Abstract: When a mounting head is moved upward of a rear side conveyor across and over a front side conveyor after a component suction operation, it is determined whether or not there is a possibility that a component sucked by a suction nozzle may interfere with a component mounted on a circuit board on the front side conveyor. When so determined, a head lifting mechanism is caused to lift up the mounting head to a position where the component sucked by the suction nozzle does not interfere with the mounted component. Thereafter, the mounting head is moved upward of the rear side conveyor, and the head lifting mechanism is caused to lower down the mounting head to an initial height position. Thereafter, the component is mounted on a circuit board on the rear side conveyor.

Abstract: An installation fixture for installing a device on a power line is disclosed. The fixture includes a lower cradle that may receive one part of the device, an upper cradle that may receive another part of the device, and a base. The installation fixture may be installed on a worker carrier for a boom truck or the like. The orientation of the lower cradle may be adjusted relative to the base to facilitate the installation on the power line. The upper cradle may be moved between an open position (where the parts may be loaded into the fixture) and a closed position (where the power line is captured between the two parts of the device) and at which time that parts can be secured together.

Abstract: An apparatus that couples a first substrate and a second substrate of an electrowetting display panel, the apparatus comprising a first chuck provided with a first support surface and a second chuck provided with a second support surface opposite to the first support surface and positioned beneath the first chuck. The second support surface is smaller than the first support surface and is positioned in a plane parallel to a plane that includes the first support surface.

Abstract: A method for producing a wired circuit board includes the steps of preparing a metal supporting layer; forming an insulating layer on the metal supporting layer; roughening the surface of the insulating layer; forming a conductive pattern on the insulating layer; and inspecting the presence or absence of a defect of the conductive pattern by using an inspection device provided with a light emitting portion emitting incident light that enters the insulating layer and the conductive pattern and a light receiving portion receiving reflected light that is reflected from the incident light. The incident light has a wavelength in the range of 435 to 500 nm and includes inclined light that inclines so as to form an angle of more than 0° to not more than 30° with respect to the optical axis thereof.

Abstract: Embodiments of the invention provide methods for forming electrical connections using liquid metals. Electrical connections that employ liquid metals are useful for testing and validation of semiconductor devices. Electrical connections are formed between the probes of a testing interface and the electronic interface of a device under test through a liquid metal region. In embodiments of the invention, liquid metal interconnects are comprised of gallium or liquid metal alloys of gallium. The use of liquid metal contacts does not require a predetermined amount of force be applied in order to reliably make an electrical connection.

Abstract: Components and methods of making the same are disclosed herein. In one embodiment, a method of forming a component comprises forming metal anchoring elements at a first surface of a support element having first and second oppositely facing surfaces, the support element having a thickness extending in a first direction between the first and second surfaces, wherein each anchoring element has a downwardly facing overhang surface; and then forming posts having first ends proximate the first surface and second ends disposed above the respective first ends and above the first surface, wherein a laterally extending portion of each post contacts at least a first area of the overhang surface of the respective anchoring element and extends downwardly therefrom, and the overhang surface of the anchoring element resists axial and shear forces applied to the posts at positions above the anchoring elements.

Abstract: A method for manufacturing a liquid cartridge for recycling includes a preparing step and a first step. The preparing step prepares the liquid cartridge for recycling. The liquid cartridge for recycling includes a liquid accommodating portion, a flowing path, a stopper, and a valve. The first step includes a first insertion step, a first valve open step, a first injection step, a first valve close step, a first removal step, and a first mounting step. The first insertion step inserts an injection member into the stopper. The first injection step injects the liquid into the liquid accommodating portion through the injection member, after the first insertion step and the first valve open step. The first removal step removes the stopper from the opening while the valve is maintained in the closed position after the first valve close step. The first mounting step mounts a new stopper.

Abstract: A PCB includes a base layer, a wiring pattern formed on a surface of the base layer, and a protecting layer formed on the wiring pattern. The protecting layer is formed by printing and solidifying an ink on the wiring pattern. The ink includes a cycloaliphatic epoxy resin, a phenoxyl resin solution, a solvent, a hardener, and an antifoaming agent.

Abstract: A package for a multi-chip module includes a top cold plate and a bottom plate whose perimeters are in thermal communication so the plates together completely encase the module except for a connector passing through the bottom plate. The cold plate has copper tubing pressed into a groove formed in a serpentine pattern. The perimeter of the cold plate has thermal conduction fins which mate with thermal conduction slots in the perimeter of the bottom plate. Thermal interface material is disposed in gaps between the plates and chips on the module, the gaps having dimensions controlled by support ribs of plates which abut the module substrate. The cold plate is used on the hottest side of the module, e.g., the side having computationally-intensive chips such as ASICs. A densely packed array of these packages can be used in a central electronic complex drawer with a shared coolant circulation system.

Abstract: Provided is an electronic circuit including a substrate having a flat device region and a curved interconnection region. A conduction line may extend along an uneven portion in the interconnection region and may be curved. The uneven portion and the conductive line may have a wavy shape. An external force applied to the electronic circuit may be absorbed by the uneven portion and the conductive line. The electronic device may not be affected by the external force. Therefore, functions of the electronic circuit may be maintained. A method of fabricating an electronic circuit according to the present invention may easily adjust areas and positions of the interconnection region and the device region.

Abstract: Methods and apparatus for joining a chip with a substrate. The chip is moved by with a pick-and-place machine from a first location to a second location proximate to the substrate over a first time. In response to moving the chip in a motion path from the first location to the second location, a plurality of solder bumps carried on the chip are liquefied over a second time that is less than the first time. While the solder bumps are liquefied, the chip is placed by the pick-and-place machine onto the substrate.

Abstract: Embodiments disclosed herein provide approaches for attaching scan control and other electronic chips to textiles, e.g., on a loom as part of a real-time manufacturing process.

Abstract: Disclosed is a leak detection cable that has an outer jacket layer and a four wire construction in a flat wire configuration that is twisted in a helix. Detection cables are disposed on the exterior surface adjacent openings of the jacket to allow for detection of aqueous fluids. The wire is twisted in a helix to allow adjacent detector wires to easily detect aqueous fluids. Disparate materials are used for the jacket and the coatings of the wires, to allow the jacket to be easily removed from the wires without affecting the integrity of the coatings of the wires. The four flat wire configuration is sized and spaced for easy connection to an insulation displacement connector.

Abstract: A rotor core is manufactured by forming thin plate-like core pieces including holes, forming a lamination body including insertion holes by laminating the core pieces, and inserting and embedding a permanent magnet in each of the insertion holes of the lamination body. The holes of each core piece include one or more first holes, in each of which a position determining portion for determining the position of the permanent magnet is formed, and one or more second holes, in which a position determining portion is not formed. Each insertion hole of the lamination body is formed by overlapping first holes of some of the core pieces and second holes of the remaining core pieces.

Abstract: A multilayer rigid flexible printed circuit board including a flexible region including a flexible film having a circuit pattern formed on one or both surfaces thereof and a laser blocking layer formed on the circuit pattern and a rigid region formed adjacent to the flexible region and including a plurality of pattern layers on one or both surfaces of extended portions extended to both sides of the flexible film of the flexible region, and a method for manufacturing the same.

Abstract: The present invention is for a switchable 3-dimensional conversion device having a spacer stably formed at a predetermined height by imprinting, a manufacturing method thereof and a stereoscopic image display device using the same, the method includes: providing a first electrode on an inner surface of a first substrate; applying a resin material to the first electrode to a predetermined thickness; placing a mold structure which has a concave part formed with a predetermined depth thereon, on the resin material; stamping the resin material using the mold structure, in order to form a spacer pattern; dry etching the spacer pattern to form a spacer; forming a plurality of second electrodes, which are spaced from one another and have longitudinal axes in one direction, respectively, on a second substrate; and arranging the first and second substrates opposite to each other, bonding the same, and forming a liquid crystal layer between the first and second substrates.

Abstract: A chip attach frame is used to align pins of an integrated circuit chip with pads on a chip carrier. A frame block has a socket defining two alignment edges that form a reference corner. The chip is lowered into the socket, and the chip carrier is inclined while it supports the frame block and chip until the chip moves under force of gravity to the reference corner. Once located at the reference corner, the chip position is carefully adjusted by moving the frame block in the x- and y-directions until the pins are aligned with the pads. The frame block is spring biased against movement in the x- and y-directions, and the position of the frame block is adjusted using thumbscrews. A plunger mechanism can be used to secure the integrated circuit chip in forcible engagement with the chip carrier once the pins are aligned with the pads.

Abstract: A docking station for a removable printer mechanism is provided, together with methods for providing a removable printer mechanism. The docking station may have a base with parallel side arms adapted to be fixed to an interior of a printer housing. Side walls may extend from each of the parallel side arms. The side walls may be adapted to guide the printer mechanism into a docked position in the printer and to removably fix the printer mechanism in the docked position. A bridge element may extend between the parallel side arms at a rear of the base. A clamping element may be fixed to the bridge element and be adapted to hold a printer-side cable connector in position to accept a corresponding cable connector of the printer mechanism. The printer mechanism may easily be slid into and out of the docking station for repair or replacement.

Abstract: A bonding device electrically bonds metallic surfaces through serrated metal teeth which embed into each metal surface as a fastener is tightened. A sealing material circumferentially outward and inward from the teeth create an air-tight and water-tight seal around the teeth, protecting the bonding location. The device can have an extended central collar extending axially from the through-hole in the center of the device, which will allow it to be installed in holes, or on a stud without the use of adhesives or other retaining methods.

Abstract: A bonding device electrically bonds metallic surfaces through serrated metal teeth which embed into each metal surface as a fastener is tightened. A sealing material circumferentially outward and inward from the teeth create an air-tight and water-tight seal around the teeth, protecting the bonding location. The device can have an extended central collar extending axially from the through-hole in the center of the device, which will allow it to be installed in holes, or on a stud without the use of adhesives or other retaining methods.