Patents Examined by Kiley S. Stoner
  • Patent number: 11458558
    Abstract: The invention relates to a soldering nozzle for the simultaneous selective wave soldering of at least two spaced-apart rows of solder joints in a soldering installation, with a base portion which can be arranged on a nozzle plate, and with a wave portion which forms the solder wave during operation and which has a peripheral wall having a free upper side, and with at least one separating strip which can be inserted into the wave portion and which can be wetted with solder, wherein the at least one separating strip is formed as a frameless separating strip. The invention also relates to a soldering installation having a nozzle plate and having at least one soldering nozzle.
    Type: Grant
    Filed: March 1, 2019
    Date of Patent: October 4, 2022
    Assignee: ERSA GmbH
    Inventor: Alexander Leisering
  • Patent number: 11458557
    Abstract: An apparatus for soldering a terminal to which a solder alloy is attached on window glass for a vehicle, includes a terminal to which the solder alloy is attached; a coil unit including a coil which generates induction heat; a gripper which grips and releases the terminal and is configured to be movable upward and downward relative to the coil unit in a state of gripping the terminal; and a ferrite core unit including a ferrite core which is configured to be surrounded by the coil unit to receive the induction heat, and is configured to be movable upward and downward relative to the coil unit, wherein the solder alloy attached to the terminal, in a state of being in contact with the window glass, is melted by the induction heat from the coil unit and the ferrite core unit such that the terminal is attached to the window glass.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: October 4, 2022
    Assignee: SAINT-GOBAIN GLASS FRANCE
    Inventor: Un Haeng Heo
  • Patent number: 11458556
    Abstract: A hand-held heating tool includes a handle unit, a pivot unit, a positioning unit, and a heating unit. The handle unit has a recess and a positioning portion. The pivot unit is pivotally connected to the handle unit and has a guiding groove and an abutment section. The positioning unit includes a positioning member, a control member, and an elastic member arranged between the control member and the abutment section. The control member is movably arranged in the guiding groove to actuate the positioning member to move relative to the recess so that the positioning member is selectively engaged with the positioning portion for adjusting a relative angle between the handle unit and the heating unit.
    Type: Grant
    Filed: May 23, 2019
    Date of Patent: October 4, 2022
    Assignee: Pro-Iroda Industries, Inc.
    Inventor: Wei Cheng Wu
  • Patent number: 11458562
    Abstract: The invention relates to an ultrasonic metal welding device and a method for welding electrical conductors using a compression chamber that is adjustable at least in height and that is delimited on opposite sides by a section of a sonotrode as a first delimiting surface and by at least one section of a counter electrode (156) as a second delimiting surface, wherein for welding, the counter electrode and the sonotrode are displaced relative to one another. The counter electrode used is one that comprises sections (152, 154) of geometrically different working surfaces or is composed of at least two sections that are displaceable relative to one another.
    Type: Grant
    Filed: August 27, 2018
    Date of Patent: October 4, 2022
    Assignee: SCHUNK SONOSYSTEMS GMBH
    Inventors: Sebastian Rühl, Peter Wagner, Udo Wagenbach, Heiko Strobel
  • Patent number: 11462506
    Abstract: An ultrasonic transducer system is provided. The ultrasonic transducer system includes: a transducer mounting structure; a transducer, including at least one mounting flange for coupling the transducer to the transducer mounting structure; and a tuned resonator having a desired resonant frequency, the tuned resonator being integrated with at least one of the transducer mounting structure and the at least one mounting flange.
    Type: Grant
    Filed: April 6, 2021
    Date of Patent: October 4, 2022
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventor: Dominick A. DeAngelis
  • Patent number: 11446772
    Abstract: An apparatus for repairing a metal sheet and method of operating the same are provided. The apparatus includes: a base unit including: a frame and an attachment feature on the frame, a cutting unit removably attachable to the base unit to cut out a damaged portion of the metal sheet, and a welding unit removably attachable to the base unit. The cutting unit includes: a cutting arm including a cutting blade, and a motor for operating the cutting arm. The welding unit includes: a fixed platform, a weld movement motor for moving a moveable platform on the fixed platform, and a welding assembly, attached to the moveable platform, to automatically weld a replacement piece to the metal sheet. In operation, the frame is continuously attached to the metal sheet during cutting of the damaged portion and welding of the replacement piece, providing a stable and repeatable frame of reference.
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: September 20, 2022
    Assignee: IPCO SWEDEN AB
    Inventors: Conny-Christian Neumayr, Lars Anders Köijer
  • Patent number: 11445650
    Abstract: Provided is a system for removing an electronic component from a printed circuit board (PCB). The system may comprise a heating well configured to hold a rework liquid. The system may further comprise a head system configured to create a liquid-tight seal around an electronic component. The system may further comprise a nozzle and a mechanical capture device disposed within the head system. The mechanical capture device may be configured to attach to the electronic component. The system may further comprise a controller. The controller may be configured to release the rework liquid through the nozzle and onto the electronic component and lift the electronic component off the PCB.
    Type: Grant
    Filed: October 22, 2019
    Date of Patent: September 13, 2022
    Assignee: International Business Machines Corporation
    Inventors: Theron Lee Lewis, Jennifer I. Bennett, James D. Bielick, David J. Braun, John R. Dangler, Stephen Michael Hugo, Timothy Jennings, Timothy P. Younger
  • Patent number: 11440117
    Abstract: A unitary wafer assembly arrangement for the application of solder balls onto a substrate for subsequent use in the electronics industry. This wafer tool assembly comprises a number of modules connected to one another and all serviced by a robotic arm to transfer processed wafers from one module to another. The tool assembly comprises a load port and pre-aligner module, a binder module, a solder ball mount module and a reflow module. A wafer inspection and repair module arrangement is also part of the tool assembly.
    Type: Grant
    Filed: September 27, 2019
    Date of Patent: September 13, 2022
    Inventor: Jian Zhang
  • Patent number: 11440131
    Abstract: Provided is an ultrasonic joining apparatus capable of easily changing the elliptical ratio and the amplitude of a complex vibration. An ultrasonic joining apparatus (1) includes an ultrasonic LT horn (4) transmitting an ultrasonic vibration to a horn tip (6), in which the horn tip (6) is attached to a lower side of a tip portion (4b) of the ultrasonic LT horn (4) and detachable adjustment screws (5) are attached to positions (screw holes 4b1, 4b2, 4b4) not interfering with the horn tip (6) of the tip portion (4b).
    Type: Grant
    Filed: November 6, 2019
    Date of Patent: September 13, 2022
    Assignee: LINK-US Co., Ltd.
    Inventor: Jun Mitsuyuki
  • Patent number: 11433490
    Abstract: A method includes removing a section of electrical insulation proximate an end of a tubing-encased conductor (TEC) to form an end of electrical insulation that is axially recessed relative to the end of the TEC. The method includes welding an end member to an outer surface of the outer tube at a weld joint that is axially between the end of the TEC and the end of the electrical insulation to protect the electrical insulation from heating damage from welding. The method includes replacing the section of electrical insulation proximate the end of the TEC by inserting a spacer into the end of the TEC between the outer tube and the electrical conductor after welding the end member to the outer surface of the TEC. A tool can be electrically connected to the electrical conductor and the tool can be welded to the end member.
    Type: Grant
    Filed: January 22, 2019
    Date of Patent: September 6, 2022
    Assignee: Halliburton Energy Services, Inc.
    Inventors: Paul Gregory James, Ibrahim El Mallawany
  • Patent number: 11433447
    Abstract: A method for shaping a part using a magnetic pulse is provided. A thin conductive layer is positioned on the part. The part is positioned between a coil and a matrix, the conductive layer being arranged between the coil and the part. An induced current, generated by the coil, is configured: to vaporize the conductive layer generating a pressure wave in the direction of the part. Additionally, the induced current is configured to accelerate the part in the direction of the matrix in association with a magnetic field generated by the coil, pressing the part against the matrix, thereby shaping the part. Further, a method for welding a part using a magnetic pulse is provided.
    Type: Grant
    Filed: December 3, 2018
    Date of Patent: September 6, 2022
    Assignee: ADM28 S.ÀR.L
    Inventor: Victor Shribman
  • Patent number: 11433472
    Abstract: A chassis welding device for welding brackets as standard members to a body of a chassis includes a frame, a first transferring member, a plurality of loading mechanisms, a plurality of carriers, a conveying member, a shifting member, and a spot welder. The loading mechanism transfers standard members to individual preset positions on the carrier to face the solder joints on the standard members away from the carrier. The first transferring member transports the carrier to the shifting member. The shifting member transfers the carrier from the first transferring member to the spot welder. The conveying member transfers the body into contact with the solder joints. The spot welder applies heat to melt the solder joints to bond the standard members to the body.
    Type: Grant
    Filed: July 8, 2019
    Date of Patent: September 6, 2022
    Assignees: HONG FU JIN PRECISION INDUSTRY (WuHan) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Chung Chai, Yu-Ming Xiao, Lin Ding, Zhi-Bing Li
  • Patent number: 11426822
    Abstract: A composition includes the constituents, in approximate weight percentages: Chromium 15-17; Silicon 2.5-3.5; Cobalt 6.0-8.0; Aluminum 1.0-2.0; Tantalum 1.5-2.5; Boron 1.5-2.5; Yttrium 0.015-0.025; Nickel balance; and incidental impurities.
    Type: Grant
    Filed: December 3, 2020
    Date of Patent: August 30, 2022
    Assignee: General Electric Company
    Inventors: Yan Cui, Michael Douglas Arnett, Ethan Conrad Schaeffer, Brian Lee Tollison, Matthew Joseph Laylock
  • Patent number: 11420282
    Abstract: A soldering device capable of shortening operation time of soldering and suppressing solder non-wetting is provided. A soldering device includes: a plurality of tubular solder piece guide tubes which have space therein for a solder piece supplied from a supply port to pass through; a first holding unit which holds the solder piece guide tubes; and a heating unit which heats the first holding unit. Tip end portions of the solder piece guide tubes on a soldering side are arranged on an inner side of the first holding unit.
    Type: Grant
    Filed: November 27, 2017
    Date of Patent: August 23, 2022
    Assignee: Hitachi, Ltd.
    Inventors: Miki Hiraoka, Shinya Kawakita, Masayuki Kyoi, Osamu Ikeda
  • Patent number: 11420287
    Abstract: A wire clamping system for fully automatic wire bonding machine comprises a base, a wire clamping support, a wire clamping assembly, a driving mechanism and an elastic assembly. The wire clamping assembly can move relative to the capillary, so that when the wire clamping system completes the second bond, the metal wire at the end of the capillary may directly extend out of the capillary by the independent movement of the wire clamping assembly and a length thereof can be effectively controlled, in order to form a metal ball in the next first bond. Furthermore, when the wire clamping system completes the second bond, the wire clamping assembly is in a clamping state, which avoids wires flying, even though the second bond is not firmly connected or the machine vibrates.
    Type: Grant
    Filed: September 29, 2020
    Date of Patent: August 23, 2022
    Assignee: NINGBO SHANGJIN AUTOMATION TECHNOLOGY CO., LTD.
    Inventors: Wen Chen, Chengjun Zhang
  • Patent number: 11420281
    Abstract: An electric heating device includes a body and a heating head connected to the body. The heating head includes an electric heating wire and a heat storage member. The electric heating wire includes a first section and a second section connected to the first section. The first section is made of pure nickel. The second section is made of ferrochrome. The heat storage member is mounted around an outer radial periphery of the second section. The heat storage member is made of porcelain clay. The electric heating wire is connected by sections of three different materials so that the heating head can be raised to a very high temperature with extremely high heat generation efficiency, and the electric heating device is not easily damaged by high temperature.
    Type: Grant
    Filed: May 31, 2019
    Date of Patent: August 23, 2022
    Assignee: Pro-Iroda Industries, Inc.
    Inventor: Guan Jun Wang
  • Patent number: 11400549
    Abstract: The present disclosure relates to a method for producing a tubular welding electrode comprising the steps of providing a strip of metal material having a length and first and second surfaces, wherein at least the first surface of the strip is at least substantially coated with nickel or a nickel alloy and then copper or a copper alloy, forming the strip into a “U” shape along the length, filling the “U” shape of the strip with a granular powder flux, and mechanically closing the “U” shape to form a sheath of nickel- and copper-coated metal material that substantially encases the granular powder flux, thus forming a tubular welding electrode. In certain embodiments, the metal material may be steel. In certain other embodiments, the metal material may be nickel or a nickel alloy, which may be at least substantially coated with copper or a copper alloy.
    Type: Grant
    Filed: July 23, 2019
    Date of Patent: August 2, 2022
    Assignee: HOBART BROTHERS LLC
    Inventors: Steven E. Barhorst, Mario A. Amata, Joseph C. Bundy
  • Patent number: 11404393
    Abstract: A wire bonding method includes bringing a capillary and a wire inserted through the capillary into pressure contact with a bonding point of a lead placed on an XY stage to bond the wire to the lead, including moving the XY stage in a state in which the capillary is in pressure contact with the lead to move the capillary along a movement locus including a plurality of arc portions.
    Type: Grant
    Filed: August 23, 2018
    Date of Patent: August 2, 2022
    Assignee: KAIJO CORPORATION
    Inventors: Eiji Kimura, Hiroaki Suzuki, Yoshikazu Tashiro
  • Patent number: 11393700
    Abstract: This bonding apparatus is provided with: a bonding mechanism which has a bonding surface that holds a semiconductor die in a detachable manner, with a film being interposed therebetween, and a heater that applies heat to the bonding surface; a film conveyance mechanism which supplies the film to the bonding surface; a remover bar which is able to enter between the film and the bonding surface; and a drive unit which drives the remover bar.
    Type: Grant
    Filed: July 12, 2018
    Date of Patent: July 19, 2022
    Assignee: Yamaha Motor Robotics Holdings Co., Ltd.
    Inventors: Kohei Seyama, Yuichiro Noguchi
  • Patent number: 11389888
    Abstract: A wave soldering machine includes a housing and a conveyor configured to deliver a printed circuit board through the housing. The wave soldering machine further includes a wave soldering station coupled to the housing. The wave soldering station includes a reservoir of solder material, and a wave solder nozzle assembly configured to create a solder wave. The wave solder nozzle assembly has a nozzle core frame and an exit wing, the exit wing being rotatable about a hinge with respect to the nozzle core frame to adjust a flow of a solder wave. A linear actuator is connected via a linkage to the exit wing to allow the linear actuator to adjust an orientation of the exit wing with respect to the nozzle core frame.
    Type: Grant
    Filed: August 17, 2020
    Date of Patent: July 19, 2022
    Assignee: Illinois Tool Works Inc.
    Inventor: Jonathan M. Dautenhahn