Patents Examined by Kaying Kue
  • Method for stencil printing during manufacture of printed circuit board
    Patent number: 10426039
    Abstract: A method for stencil printing during manufacture of a printed circuit board includes forming a circuit diagram on a trepanned circuit board using a first stencil that has the circuit diagram, a scraper and conductive inks, forming a solder mask layer on the circuit board using a second stencil, the scraper, and solder materials, forming words and marks on the circuit board using a third stencil, the scraper, and inks, and forming a solder paste layer on the circuit board using a fourth stencil, the scraper, and solder paste.
    Type: Grant
    Filed: March 21, 2016
    Date of Patent: September 24, 2019
    Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: Xue-Qin Zhang
  • Methods and system for creating spacing between insulated coils of electrodynamic machines
    Patent number: 10418874
    Abstract: Methods and system for creating spacing between insulated stator coils include a spacing device with an expandable container. The expandable container is positioned and expanded between stator coil end portions in order to create a space between the insulated stator coil end portions. Insulating elements are placed in the space created between the stator coil end portions, and the expandable container removed.
    Type: Grant
    Filed: July 14, 2016
    Date of Patent: September 17, 2019
    Assignee: SIEMENS INDUSTRY, INC.
    Inventors: Ross Patrick Lamberson, Timothy David Beatty
  • Flexible printed circuit board and method for manufacturing the same
    Patent number: 10412841
    Abstract: A FPCB includes a base layer defining at least one first through hole. A conductive paste block is formed in each first through hole. Each conductive paste block includes a first and a second end portion. The base layer has opposite surfaces, and a first conductive wiring layer is formed on each surface of the base layer. The first end portion at least protrudes from the base layer and is exposed from the first conductive wiring layer. An insulating layer and a second conductive wiring layer are formed on each first conductive wiring layer. At least one second through hole is defined in each insulating layer. The second through hole positioned near the first end portion extends to the first end portion and forms a recess. A conductive via is formed in each second through hole and the corresponding recess, and is electrically connected to the conductive paste block.
    Type: Grant
    Filed: December 6, 2017
    Date of Patent: September 10, 2019
    Assignees: Avary Holding (Shenzhen) CO., Limited., HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
    Inventor: Tzu-Chien Yeh
  • Wiresaw removal of microelectronics from printed circuit board
    Patent number: 10403595
    Abstract: An assembly is provided for mechanically severing ball grid array (BGA) attachment solder between an electronics chip and a printed circuit board. The assembly includes a bridge fixture, a tungsten wire and removable spacers. The bridge fixture extends over the chip. A pair of guide bars flanks the bridge fixture. each guide bar has a wire engagement surface. The tungsten wire is disposed across the chip between the pair of guide bars along their respective surfaces. The removable spacers are disposed between the corresponding guide bars and the printed circuit board for aligning the wire to engage the solder.
    Type: Grant
    Filed: June 7, 2017
    Date of Patent: September 3, 2019
    Assignee: United States of America, as represented by the Secretary of the Navy
    Inventor: Joel T. Harrison
  • Tooling for holding thin metal parts making up a hollow structure in order to enable them to be friction-welded together
    Patent number: 10384303
    Abstract: A tooling for holding a set of preformed parts to be friction-welded together to construct a generally plane hollow structure is provide. The tooling includes a framework for receiving the preformed parts inside the framework for welding together to form the hollow structure. The framework includes shape-holder members which are shaped to correspond and contact the outer surfaces of the preformed parts. At least one anvil is disposed inside the framework. A reversible clamp is installed inside the framework and movable into a clamping position in which the clamp inflates to apply opposing thrust in at least two directions such that thrust is applied in a lateral direction to the anvil and applied in a second direction to the inside surface of the preformed parts disposed. The set of preformed parts is held in a welding position with the clamp and framework while a welding operation is performed.
    Type: Grant
    Filed: July 23, 2015
    Date of Patent: August 20, 2019
    Assignee: AIRBUS HELICOPTERS
    Inventors: Delphine Allehaux, Jean-Loup Gatti, Laurent Marchione, Philippe Durand
  • Methods of manufacturing a hermetic lead connector
    Patent number: 10363424
    Abstract: A method of manufacturing a hermetic lead connector includes fixing an electrically insulating ring between an electrically conducting contact ring and an electrically conducting spacer ring to form a hermetic ring subassembly, and fixing a plurality of the hermetic ring subassemblies in axial alignment to form a hermetic lead connector. The hermetic lead connector includes an open end, an outer surface, and an inner surface defining a lead aperture. The hermetic lead connector provides a hermetic seal between the outer surface and the inner surface.
    Type: Grant
    Filed: January 30, 2012
    Date of Patent: July 30, 2019
    Assignee: Medtronic, Inc.
    Inventors: Darren A. Janzig, Gerald G. Lindner, Chris J. Paidosh
  • Apparatus for installing LED light bar and method of installing LED light bar
    Patent number: 10310172
    Abstract: An apparatus for installing LED light bar is provided. The apparatus includes a platform at which a component with a LED light bar to be installed is placed; a rotatable arm and a first driving device disposed on a side of the platform. The rotatable arm is provided with a locating member, and one end of the arm is fixed relative to the platform; the first driving device drives the arm to rotate about the fixed end from a first position to a second position. When the arm is located at the first position, the LED light bar to be installed may be placed at the arm, and the locating member may fix the LED light bar on a predetermined position of the arm; when the arm rotates to the second position, the LED light bar adheres to the surface of the component for installing the LED light bar thereon.
    Type: Grant
    Filed: April 29, 2016
    Date of Patent: June 4, 2019
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., BOE OPTICAL SCIENCE AND TECHNOLOGY CO., LTD.
    Inventors: Yuqi Mei, Chunlei Cao, Ying Zang, Haiyan Wang
  • Docking station for a removable printer mechanism and methods of providing a removable printer mechanism
    Patent number: 10300721
    Abstract: A docking station for a removable printer mechanism is provided, together with methods for providing a removable printer mechanism. The docking station may have a base with parallel side arms adapted to be fixed to an interior of a printer housing. Side walls may extend from each of the parallel side arms. The side walls may be adapted to guide the printer mechanism into a docked position in the printer and to removably fix the printer mechanism in the docked position. A clamping element may be provided which is adapted to clamp and hold a printer-side cable connector in position to accept a corresponding cable connector of the printer mechanism. The printer mechanism may easily be slid into and out of the docking station for repair or replacement.
    Type: Grant
    Filed: April 12, 2017
    Date of Patent: May 28, 2019
    Assignee: TransAct Technologies Incorporated
    Inventors: Steven A. Supron, Roger J. Rimbey
  • Wiring board with dual stiffeners and dual routing circuitries integrated together and method of making the same
    Patent number: 10306777
    Abstract: A wiring board with dual stiffeners and integrated dual routing circuitries is characterized in that first and second routing circuitries are positioned within and beyond a through opening of a first stiffener, respectively, and an array of vertical connecting channels are disposed on the second routing circuitry and laterally surrounded by a second stiffener. The mechanical robustness of the first and second stiffeners can prevent the wiring board from warping. The vertical connecting channels can offer electrical contacts for next-level connection. The first routing circuitry, positioned within the through opening of the first stiffener, can provide primary fan-out routing, whereas the second routing circuitry not only provides further fan-out wiring structure for the first routing circuitry, but also mechanically binds the first routing circuitry with the first stiffener.
    Type: Grant
    Filed: August 25, 2016
    Date of Patent: May 28, 2019
    Assignee: BRIDGE SEMICONDUCTOR CORPORATION
    Inventors: Charles W. C. Lin, Chia-Chung Wang
  • Robotic power and signal distribution using laminated cable with separator webs
    Patent number: 10293496
    Abstract: Systems and methods that facilitate cables to pass through moving, space-constrained joints and conveying power and/or signals to various robotic joint-associated elements utilize a unitary and flat laminated cable slack within the joint to accommodate the relative motion between mechanical elements of the joints. In various embodiments, the cable has multiple insulated sub-cables; each sub-cable is insulated and physically separable from all other sub-cables. Some of the sub-cables are separated from the cable and electrically connected to joint-associated components for conveying signals and power thereto without mechanically interfering with relative motion between mechanical elements of the joint.
    Type: Grant
    Filed: January 19, 2017
    Date of Patent: May 21, 2019
    Assignee: RETHINK ROBOTICS GmbH
    Inventor: Michael Sussman
  • Planar balun transformer device
    Patent number: 10290917
    Abstract: An electric transformer device (balun) is formed on a support plate having a first base face and an opposite second base face. The balun includes a first port (40) connectable to an electrical line for a differential signal and a second port connectable to an electrical line for a single-ended signal. A first printed conductive track is associated to the first base face of the support plate for connecting the first port to the second port. A printed conductive path is associated to the second base face of the support plate for connecting the first port to the second port. The printed conductive path is formed of a symmetric second and third printed conductive tracks.
    Type: Grant
    Filed: September 9, 2015
    Date of Patent: May 14, 2019
    Assignee: STMicroelectronics S.r.l.
    Inventor: Roberto Cammarata
  • Device and method for mounting a pharmaceutical application aid
    Patent number: 10279102
    Abstract: A device (1) for assembly of a pharmaceutical application aid (51), particularly a pen, is proposed. The device (1) is characterized by a holding device (3) for fixation of a first housing sleeve (5) that accommodates a pharmaceutical container, particularly a carpule (23), and by a stop (43) for limiting a displacement of a second housing sleeve (35) relative to the first housing sleeve (5).
    Type: Grant
    Filed: July 31, 2015
    Date of Patent: May 7, 2019
    Assignee: ARZNEIMITTAL GMBH APOTHEKER VETTER & CO. RAVENSBURG
    Inventors: Guenter Kavallar, Hubert Goederle, Janosch Steib
  • Method of manufacturing circuits using thick metals and machined bulk dielectrics
    Patent number: 10285277
    Abstract: A method of manufacturing an electrical circuit from bulk materials includes the steps of machining a first bulk dielectric material, forming a conductive element, and placing the conductive element on a first side the first bulk dielectric material. The method further includes the step of machining a second bulk dielectric material and placing the second bulk dielectric material on the first side of the first bulk dielectric material and over the conductive element. The first bulk dielectric material and the second bulk dielectric material may be laminated together.
    Type: Grant
    Filed: December 31, 2015
    Date of Patent: May 7, 2019
    Assignee: Lockheed Martin Corporation
    Inventors: Marc T. Angelucci, Anthony R. Niemczyk
  • Flexible printed circuit board and method for manufacturing same
    Patent number: 10285260
    Abstract: The flexible printed circuit board includes a base layer, a first circuit layer and a second circuit layer, the first circuit and the second circuit layer formed on both sides of the base layer; conducting holes extending through the base layer and the first copper layer, the conducting holes include annular copper ring embedded in the first circuit layer. A height difference between a surface of the annular copper ring and a surface of the first circuit layer is in a range from 0 to 3 micrometers. A method for manufacturing the flexible printed circuit board is also provided.
    Type: Grant
    Filed: October 30, 2015
    Date of Patent: May 7, 2019
    Assignees: Avary Holding (Shenzhen) Co., Limited., HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., GARUDA TECHNOLOGY CO., LTD.
    Inventors: Xian-Qin Hu, Yan-Lu Li, Li-Bo Zhang
  • Brush holder assemblies and methods for mounting and replacing brushes
    Patent number: 10270216
    Abstract: An assembly has a handle, a brush holder, and a support that connect and disconnect to each other using a locking mechanism. The handle reversibly connects and disconnects from the brush holder. The locking mechanism includes a connecting member on the brush holder that attaches to the handle by interaction of a locking flange on the connecting member with a pair of teeth inside of the handle. Insertion of the support within the brush holder extends a post on the support through the connecting member to interact with the handle and enable disconnection of the handle from the brush holder when the support is fully engaged by the brush holder. The locking mechanism prevents the handle from releasing from the brush holder before the brush holder is completely seated on the support.
    Type: Grant
    Filed: December 7, 2017
    Date of Patent: April 23, 2019
    Assignee: Wabtec Holding Corp.
    Inventors: Leo A. Eger, John H. Parslow
  • Method for making touch panel
    Patent number: 10268329
    Abstract: A method for making a touch panel, the method comprises the following steps. Carbon nanotubes, a first substrate and a second substrate are provided. A carbon nanotube floccule structure is obtained by flocculating the carbon nanotubes. A first conductive layer is formed on the first substrate. A second conductive layer is formed on the second substrate. Two first-electrodes are located on opposite ends of a first electrode plate and two second-electrodes are located on opposite ends of a second electrode plate. The first electrode plate is spaced from the second electrode plate.
    Type: Grant
    Filed: December 29, 2015
    Date of Patent: April 23, 2019
    Assignees: Tsinghua University, HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Chang-Hong Liu, Kai-Li Jiang, Liang Liu, Shou-Shan Fan
  • Methods and apparatus for transmission lines in packages
    Patent number: 10269746
    Abstract: Methods and apparatus for forming a semiconductor device package with a transmission line using a micro-bump layer are disclosed. The micro-bump layer may comprise micro-bumps and micro-bump lines, formed between a top device and a bottom device. A signal transmission line may be formed using a micro-bump line above a bottom device. A ground plane may be formed using a redistribution layer (RDL) within the bottom device, or using additional micro-bump lines. The RDL formed ground plane may comprise open slots. There may be RDLs at the bottom device and the top device above and below the micro-bump lines to form parts of the ground planes.
    Type: Grant
    Filed: October 5, 2015
    Date of Patent: April 23, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chin-Wei Kuo, Hsiao-Tsung Yen, Min-Chie Jeng, Yu-Ling Lin
  • Method of fabricating an electrical device package structure
    Patent number: 10271433
    Abstract: A method of packaging an electrical device including following steps is provided. A circuit board including a substrate and a first conductive pattern is provided. The electrical device having an electrode is disposed on the circuit board. A dielectric layer is formed on the circuit board to cover the electrical device, the electrode and the first conductive pattern, wherein a first caving pattern is formed in the dielectric layer by the first conductive pattern. The dielectric layer is patterned to form a through hole and a second caving pattern connecting with the through hole and exposing the electrode. A conductive material is filled in the through hole and the second caving pattern to form a conductive via in the through hole and a second conductive pattern in the second caving pattern. The substrate is removed.
    Type: Grant
    Filed: September 16, 2015
    Date of Patent: April 23, 2019
    Assignee: Unimicron Technology Corp.
    Inventors: Tzyy-Jang Tseng, Shu-Sheng Chiang, Tsung-Yuan Chen, Shih-Lian Cheng
  • Chip joining by induction heating
    Patent number: 10245667
    Abstract: Methods and apparatus for joining a chip with a substrate. The chip is moved by with a pick-and-place machine from a first location to a second location proximate to the substrate over a first time. In response to moving the chip in a motion path from the first location to the second location, a plurality of solder bumps carried on the chip are liquefied over a second time that is less than the first time. While the solder bumps are liquefied, the chip is placed by the pick-and-place machine onto the substrate.
    Type: Grant
    Filed: July 19, 2017
    Date of Patent: April 2, 2019
    Assignee: GLOBALFOUNDRIES Inc.
    Inventors: Stephen P. Ayotte, Glen E. Richard, Timothy D. Sullivan, Timothy M. Sullivan
  • Wireless sensor patches and methods of manufacturing
    Patent number: 10244986
    Abstract: Wireless sensor patches include a skin-friendly adhesive and a flexible cover patch. In further examples, methods of manufacturing a plurality of wireless sensor patches include the step (I) of unwinding a flexible support membrane from a support membrane storage roll along an assembly path. The flexible support membrane is provided with a skin adhesive configured to mount a first face of the flexible support membrane to a skin surface. The method further comprises the step (II) of sequentially mounting a plurality of sensor devices with respect to a second face of the flexible support membrane along a longitudinal axis of the assembly path. The method further includes the step (III) of sequentially separating the flexible support membrane to provide the plurality of wireless sensor patches, wherein each wireless sensor patch includes a corresponding one of the plurality of sensor devices.
    Type: Grant
    Filed: January 23, 2014
    Date of Patent: April 2, 2019
    Assignee: Avery Dennison Corporation
    Inventors: James W. Adams, Edward A. Armijo, Ryan Hruska, Michael R. Onderisin, David Silvestro