Abstract: Pressure roller and heating element combination for a welding apparatus and a method designed to weld a first thermoplastic sheet laid on the deck of a roof structure and secured to the deck by a line of fastening means, and an overlapping second thermoplastic sheet disposed over the line of the fastening means. The pressure roller includes a distal end, a proximal end, and a center portion which defines a groove. The groove is provided with an elastomeric cushion to smoothly ride over the line of fastening means and expel air from between welds produced on both sides of the fastening means when the apparatus is advanced in tandem with a heating element longitudinally along the overlapping portions of the thermoplastic sheets.

Abstract: The present invention is directed to a method for the lamination of metals, and especially copper, to the surface of polyimides and derivatives of polyimides at temperatures substantially below the curing temperature of the imide polymers. More specifically, the invention is directed to a method for surface modification of polyimides and derivatives of polyimides by thermal graft copolymerization and interfacial polymerization with concurrent lamination of the metal of interest in the presence of an appropriate functional monomer. The process can be carried out under atmospheric conditions and either in the presence or the complete absence of an added polymerization initiator. The so laminated polyimide-metal interfaces exhibit T-peel adhesion strengths in excess of 16 N/cm. The adhesion strength also exceeds the fracture strength of polyimide films with a thickness of 75 &mgr;m.

Abstract: A vacuum-assisted tape applicator includes means for transporting the tape toward the object; means for applying the tape onto adjacent first and second sides of the object; and means for cutting the tape to form a tag. The means for applying includes means for contacting the tape to the first side of the object with the longitudinal centerline of the tape substantially perpendicular to the common edge; means for contacting the tape to the second side of the object with the longitudinal centerline of the tape substantially parallel to the direction of object travel; and means for wiping the tape from the longitudinal centerline toward the transverse edges to minimize bubbles under the tape and wrinkles in the tape. The apparatus can include means for holding the tape during application. The length of the leading leg of the tag can be adjusted and the applying force can also be adjusted to reduce crushing the corners of the object.

Abstract: In a method of manufacturing an optical medium, an extended optical conductor containing active substance is formed to a predetermined shape by the use of resin by repeatedly folding or winding the optical conductor. A laser light beam or an amplified light beam is outputted from an edge portion of the optical conductor by absorbing an excitation light beam incident from the side surface of the optical conductor into the active substance through the resin. Thermoplastic resin is used as the resin. The thermoplastic resin transmits the excitation light beam. The resin is heated up to a glass transition temperature or higher. The optical conductor and the resin are bonded to each other so as to constitute a predetermined shape. The resin is cured.

Abstract: An adhesive bonding process for making vehicle structures wherein a surface portion of an aluminum alloy body is anodized in an aqueous solution of hypophosphorous acid (H3PO2) to form an anodic oxide coating. A layer of adhesive is applied onto the surface portion and the adhesive coated anodized surface portion is joined to an adjacent metal structure. The phosphorous acid anodizing is preferably carried out for less than 1 minute at about 5-40 volts and a current density of about 1-50 mA/cm2 in a solution containing about 1-25 wt % hypophosphorous acid. Anodization time is more preferably about 10-30 seconds and is about 20 seconds in a particularly preferred embodiment.

Abstract: An electric wire-connecting portion (11) is formed by connecting together conductive ends of a plurality of electric wires (W). One end of a heat shrinkable tube (12) is sealed with hot melt adhesive (15). The heat shrinkable tube (12) is attached onto the electric wire-connecting portion (11). A tube holding tool (13) for protecting the one end of the heat shrinkable tube (12) against heat is attached to the one end of the heat shrinkable tube (12). The heat shrinkable tube (12) is heated to shrink thereby sealing the electric wire-connecting portion (11). The tube holding tool (13) includes a holding portion (13a) for holding the one end of the heat shrinkable tube (12), and a shaft portion (13b) integrally formed with the holding portion (13a).

Abstract: The invention relates to a process and a device for manufacturing segmented pressure-sensitive adhesive layers and applying the same to a substrate, involving the use of a reaction medium containing radiation-inducible polymers and/or prepolymers of olefinically unsaturated compounds and the addition of a photoinitiator.

Abstract: For the purpose of producing a method for detaching a segment—disposed on a carrier—from a material layer extending in a layer plane and having a specific layer thickness, by means of a laser pulse passing through the carrier in such a way as to detach segments from a material layer with as little thermal stress and as few thermal secondary effects as possible, it is proposed that the laser pulse within a segment layer-component volume butting against the carrier, the said layer-component volume lying in the plane of the layer within an extent of the beam cross-section of the laser pulse and extending transversely to the layer plane via a part of the layer thickness, produces superheated matter of a density similar to the solid state in a state of thermodynamic non-equilibrium and in particular at a temperature above the critical temperature, and that a cohesive, solid partial layer remains in the segment on the side of the layer-component volume opposite to the carrier, the said partial layer bei

Abstract: A method of and apparatus for activating a ready-to-install heat activated adhesive for attaching a vehicle panel to a vehicle is disclosed which provides a “ready-to-install” panel assembly. The panel assembly includes first and second spaced apart surfaces, with the bead of heat activated adhesive provided on the second surface of the panel. The panel and bead are heated preferably by applying shortwave and longwave infrared radiation, with the shortwave infrared radiation being applied to an adhesive free side of the panel to heat the panel and, thereby, indirectly heat the bead of the heat activated adhesive. For example, where the window panel is such as a laminated windshield or side window or backlite comprising two glass sheets laminated with a polymer inner layer, such as plasticized polyvinyl butyral, or silicone or the like, it is preferable that the heat activation temperature of the adhesive be less than or equal to about 125° C.

Abstract: A semiconductor chip carrier assembly which includes a flexible substrate having a metallicized path on one of its surfaces in electrical communication with a semiconductor chip. A stiffener is disposed adjacent to said flexible substrate and is bonded thereto by an adhesive composition. The adhesive composition which comprises a microporous film laden with a curable adhesive is disposed between the flexible substrate and the stiffener. A cover plate is adhesively bonded to the semiconductor chip and to the stiffener. A process of making the assembly involving disposition of the flexible substrate in a vacuum fixture upon which the adhesive composition and stiffener is placed followed by the application of heat and pressure to cure the curable adhesive is also described.

Abstract: This invention relates to a labeling system for continuously applying a layer of a radiation curable adhesive, e.g., a UV curable adhesive, to plastic, sheet fed, cut and stack, labels, irradiating the adhesive on the labels to render the adhesive sufficiently tacky to effectively adhere the labels to containers in a commercial labeling machine and thereafter applying the labels to discrete containers through the sufficiently tacky adhesive layer. The plastic labels can be clear, opaque (including metallized) plastic films and can be retained in a dispensing magazine prior to the application of the radiation curable adhesive to the labels.

Abstract: The conductive particles can be sintered without being influenced by softening and removing of the adhesive layer. As a result, a wiring pattern of high precision can be formed without causing deformation of conductive pattern.

Abstract: A supporting substrate for mounting a semiconductor bare chip thereon has a surface provided with electrode pads thereon and bumps on the electrode pads. A sealing resin film is selectivley formed on the periphery of the surface of the supporting substrate, except over the bumps, and further the sealing resin film has at least a thermosetting property. The electrode pads of the supporting substrate and the bumps of the semiconductor bare chip are bonded by a thermo-compression bonding.

Abstract: This invention relates to a radiation curable system for continuously applying a layer of a radiation curable adhesive, e.g., a UV curable adhesive, to plastic, sheet fed, cut and stack, labels, irradiating the adhesive on the labels to render the adhesive sufficiently tacky to effectively adhere the label to a container in a commercial labeling machine and thereafter applying the labels to discrete containers through the sufficiently tacky adhesive layer. The plastic labels can be clear, opaque (including metallized ) plastic films and can be retained in a dispensing magazine prior to the application of the radiation curable adhesive to the labels.

Abstract: An integrated pressure sensitive adhesive label application surface and pull card holder in the form of a placard component and an integral pocket component. The placard component includes a placard wall having a first side and an opposite second side, wherein a pressure sensitive adhesive coating is present on the first side. A rear wall of the pocket component is integrally connected with the placard wall, wherein a fold-over is provided at an imaginary demarcation therebetween. A front wall is superposed the rear wall, and secured to the rear wall along the mutual peripheries, except adjacent the fold-over. In one form of the present invention, the placard wall is provided with a preferably white color, the pocket component is clear, and the second side of the placard wall has a release coating. In another form of the present invention, the placard wall and pocket component are clear, and a conventional label system (ie.

Abstract: A method and an apparatus for fixing a part and a part support for mounting the part by use of adhesive via an intermediate member are disclosed. The adhesive is implemented by photocuring adhesive while the intermediate member is formed of a material transparent for light. The intermediate member is free from coloring and deformation when illuminated by light for curing the adhesive. The adhesive is prevented from dropping or turning round to other portions during assembly.

Abstract: The present invention discloses a color-modifying method, which comprises the provision of a metal oxide thin film (14) based on Ni and/or Cr. The method is characterized in that, when coloring the metal oxide film (14), exposing the metal oxide thin film to ozone, and when bleaching the metal oxide film, exposing the metal oxide film to UV radiation (18). A lamination process or a deposition of another thin film may follow the exposure. Preferably, exposing the metal oxide thin film (14) to ultraviolet radiation (18) in an oxygen-containing atmosphere (20) provides the ozone exposure and exposing the metal oxide thin film to ultraviolet radiation (18) in an oxygen-free atmosphere (20) provides the ultraviolet exposure.

Abstract: Methods for the use of laser beams in the case of plastic monofilaments are proposed. For example, methods for joining extruded plastic monofilaments and monofilaments having different absorption coefficients for laser beams (LS) are at least zonally contacted along their circumferential surface and by the introduction of laser beams are melted together in the contact area. For the optical marking of extruded monofilaments or individual monofilaments of a monofilament union, at least the monofilament to be marked, accompanied by the addition of additives reacting with a color change under laser action, are extruded and treated with laser beams in the areas corresponding to the desired marking. For structural modifying monofilaments or individual monofilaments of a monofilament union, the monofilament to be structurally modified is extruded with LS-absorbing additives and subsequently treated with laser beams.

Abstract: In a plate bonding system for bonding first and second substrate discs (or other plates) with adhesive, there are provided a first section for bringing the first and second substrate discs closer to each other with the interposition of adhesive, and a second section for producing an electric field in the interspace between the first and second substrate discs. The second section produces the field and thereby deforms the adhesive into a tapered shape to minimize the initial contact area and thereby prevent voids from being involved in the adhesive.

Abstract: An ultrasonic vibration bonding machine which enables appropriate bonding by selecting a pressure curve according to the sizes of portions to be bonded together and the physical properties of their materials and the like. Pressure inside the pressure chamber of an air cylinder which is a pressure control unit for bonding work and the normal rotation and reverse rotation of a motor which constitutes part of a vertical drive unit for bonding work are controlled to bond together a first member and a second member with ultrasonic vibration under pressure which rises from a first pressure set value to a second pressure value from a vibration start time.