Abstract: A process for crosslinking a coating of pressure-sensitive adhesive systems on a backing material, characterized in that the pressure-sensitive adhesive system present on the backing material is irradiated with accelerated electrons by means of an irradiation means, the backing material coated with the pressure-sensitive adhesive system to be irradiated runs via a roller, there is a contact medium between the roller and the backing material during irradiation.

Abstract: Valves and methods for manufacturing the valves are disclosed. The valves are formed from a plurality of flexible polymer layers. A radio frequency bonding process, or the like, is utilized to form welds between the various layers. In general, a sub-assembly is formed that includes a valve layer bonded to a substrate layer. The sub-assembly is bonded to a second element such that a channel is formed between the valve layer and the second element. The channel includes an inlet, an outlet, and a pair of weld beads located in the inlet that place the inlet in an open configuration.

Abstract: The present invention relates to a reinforced, pressure-resistant flexible tube for mechanical end-winding support for rotating electrical machines. The flexible tube according to the invention in this case comprises a glass fiber bundle which is encased by an inner glass cloth flexible tube. This glass cloth flexible tube is in turn externally coated with a polymer layer and is for its part surrounded by an outer glass cloth flexible tube. A matrix polymer is introduced into the inner glass cloth flexible tube and, after it has cured, the reinforced, pressure-resistant flexible tube can carry out its supporting and spacing function fully.

Abstract: Transparent parallel planar plates which are members for retaining an optical waveguide are provided erectly in an optical path of light in a transparent vessel in advance. An optical fiber is fixed into the transparent vessel while the optical fiber penetrates the transparent vessel, and an optical sensor is also disposed adjustably. Next, a first photo-curable resin solution is injected into the transparent vessel, and light with a predetermined wavelength for curing is emitted from the optical fiber so that the optical waveguide is self-formed by polymerization reaction. Because the parallel planar plates are transparent, the optical waveguide is formed so as to be extended again from the emission ports of the parallel planar plates. Finally, the optical waveguide is formed so as to reach a bottom surface of the transparent vessel.

Abstract: Paper webs are wound up or supplied to units of a rotary printing press, such as a longitudinal fold former. Flexible endless or open ended traction devices are used. Paper webs are secured to the traction devices in a positive manner. The paper webs or their starting ends can be secured together only for purposes of being fed through the longitudinal fold former.

Abstract: The present invention provides an information carrier which has flat surfaces, is excellent in beautiful appearance and permits beautiful necessary printing, and a production process which permits easy and inexpensive production of such an information carrier. An IC chip 1 and a coil 2 connected to the IC chip are embedded in a substrate 3 composed of a nonwoven fabric. The IC chip and the coil are held between two nonwoven fabrics produced according to a conventional production procedure. The laminate of the nonwoven fabrics is fed to a roller or a press and the two nonwoven fabrics are hot-pressed, whereby their mating surfaces are joined with or without an adhesive (including low-melting synthetic resin fiber) incorporated into the webs. After positioning of the coil in the thus obtained raw product of information carrier, the laminate of the nonwoven fabrics and cover sheets is cut to obtain an information carrier of predetermined shape and size.

Abstract: A chip is bonded on a circuit board by aligning in position bumps with board electrodes with interposition of an anisotropic conductive layer between the chip and the circuit board. The anisotropic conductive layer is a mixture of an insulating resin, conductive particles and an inorganic filler. The chip is pressed against the board with a pressure force of not smaller than 20 gf per bump by virtue of a tool, while warp of the chip and the board is corrected, the bumps are compressed, and the insulating resin is hardened.

Abstract: A method involves sheathing a superconductor with a thermoplastic insulation material on all sides. The conductor exits a guide channel that extends in the propulsion direction. A melt hose is extruded from the molten insulation material in the propulsion direction and through a nozzle that has an outlet which embraces the conductor, whereby a distance is kept on all sides. The melt hose is stretched via the propulsion of the conductor. The hose is drawn to the surface of the conductor and is compacted by cooling. The method can especially be used for sheathing band-shaped high-Tc-superconductors. Materials having processing temperatures between 200° C. and 450° C., are selected as thermoplastic insulation materials.

Abstract: The present invention is directed to a photocurable composition for use as an encapsulant, for underfill or attachment adhesives, capable of curing at wavelengths greater than 290 nm. Reaction products of these photocurable compositions have a low level of extractable halide ion, such as less than 100 ppm. In use, the photocurable composition may be applied, for instance, over the wire bonds that electrically connect a semiconductor device to a substrate to maintain a fixed positional relationship and protect the integrity of the electrical connection from vibrational and shock disturbances, as well as from interference from environmental contaminants.

Abstract: A multi-layered endless belt having an arbitrary layer thickness by the thickness of the film and the winding number, a medium conveying belt using the same, and a method and apparatus by which these can be stably produced without various residues in the production process and can be produced with a high general-purpose properties and at a low cost. There are provided a multi-layered endless belt made by winding and heat-welding a polymer material film and a production method thereof, and further a production method of medium conveying belts of various forms fundamentally having a construction in which an electrode pattern and a protective film are laminated thereon, and a novel production method and molding apparatus for molding the multi-layered endless belt by heat-pressing a wound tubular body.

Abstract: A laser strikes and aseptically heats or sterilizes the end of two flexible tube ends for connection. Tube holders are pushed toward each other to bring the tube ends into contact. A weld detector checks the characteristics of the weld. A laser optics assembly may be used to change the direction of the laser and focus the laser at the tube ends. In addition, a crimping device is used to compress a single flexible tube for disconnection. The laser strikes the compressed area. The crimping device continues to pinch the area and forms a seal in the tube. The tube is separated into two tube segments, each segment has a sealed end.

Abstract: A dummy member is covered with a sheet member in a manner to keep one side of the sheet member in contact with the dummy member retaining a plurality of permanent magnets in a manner that any pair of adjoining magnets are opposite in polarity. A plurality of permanent magnets are supplied to the other side of the sheet member conforming to the dummy member so as to be magnetically attracted by the permanent magnets of the dummy member whereby the therapeutic permanent magnets are positioned at predetermined places on the other side of the sheet member. Subsequently, the therapeutic permanent magnets arranged on the other side of the sheet member are fixed to the sheet member.

Abstract: Photon welding devices of this invention comprise a non-coherent photon source, and a light pipe coupled to the photon source at one end. A thin mask is positioned at another end of the light pipe that defines a weld location for photon delivery. A work piece to be bonded by the device comprises a top layer of transparent plastic and a base layer of absorbing plastic. The thin mask is in the form of a reflective coating positioned on the end of the light pipe over all surfaces that are not in contact with the work piece. A device includes a member that imposes a controlled, compressive force to the work piece while it is being welded and during a short time thereafter. The device also includes a member that maintains a desired alignment of the light pipe, top layer of the work piece, and base layer of the work piece during the bonding cycle.

Abstract: A belt seam treatment apparatus includes a support element with a smooth surface that supports the seam region of the belt, a heat source that heats a treatment strip and the belt seam region, and a pressure applicator that forces the treatment strip against the belt seam region. The support element can be a tube over which the belt hangs and can include a vacuum belt hold system that secures the seam region against the tube during treatment. The heat source can be an infrared laser or an infrared lamp. Optics form a heat spot or a heat line on the strip and seam region, and a pressure wheel traverses the seam region after heating to compress the strip and seam and bond a thermoplastic polymer of the strip to the seam region of the belt.

Abstract: There is disclosed a method of embedding an optical fiber in the miltilayer printed circuit board without causing chemical or thermal damage to the optical fiber, in which a groove is formed on a substrate consisting of a dielectric substrate layer having a conductive layer formed on one side thereof, for example by a router bit process, the optical fiber is embedded in the groove using an adhesive liquid to give a optical substrate, and then at least one printed circuit board is laminated on and under the single optical substrate or the layered structure of two or more of the optical substrate.

Abstract: A method of manufacturing a device includes activating a gas containing at least one of hydrogen and of nitrogen by a hollow cathode discharge and exposing a first surface of a first material to the activated gas, thereby generating at the first surface an enrichment of at least one of hydrogen and of nitrogen and applying a further treatment to the enriched surface.

Abstract: A three part laminated material for use in making blister packages and a method of making such a material. The material is comprised of a central core layer of poly chloro-tri-fluoro ethylene to each side of which a separate polymer film is adhesively attached. The method of making the material involves use of a corona treater, a vertical forced air convection dryer, a horizontal convection dryer, a motor driven rewind, a chilled cylinder, a primary unwind and at least one laminating unwind. In the preferred embodiment, each of the polymer films is polyvinyl chloride, although a variety of different films may be used. The disclosed material provides a high moisture barrier, a stable inter-laminar structure and outer surfaces which lend themselves well to bonding with other materials.

Abstract: A manufacturing method for a resin formed element capable of exhibiting an advanced design quality while reducing the manufacturing cost is provided. The method comprises the steps of printing a pattern on a reverse side of a thermoplastic film to form a printed pattern layer, printing and curing an ultraviolet curable or thermosetting resin in part of the surface of the thermoplastic film to form an ultraviolet cured or thermoset resin layer, burying this ultraviolet cured or thermoset resin layer in the thermoplastic film, and forming a resin base material from the printed pattern layer side of the laminated element to adhere and integrate, so as to produce a difference in distance from the surface between the region corresponding to the ultraviolet cured or thermoset resin layer of the printed pattern layer and other region, and finally peeling the ultraviolet cured or thermoset resin layer from the thermoplastic film.

Abstract: Curved surfaces of a preform of thermoplastic adhesive provide improved regulation of heating and exclusion of gas as surfaces to be bonded are heated and pressed against the thermoplastic adhesive preform. Particulate or filamentary materials can be added to the thermoplastic adhesive for adjustment of coefficient of thermal expansion or further increase of heat transfer through the adhesive or both. The preform is preferably fabricated by molding, preferably in combination with die-cutting of a preform of desired volume from a web of approximately the same thickness as the completed bond.

Abstract: A method and system of cleaning to remove cutting dust and the like generated and adhering to a board material (1a) during drilling for electrical connection, and drying the board material, in a process of manufacturing a circuit board for small electronic equipment and the like. A large amount of board materials can be treated without receiving thermal damage by performing the steps of: placing sheets of the board material that have absorbed moisture resulting from cleaning, like a stack in a vacuum chamber (11); and drying the board material by repeating evacuation and pressurization under predetermined conditions while heating the board material.