Abstract: A method and resulting electronic package in which a heat sink is secured to the package's dielectric material (e.g., overmold). The surface of the dielectric is roughened (e.g., using an abrasive paper or pad) to enhance the subsequent dielectric-heat sink bond in which an adhesive is used. The dielectric material's roughened external surface(s), typically containing silicone material (e.g., silicone residue) which is an inherent by-product of many dielectric materials of the type used in such packaging, is (are) able to still be securely attached to the heat sink, despite the presence of said silicone. In another embodiment, the roughened surface enhances the marking of dielectric material of this type (e.g., using ink).

Abstract: A method and apparatus for application of adhesive tape to semiconductor devices are disclosed. A first adhesively coated tape material length is supplied to a first die associated with a cutting and application mechanism. A second length of adhesively coated tape material is also provided to a second die of the cutting and application mechanism. A plurality of LOC leadframes is supplied sequentially through the application structure to apply a first decal cut from the first tape material to a first die site at a first location and to apply a second decal cut from the second tape material to a second die site at a second location.

Abstract: A curable adhesive composition, comprising an epoxy terminated silane is provided. A thin profile battery and a substrate to which the thin profile battery is to be conductively connected are also provided. The adhesive composition is interposed between the battery and the substrate, and cured into an electrically conductive bond between the battery and the substrate. In another aspect, a curable epoxy composition is interposed between first and second electrically conductive components. The epoxy has an effective metal surface wetting concentration of silane to form a cured electrical interconnection having a resistance through said electrical components of less than or equal to about 0.3 ohm-cm2. In another aspect, a battery powerable apparatus, i.e. an Rf communication device, includes a conductive adhesive mass comprising an epoxy terminated silane.

Abstract: Techniques are given for determining the data transmission or sending rates in a router or switch of two or more input queues in one or more input ports sharing an output port, which may optionally include an output queue. The output port receives desired or requested data from each input queue sharing the output port. The output port analyzes this data and sends feedback to each input port so that, if needed, the input port can adjust its transmission or sending rate.

Abstract: A curable adhesive composition is provided which comprises an epoxy terminated silane. A thin profile battery and a substrate to which the thin profile battery is to be conductively connected are also provided. The curable adhesive composition is interposed between the thin profile battery and the substrate. It is cured into an electrically conductive bond electrically interconnecting the battery and the substrate. In another aspect, the invention includes a method of conductively interconnecting electronic components using a curable adhesive composition which comprises an epoxy terminated silane. The invention in another aspect includes interposing a curable epoxy composition between first and second electrically conductive components to be electrically interconnected. At least one of the components comprises a metal surface with which the curable epoxy is to electrically connect. The epoxy is cured into an electrically conductive bond electrically interconnecting the first and second components.

Abstract: A method and system of manufacturing an air bag cover assembly utilizing infrared radiation is disclosed. The assembly includes a front panel, a back plate, a switch and infrared-absorbing material. Initially, the front panel and the back plate are positioned so that inner surfaces of the front panel and the back plate define a switch pocket therebetween. Then the switch is positioned in the switch pocket. Thereafter, infrared radiation is directed at the infrared-absorbing material for a time sufficient to heat the infrared-absorbing material to a desired temperature. The amount of heat applied to the infrared-absorbing material by the infrared radiation is controlled by a controller. Finally, the heated material cools to fixedly secures the back plate to the front panel. The heated material may be forced to flow prior to cooling.

Abstract: The present invention is directed to an inter-laminar adhesive composition containing a liquid epoxy resin, a polyfunctional epoxy resin having a softening point higher than a lamination temperature of the adhesive and with two or more epoxy groups within the molecule; and a latent epoxy curing agent initiating a reaction at a temperature higher than the lamination temperature. The adhesive composition optionally contains a liquid resin other than the liquid epoxy resin and/or an organic solvent and the liquid resin includes the liquid epoxy resin, the organic solvent or both constituting from 10 to 55% by weight of the composition. This inter-laminar adhesive composition allows for the preparation of a multi-layer printed wiring board. The process for preparing the multi-layer printed wiring board is provided.

Abstract: In the process described, the surfaces of plastics are provided with electrical conductor tracks with the aid of laser beams. The process permits the production of moldings made from plastic with integrated conductor tracks which are less expensive and can be produced using simple apparatus. The products of the process may be used in the electrical and electronics industries, for example.

Abstract: The invention is a process for bonding glass to a substrate without the need to prime the surface of the substrate. The process comprises, first, treating the surface of the substrate with air plasma, applying to the surface of the substrate or to the surface of the glass an adhesive capable of bonding to the treated substrate and glass, and contacting the glass and the substrate with the adhesive disposed between the substrate and the glass, and allowing the adhesive to cure. Preferably the substrate is coated with a coating. Preferred adhesives are polyurethane or silane functional elastomeric adhesives. The process of the invention allows bonding of glass to a substrate without the need to use a primer on the substrate prior to application of the adhesive. The process is especially effective in facilitating the bonding of glass to coated substrates, especially substrates coated with acid resistant coatings such as PPG's carbamate coating or DuPont's Gen III, IV and VI coatings.

Abstract: A method for joining large area semiconductor substrates, a liquid thermoset polymer. Two large area substrates, such as wafers or circuit boards (e.g., rigid or flexible), can be joined together by dispensing a liquid polymer inwardly from the edges of the semiconductor substrates. The substrates can then be pressed together so that the liquid thermoset flows in an outwardly direction ward the edges of the semiconductor substrates. Conducting surfaces on the first and second substrates may contact each other after pressing the liquid thermoset polymer. The liquid thermoset polymer in the formed structure may then be cured to a hardened state. The liquid thermoset polymer preferable has a low viscosity, low levels of ionic contaminants, good adhesion to the substrates, low moisture absorbing properties and favorable thermal expansion properties.

Abstract: A method and apparatus for continuously seaming cured EPDM membrane to form a composite sheet of predetermined width and indefinite length. The method includes the steps of providing at least two rolls of cured EPDM membrane having longitudinal marginal edges and feeding the cured EPDM membrane from the at least two rolls in a first direction. The longitudinal marginal edges of the cured EPDM membranes are positioned in an overlapping relationship as the cured EPDM membranes are fed in the first direction and then the overlapping longitudinal marginal edges are continuously seamed to form a composite sheet of indefinite length.

Abstract: In a film with metal foil of the present invention, a metal foil is stuck to the surface of a resin film via an adhesive layer. The adhesive is formed by crosslinking an acrylic polymer obtained by the copolymerization of a (meth)acrylic acid ester with a carboxyl group-containing radically polymerizable monomer, with a polyfunctional compound having a functional group reactive with the carboxyl group. The film with metal foil is very useful for producing a multi-layer wiring board by the so-called transfer method. By using this film, there can be produced a multi-layer wiring board having a fine and highly dense wiring/circuit layer and having a very excellently flat surface.

Abstract: A method and article for producing a high transition temperature superconducting tape or wire with a normal metal sheath and at least two surface layers, an inner electrically insulating layer and an outer low friction layer. The method includes mechanical deformation and a plurality of annealing steps, and the application of at least one surface layer after the final annealing step. The coating materials are selected based on their electrical insulation and friction, as well as their compatibility with cryogenic conditions and coating methods.

Abstract: This invention relates to a labeling system for continuously applying a layer of a UV curable adhesive to plastic, sheet fed, cut and stack, labels, irradiating the adhesive on the labels to render the adhesive sufficiently tacky to effectively adhere the labels to containers in a commercial labeling machine and thereafter applying the labels to discrete containers through the sufficiently tacky adhesive layer. The plastic labels can be clear, opaque (including metallized) plastic films and can be retained in a dispensing magazine prior to the application of the UV curable adhesive to the labels.

Abstract: In a system for laser welding upper and lower work pieces along a weld interface, the upper work piece being transparent to laser light and having a non-uniformly thick dimension, compensation plates and compliant members are taught that mate or otherwise contact the upper work piece such that a combined thickness of the upper work piece and the compensation plate or compliant member is substantially uniform in a region at least above the weld interface. In this manner, substantially consistent amounts of laser light reach the weld interface. The upper work piece may include positive projections, negative voids, contoured profiles, surface imperfections or other that cause the non-uniformity. In one embodiment, the compensation plate is fashioned together with a compliant member. In another embodiment, the upper and lower work pieces comprise inkjet printhead lids and bodies, respectively.

Abstract: The invention relates to the use of adhesive systems which are radically polymerizable and contain 1-30 wt.-% of a reactive solvent with a pKS value less than or equal to that of acetone and are used for the attachment of materials which are only or also cationically polymerizable to hard tissue containing water. The adhesive systems contain at least one component i) which is capable of starting a radical reaction and one component ii) which contains radically polymerizable monomers which are acid-functional or contain groups which can form acids and optionally customary additives.

Abstract: The use of free-radically polymerized, UV-crosslinkable polymers which consist to the extent of at least 50% by weight of C2 to C18alkyl(meth)acrylates as adhesives for the bonding of carriers coated with the polymer on substrates, wherein from 0.1 to 30% by weight of the monomers of which said polymer is composed are monomers A without carboxylic acid or carboxylic anhydride groups and with a water solubility of more than 5 g of monomers per liter of water and said substrates are moist substrates, especially refrigerated substrates.

Abstract: A high quality optical disc with extremely tiny bubbles or bubble less present in both disc-shaped substrates when they are laminated by means of an adhesive sheet in a operation process. The method includes bonding the adhesive agent to the surface of the lower disc-shaped substrate placing the upper disc-shaped substrate on the adhesive applied to lower disc-shaped substrate, pressurizing the upper disc-shaped substrate against the lower disc-shaped substrate by means of the pressing body, and exposing both the disk-shaped substrates to a high-pressure atmosphere. In a next operation process in which both the disc-shaped substrates are left to the inside of a high pressure atmosphere, firstly pressing body is permitted to press against the disc-shaped substrates to so enlarge or magnify the contact portion from the center side to the outside to render high-pressure atmospheric.

Abstract: An optical recording head is provided which includes a slider body having a leading edge. A void is formed in the slider body to receive a sphere of optically transparent material. The sphere is inserted into the void such that a portion of the sphere protrudes from the slider body. The protruding portion is lapped to be coplanar with a surface of the slider body to form a near-field lens. A mesa may be formed onto the lapped portion and may include a coil. The slider body, mesa, near-field lens, and coil may be formed in one batch process.

Abstract: A process for surface pretreatment, including providing a clean metal surface which is aluminum or an aluminum alloy; applying a composition including an organosilane to the clean metal surface to form a coated surface; and exposing the coated surface to a laser which produces an elevated temperature on the coated surface.