Abstract: A spacer assembly and method for using same to fix a first component to a second component are provided. The method includes positioning the first and second spacer segments between the first and second components, the first and second spacer segments each including an inner face, an opposite outer face, and an exterior surface extending along a longitudinal axis between the inner face and the outer face. The exterior surfaces of the first and second spacer segments are coaxially aligned and secured by a securing device such that the inner faces of the first and second spacer segments define supplementary non-perpendicular angles relative to the longitudinal axis and the outer faces of the first and second spacer segments are parallel to one another. The securing device and the first and second spacer segments are removed after the first component is mechanically coupled to the second component.

Abstract: This document describes systems and techniques of a depth-adaptive mechanism for ball grid array dipping. In an aspect, a depth-adaptive mechanism having a tensioned mesh is positioned in a reservoir filled with flux. When solder balls of an integrated circuit component are dipped into the reservoir of flux, the solder balls are pressed up against the tensioned mesh. The tensioned mesh is configured to, first, elastically deform under the downward force applied by the solder balls and, second, provide an equal and opposite pushing force in order to facilitate solder ball extraction. In so doing, the solder balls of an integrated circuit component can be more easily extracted from flux when deep ball grid array dipping is performed.

Abstract: A method of operating a wire bonding machine is provided. The method includes: (a) operating a wire bonding machine during at least one of (i) an automatic wire bonding operation and (ii) a dry cycle wire bonding operation, wherein a bonding force is applied during the operation of the wire bonding machine; and (b) monitoring an accuracy of the bonding force of the wire bonding machine during the at least one of (i) an automatic wire bonding operation and (ii) a dry cycle wire bonding operation.

Abstract: A bonding device for bonding an electronic element includes an engaging component. The engaging component has a first surface and a second surface opposite to the first surface. The engaging component includes a plurality of recesses at the second surface. The plurality of recesses are configured to cover a plurality of projections of an electronic element. The engaging component is coupled to a heating component.

Abstract: Disclosed is a warpage suppressing reflow oven, which comprises a reflow oven body, where a perforated steel plate circulating device comprising a perforated steel plate is disposed at a reflow-oven inner oven. A plurality of downdraft modules is arranged in the perforated steel plate, and the downdraft acting forces thereof face the upper panel. More than one air extractor is communicated with the plurality of downdraft modules via a plurality of pipelines. Under actuation of the air extractors, the downdraft modules generate downdraft acting forces to the bottom surfaces of the products, so that the products are flatly attached to the universal perforated carriers without warpage in a heat soldering process. Thereby, more uniform heating of the products and better contact of solder joints and effectively improving the yield of reflow soldering operations are achieved.

Abstract: A solder member mounting method includes providing a substrate having bonding pads formed thereon, detecting a pattern interval of the bonding pads, selecting one of solder member attachers having different pattern intervals from each other, such that the one selected solder member attacher of the solder member attachers has a pattern interval corresponding to the detected pattern interval of the bonding pads, and attaching solder members on the bonding pads of the substrate, respectively, using the one selected solder member attacher.

Abstract: A fastening element for friction welding onto a planar workpiece includes a nut head, a through-bore extending at least locally within the nut head, a friction welding face on one end side of the nut head, and a cutting device for introducing a drilled hole into the workpiece on the one end side of the nut head having the friction welding face.

Abstract: A method of forming an assembly in which a metal extension element is connected with a metal stub element, by an intermediate element. The intermediate element extends between first and second ends. The intermediate element is positioned to locate its first end spaced apart from the stub element. An inner end of the extension element is spaced apart from the second end of the intermediate element. Heating elements are located between the elements, to heat the proximal portions of the elements to a hot working temperature, at which the heated portions are subject to plastic deformation. The heating elements are removed, and while the intermediate element is rotating, the first end is urged against the stub element to bond the intermediate element with the stub element. While the extension element is rotating, the inner end is urged against the second end to bond the extension element and the intermediate element.

Abstract: Some implementations of the disclosure are directed to a thermal interface material. In some implementations, a method comprises: applying a solder paste between a surface of a heat generating device and a surface of a heat transferring device to form an assembly; and reflow soldering the assembly to form a solder composite, wherein the solder composite provides a thermal interface between the heat generating device and the heat transferring device, wherein the solder paste comprises: a solder powder; particles having a higher melting temperature than a soldering temperature of the solder paste, wherein the solder paste has a volume ratio of solder powder to high melting temperature particles between 5:1 and 1:1.5; and flux.

Abstract: Apparatus for producing a three-dimensional object layer by layer using a powdery material which can be solidified by irradiating it with an energy beam, said apparatus comprising: a working area onto which layers of powdery material are to be placed; a powder storage unit, where said base surface is supporting a supply of powder in said powder storage unit; a powder distribution member, a pivoted powder pushing device for bringing a portion of powder from said base surface to a position between said distribution member and said working area, said distribution member further being arranged to be moveable towards and across the working area so as to distribute the portion of powder onto the working area, wherein a first portion of said pivoted powder pushing device is movable under said distribution member. An associated method and computer program product are also provided.

Abstract: The disclosure describes example techniques and assemblies for joining a first component and a second component. The techniques may include positioning the first and second component adjacent to each other to define a joint region between adjacent portions of the first component and the second component. The techniques may also include inserting a solid retainer material into the joint region through an aperture in one of the first component or the second component to form a mechanical interlock between the first component and the second component and sealing the aperture to retain the solid retainer material within the joint region. The solid retainer material includes at least one of a metal, a metal alloy, or a ceramic.

Abstract: The axle welder can be easily configured and adjusted to accommodate axle assemblies of varying axle shaft lengths, hub styles (“straight” and “drop axle”) and lug bolt configurations. The axle welder uses a sliding carriage that slides along the support frame at one end of the welder to accommodate differing shaft lengths. The axle welder also includes a pair of pivoting hub lifts that accommodate both straight and drop axle style axle hubs using modular mounting plates. Modular mounting plates (“hub adaptors”) fitted to the hub lifts accommodate hub assemblies with differing lug bolt patterns. The axle welder is built on a rectangular frame that supports a pair of weld units and articulated electrode arms. The axle welder also includes a pair axle supports for carrying the axle shafts within the support frame. A shaft drive pivotally mounted to the support frame lowers to engage and rotate the axle shaft and hub assemblies in unison during the welding process.

Abstract: A linear friction welding system includes a processing circuit configured to execute program instructions stored in a memory to control a first motor using one of a torque and speed control, placing a plurality of timing gears in a configuration wherein a fixed projection of one of the timing gears is at a trail position of a slot of another timing gear such that two power shafts of a cam assembly are rotating in phase and a ram is motionless. The processing circuit further controls a hydraulic press to generate a pressure between two components to be welded with the power shafts rotating in phase, and controls the second motor using the one of the torque and speed control to place the timing gears in a second configuration whereat the fixed projection is at a lead position of the slot thereby forcing the ram to oscillate.

Abstract: Methods of forming a metallic-ceramic brazed joint are disclosed herein. The method of forming the brazed joint includes deoxidizing the surface of metallic components, assembling the joint, heating the joint to fuse the joint components, and cooling the joint. In certain embodiments, the brazed joint includes a conformal layer. In further embodiments, the brazed joint has features in order to reduce stress concentrations within the joint.

Abstract: The invention relates to a method for fusing a solder material deposit by means of laser energy, in which laser radiation emitted from a first laser source is applied to the solder material deposit in a first application phase by means of a first laser device (11) and laser radiation emitted from a second laser source is applied to the solder material deposit in a second application phase by means of a second laser device (12), said first laser source having a lower laser power than the second laser source, a switch being made from the first application phase to the second application phase by means of a switching device (30) and said switch being triggered by a temperature sensor, by means of which the temperature of the solder material deposit is measured at least during the first application phase.

Abstract: A silver-copper cutting electrode assembly, and method of manufacture is provided with optimized attributes to allow for improved durability, integrity and manufacturability. An electrode has a silver tip portion which is brazed to a copper body portion where the silver portion and joint have a particular structural relationship.

Abstract: The present invention provides a simple, cost effective and hassle-free method and apparatus for modifying the surface grain structure of the material, thereby providing a material with multi-modal grain structure having high strength and good formability. The present invention uses a single step processing technique known as submerged static friction stir processing for modifying the surface grain structure of the material, thereby generating a multi-modal grain structure. In the present invention since the working material is completely immersed in the coolant, this maintains the working temperature of the system. Further the present invention does not involve long processing steps and do not need any specialized equipments.

Abstract: A method for interconnecting multiple components of a head-gimbal assembly with a solder joint, including the steps of positioning a first component adjacent to and at an angle relative to a second component to provide a connection area between the first and second components, dispensing a solder sphere to a capillary tube having tapered walls, wherein the capillary tube is positioned with an exit orifice above the connection area between the first and second components, pressurizing the capillary tube until a predetermined pressure is reached, applying a first laser pulse to the solder sphere to liquefy the solder sphere until it falls from the exit orifice, waiting for a predetermined time period after the liquefied solder sphere has exited the exit orifice of the capillary tube, and applying a second laser pulse to reflow the solder sphere to create the solder joint between the first and second components.

Abstract: Apparatus and methods are disclosed for transferring solder to a substrate. A substrate belt moves one or more substrates in a belt direction. A decal has one or more through holes in a hole pattern that hold solder. Each of the solder holes can align with respective locations on one of the substrates. An ultrasonic head produces an ultrasonic vibration in the solder in a longitudinal direction perpendicular to the belt direction. The ultrasonic head and substrate can be moved together in the longitudinal direction to maintain the ultrasonic head in contact with the solder while the ultrasonic head applies the ultrasonic vibration. Various methods are disclosed including methods of transferring the solder with or without external heating.

Abstract: A method of bonding a double-ended cable to a multi-tier substrate (such as a multi-tier printed circuit board) includes picking up the double-ended cable, and imaging alignment markers on a first head of the double-ended cable, a second substrate of the multi-tier substrate, a second head of the double-ended cable, and a first substrate of the multi-tier substrate. The method also includes aligning the alignment marker on the first head of the cable to the alignment marker on the second substrate of the multi-tier substrate, coupling the first head of the cable to the second substrate, and releasing the first head of the cable. The method further includes aligning the alignment marker on the second head of the cable to the alignment marker on the first substrate of the multi-tier substrate, coupling the second head of the cable to the first substrate, and releasing the second head of the cable.