment to a filter tower frame in an ink cartridge.
    Type: Grant
    Filed: July 15, 2003
    Date of Patent: February 14, 2006
    Assignee: Lexmark International, Inc.
    Inventors: Kin Ming Kwan, David T. Shadwick, Jeanne M. Saldanha, Paul T. Spivey, Jon B. Whitney, Julie A. Gordon Whitney
  • Patent number: 6997999
    Abstract: The present invention is a corrosion-protected cable, a method of making a corrosion-inhibiting cable, and a corrosion-inhibiting composition. The corrosion-inhibiting composition includes a water-insoluble corrosion-inhibiting compound dispersed in an oil, and a stabilizer selected from the group consisting of propylene based glycol ethers, propylene based glycol ether acetates, ethylene based glycol ethers and ethylene based glycol ether acetates. The corrosion-inhibiting composition is preferably applied to the outer conductor of the coaxial cable, e.g., by wiping or by immersion, and heated to provide a corrosion-inhibiting coating that is not tacky or greasy.
    Type: Grant
    Filed: July 9, 2003
    Date of Patent: February 14, 2006
    Assignee: CommScope Properties LLC
    Inventors: Eddy Houston, Benedict Maresca
  • Patent number: 6994892
    Abstract: A method of manufacturing an optical information recording medium is provided with the steps of: immersing a substrate having guide grooves formed on both surfaces thereof into a recording-layer forming solution; raising the substrate from the recording-layer forming solution; and drying the substrate thus raised to form recording layers on both of the surfaces of the substrate.
    Type: Grant
    Filed: February 27, 2003
    Date of Patent: February 7, 2006
    Assignee: Fuji Photo Film Co., Ltd.
    Inventors: Kazutoshi Katayama, Hiroshi Kubo
  • Patent number: 6991699
    Abstract: A bonding machine for fabricating an liquid crystal display (LCD) panel to which a liquid crystal dropping method been performed includes a bonding chamber of a one pieced body for carrying out bonding of substrates, at least two or more than two air extraction tubes in communication with an interior space of the bonding chamber, and at least two vacuum means respectively connected to the air extraction tubes each for generating an air suction power to evacuate the bonding chamber. A method for fabricating an LCD panel by using the bonding machine includes loading a first substrate onto which liquid crystal has been dropped and a second substrate having sealant coated thereon into a bonding chamber, evacuating the bonding chamber, bonding the first and second substrates, applying varying bonding pressure, and unloading the bonded first and second substrates.
    Type: Grant
    Filed: June 28, 2002
    Date of Patent: January 31, 2006
    Assignee: LG.Philips LCD Co., Ltd.
    Inventors: Sang Seok Lee, Sang Ho Park
  • Patent number: 6991703
    Abstract: A bonding method is provided in which an electronic component is connected via bumps to a substrate and the electronic component is packaged on the substrate. A surface of the substrate that packages the electronic component, a surface of the electronic component that is connected to the substrate, and a surface of the bumps undergo plasma processing. Subsequently, the bumps are heated to a temperature lower than a melting point of the bumps, and the substrate and the electronic component are compression bonded via the bumps.
    Type: Grant
    Filed: September 22, 2003
    Date of Patent: January 31, 2006
    Assignee: Sumitomo Osaka Cement Co., Ltd.
    Inventors: Takeshi Ootsuka, Mamoru Kosakai
  • Patent number: 6991698
    Abstract: A method of making beams, clamps and other structures by curing a polymer containing a magnetostrictive material. A magnetostrictive material like TERFENOL-Dâ„¢ is placed in a polymer. This mixture is put onto a slide in a film. The mixture is cured by UV light (or other means) so that it cross-links. A second layer of polymer with no magnetostrictive material can be cured on top of the first layer. This leads to a beam structure which exhibits a bending moment in an applied magnetic field. By aligning the magnetostrictive particles before curing with a magnetic field, a beam or other structure can be produced with aligned particles. A mask can be used to selectively cure regions where the magnetostrictive particles have different alignments on the same layer. It is possible to build up multiple layer structures with layers of magnetostrictive particles aligned in different directions.
    Type: Grant
    Filed: October 22, 2003
    Date of Patent: January 31, 2006
    Assignees: Scientific Products & Systems, University of Maryland UMBC
    Inventors: Muniswamappa Anjanappa, David T. Bach
  • Patent number: 6989070
    Abstract: To weld a filter made of a laser beam-transmittable fiber material to a case made of a laser beam-nontransmittable resin material by a laser beam the filter is first placed on the case; subsequently, the filter is pressurized by a jig to increase the fiber density of a welding portion; and then the welding portion is irradiated by the laser beam. In the step of increasing the fiber density, a periphery of the welding portion is pressurized by the jig to increase the fiber density of the filter in a larger area than the welding portion. Accordingly, the laser beam transmitting through the filter melts a part of the case, and the melted resin material permeates through gaps between the fibers constituting the filter, thereby welding the welding portion to the case.
    Type: Grant
    Filed: April 11, 2003
    Date of Patent: January 24, 2006
    Assignees: Aisan Kogyo Kabushiki Kaisha, Toyota Jidosha Kabushiki Kaisha
    Inventors: Tomohiro Sakai, Masami Hirata, Kanehiro Fukaya, Hideo Nakamura
  • Patent number: 6984286
    Abstract: An electronic structure, and associated method of fabrication, for coupling a heat spreader above a chip to a chip carrier below the chip. Initially provided is a substrate, a chip on a surface of the substrate and coupled to the substrate, and the heat spreader. Then a fillet of at least one adhesive material is formed on the chip and around a periphery of the chip. Additionally, the heat spreader is placed on a portion of the fillet and over a top surface of the chip. The fillet couples the heat spreader to the substrate. An outer surface of the fillet makes a contact angle of about 25 degrees with the surface of the substrate. The small contact angle not exceeding about 25 degrees prevents cracking of the substrate that would otherwise result from thermal cycling.
    Type: Grant
    Filed: January 8, 2003
    Date of Patent: January 10, 2006
    Assignee: International Business Machines Corporation
    Inventors: Barry A. Bonitz, Eric Duchesne, Michael A. Gaynes, Eric A. Johnson