Abstract: Disclosed herein is a mechanism for forming an interconnect comprising forming a connector on an interconnect disposed on a first surface of a first substrate and applying a nonconductive material in a non-liquid form over the interconnect after forming the connector. The nonconductive material covers at least a lower portion of the interconnect, and at least a portion of the interconnect is exposed. The nonconductive material is formed around the connector by pressing the nonconductive material over the connector with a roller. An angle between a top surface of the nonconductive material and a connector sidewall between about 65 degrees and about 135 degrees. The nonconductive material may be formed to extend under the connector.

Abstract: The present invention relates to a method of manufacturing an optical device for a back light unit, and an optical device and an optical device array manufactured by the method, in which optical device chips constituting the optical device array are each laid the sides thereof on a printed circuit board in such a manner that light can be emitted from the optical device chips in a lateral direction, thus reducing the overall thickness of the back light unit.

Abstract: A method of determining curing conditions is for determining the curing conditions of a thermosetting resin to seal a conductive part between a substrate and an electronic component. A curing degree curve is created. The curing degree curve indicates, with respect to each of heating temperatures, relationship between heating time and curing degree of the thermosetting resin. On the basis of the created curing degree curve, a void removal time of a void naturally moving upward in the thermosetting resin, at a first heating temperature, is calculated. The first heating temperature is one of the heating temperatures.

Abstract: A method is for producing a cable which comprises a conductor and a barrel. The conductor has individual wires and is enclosed, at least in portions, by a piece of insulation. The conductor is heated and a crimping process is carried out for electrically contacting the barrel with the conductor. The barrel is pressed together with the heated conductor during the crimping process in such a way that the conductor is initially compressed on a first axial sub-portion of the conductor and subsequently the compression of the conductor is spread to a larger second axial sub-portion.

Abstract: A fabrication method of an acoustic wave device includes: forming a metal layer between regions that are located on a piezoelectric substrate and in which acoustic wave chips are to be formed, at least a part of a region of the metal layer extending to an extension direction of a dicing line for separating the acoustic wave chips; and scanning the dicing line of the piezoelectric substrate by a laser beam so that the at least a part of the region of the metal layer is not irradiated with the laser beam.

Abstract: A print element substrate is absorbed and held by a handling jig to define a predetermined location and position of the print element substrate with respect to the supporting member. In this instance, the handling jig is provided with a convex portion. Therefore, when the print element substrate is joined to the supporting member, the convex portion comes into contact with a surface of the supporting member, so that it is possible to define the height of the print element substrate with respect to the joining surface. This makes it possible to control the amount and height of squash by the print element substrate exerted on the adhesive agent applied on the joining surface. It is possible to prevent the redundant adhesive agent from spilling out in a print liquid flow path.

Abstract: A method for producing an operative connection between a coaxial cable (1) and a coaxial connector (16). A cable jacket (5), if present, is removed by means of a first tool (6) to a predefined first length L1. In a second step, an outer conductor (3) is removed by means of a second tool (7) to a predefined second length L2. In a third step, a dielectric (4) is removed by means of a third tool (8) to a third length L3, such that one end (15) of the inner conductor (2) is exposed. Then the end (15) of the inner cable conductor (2) is formed by means of a rotary swaging device (9), which comprises a plurality of deflectable jaws (10) rotatable circumferentially about an axis of rotation (11) and each hammering in the radial direction with at least one operative surface (14).

Abstract: This disclosure relates generally to an electronic chip package that can include a die and a buildup layer substantially enveloping the die. Electrical interconnects can be electrically coupled to the die and passing, at least in part, through the buildup layer. An optical emitter can be electrically coupled to the die with a first one of the electrical interconnects and configured to emit light from a first major surface of the electronic chip package. A solder bump can be electrically coupled to the die with a second one of the electrical interconnects and positioned on a second major surface of the electronic chip package different from the first major surface.

Abstract: Method for assembling includes: providing a system to transfer wire element from wire element supply device to wire element storage device; stretching wire element between supply and storage devices by tensioning; providing an individualized reservoir and separated chip elements, each including a connection terminal including a top with free access facing in which chip element is not present; transporting the chip element from reservoir to an assembly area between supply and storage devices in which wire element is tightly stretched in assembly area; fixing electrically conducting wire element to chip element connection terminal in assembly area; and adding electrically insulating material on chip element after latter has been fixed to wire element forming a cover, the addition of material being performed on surface of chip element including connection terminal fixed to wire element to cover at least the connection terminal and portion of wire element at fixing point of latter.

Abstract: A terminal with a wire having a high sealing property, a manufacturing method thereof, and a wire harness are provided. The terminal with the wire includes an aluminum wire and a crimp terminal. A resin covering member is removed from the aluminum wire to form a conductor exposed portion (a wire forming process). The crimp terminal is connected to the conductor exposed portion to form a wire-terminal connection portion (a wire-terminal connection process). Then, an anticorrosion portion is formed such that a voltage is applied between the crimp terminal and a metal nozzle and an electrified anticorrosion material is supplied from the metal nozzle to the wire-terminal connection portion in a state of being attracted (an anticorrosion material supply process). Further, the anticorrosion portion is formed by irradiating the anticorrosion material with an ultraviolet ray to be UV-cured (an anticorrosion material curing process).

Abstract: The present invention relates to an apparatus for interchanging welding tips of a spot welding gun. According to the present invention, an apparatus for interchanging welding tips of a spot welding gun comprises: a post frame provided with a connection plate on a top surface; a tip-removal means coupled at a predetermined position on one side surface of the post frame; and a tip-setting means coupled to a top surface of the connection plate.

Abstract: This disclosure discloses a touch display screen, a manufacturing method thereof and a display device. The touch display screen comprises: an opposite substrate, an array substrate, and a liquid crystal layer located between the opposite substrate and the array substrate, a side of the opposite substrate facing the liquid crystal layer being provided with a black matrix. The touch display screen further comprises: a first touch electrode, an insulating layer and a second touch electrode arranged in stack successively at a side of the opposite substrate back to the liquid crystal layer. The first touch electrode and the second touch electrode are located within an area corresponding to the black matrix respectively. The first touch electrode comprises a plurality of first touch sub-electrodes distributed along a first direction. The second touch electrode comprises a plurality of second touch sub-electrodes distributed along a second direction perpendicular to the first direction.

Abstract: A device for manufacturing a field pole magnet body includes a reference jig having reference surfaces in a lengthwise direction, a width direction, and a thickness direction for positioning the plurality of cleaved and divided magnet fragments; a lengthwise direction pressing means that presses the magnet fragments from the lengthwise direction to the lengthwise direction reference surface; a width direction pressing means that presses them from the width direction to the width direction reference surface; and a thickness pressing means that presses them from the thickness direction to the thickness direction reference surface. The lengthwise direction pressing means is operated to press the magnet fragments in a state in which a pressing force of at least one of the width direction pressing means and the thickness direction pressing means is suppressed to be weaker than a pressing force generated by the lengthwise direction pressing means or is released.

Abstract: A nanoprinthead including an array of nanotip cantilevers, where each nanotip cantilever includes a nanotip at an end of a cantilever, and a method for forming the nanoprinthead. Each nanotip may be individually addressable through use of an array of piezoelectric actuators. Embodiments for forming a nanoprinthead including an array of nanotip cantilevers can include an etching process from a material such as a silicon wafer, or the formation of a metal or dielectric nanotip cantilever over a substrate. The nanoprinthead may operate to provide uses for technologies such as dip-pen nanolithography, nanomachining, and nanoscratching, among others.

Abstract: A method for electrically conductively connecting the electrical conductors (3, 4) of two high voltage cables (1, 2) is provided. The conductors (3, 4) are exposed at their ends by removing the respective casing and they are then inserted from different sides into a pipe piece (5) in such a way that they rest against each other with their end faces extending perpendicular to their axis and level with the central throughholes. The conductors (3, 4) are then secured by means of the securing screws (6) in the pipe piece 5 and bores extending in radial direction are made through the throughholes into which the two conductors (3, 4) project in the area of their end faces. Finally, the contact screws of an electrically well conductive metal are screwed into the central throughholes and further into the bores.

Abstract: In a method for forming a microelectronic device, a substrate is loaded into a mold press. The substrate has a first surface and a second surface. The second surface is placed on an interior lower surface of the mold press. The substrate has a plurality of wire bond wires extending from the first surface toward an interior upper surface of the mold press. An upper surface of a mold film is indexed to the interior upper surface of the mold press. A lower surface of the mold film is punctured with tips of the plurality of wire bond wires for having the tips of the plurality of wire bond wires extending above the lower surface of the mold film into the mold film. The tips of the plurality of wire bond wires are pressed down toward the lower surface of the mold film to bend the tips over.

Abstract: An inter-wire connection structure includes: first and second wires connected to each other and each having a core sheathed with an insulating sheath section and including a plurality of element wires; a single-wire structure section in which the plurality of element wires of at least one of the cores exposed from the insulating sheath sections are made into a single; a core joint section in which both the cores exposed from the insulating sheath sections are joined at a position where an entire region of the single-wire structure section is not overlapped, and having an outer peripheral surface in a shape of a circumferential surface; and a tube tightly covering portions of the cores exposed from the insulating sheath sections including the single-wire structure section and the core joint section, and portions of the insulating sheath sections.

Abstract: A device including a detector 200 for detecting position of a positive electrode 24 as a first electrode in terms of a packaged electrode having a bag-shaped separator 40 in which the positive electrode is provided, and stacking unit 112 and 122 for stacking the positive electrode 24 as the first electrode on a negative electrode 30 as a second electrode having a different polar characteristics from that of the positive electrode 24 as the first electrode on the basis of the position of the positive electrode 24 as the first electrode thus detected.

Abstract: An assembly has a handle, a brush holder, and a support that connect and disconnect to each other using a locking mechanism. The handle reversibly connects and disconnects from the brush holder. The locking mechanism includes a connecting member on the brush holder that attaches to the handle by interaction of a locking flange on the connecting member with a pair of teeth inside of the handle. Insertion of the support within the brush holder extends a post on the support through the connecting member to interact with the handle and enable disconnection of the handle from the brush holder when the support is fully engaged by the brush holder. The locking mechanism prevents the handle from releasing from the brush holder before the brush holder is completely seated on the support.

Abstract: Provided is a method for manufacturing a recording head having a head chip that ejects ink, an upstream flow path member, a downstream flow path member where an accommodating portion and a downstream flow path are disposed, a wiring member that is connected to a piezoelectric actuator in the head chip, a wiring substrate, a first insertion hole into which the wiring member and a tool are inserted, and a second insertion hole where a wiring member insertion portion into which the wiring member is inserted and a tool insertion portion into which the tool can be inserted are integrally formed, the method including inserting the tool into the tool insertion portion, holding the wiring member with the tool, withdrawing the tool from the tool insertion portion by moving the downstream flow path member to the head chip side, and inserting the wiring member into the wiring member insertion portion.