Abstract: Disclosed herein are power electronic modules formed by directly bonding a heat sink to a dielectric substrate using transition liquid phase bonding.

Abstract: A process of repairing a component includes identifying a void in a component; determining at least one approximate physical configuration of the void; inserting borescope into the component in order to view the void; providing a repair rod approximately equivalent to at least one of the least one approximate physical configuration of the void; inserting the repair rod into component; confirming insertion of the repair rod in the void; separating the repair rod to leave a repair plug in the void; and depositing braze paste over the repair plug in the void.

Abstract: A support stand for a soldering or de-soldering handheld tool comprises a base and a cradle for supporting the handheld tool when it is not in use that protects the surrounding work area and accommodates user preferences.

Abstract: An ultrasonic welding apparatus joins metal pieces, such as wires, which are placed in a weldment zone where the metal pieces are subjected to pressure through a compressive height anvil and an adjustable width anvil, and intimate contact is made with a sonotrode of an ultrasonic stack. A first electric motor actuates movement of the height anvil to develop a compressive force for ultrasonic welding of the metal pieces. A second electric motor can position the width anvil before and during welding. A sensor, such as a load cell, measures the compressive force developed. The sensor directly can measure the load on the height anvil independent of the ultrasonic stack. A software algorithm can compensate for deflection of the load cell sensor and lost motion in the first electric motor actuating movement.

Abstract: A method for the magnetic pulse soldering of an item having a stack of sheets consisting of a metal material. At least one hole through a thickness of the stack is formed. The first and second plates, both consisting of a metal material, are arranged on either side of the stack. A covering area covering at least one through-hole is formed. The plates-stack assembly is positioned opposite an active part of a coil such that a working area of the covering area faces the active part of the coil and the working area covering at least one hole. The working area is subjected to a magnetic field until the assembly is joined. While the working area is subjected to the magnetic field, pressure is exerted on the first plate, in the region of at least one hole, pressing the first plate against the second plate.

Abstract: Disclosed is a wire bonding apparatus comprising a capillary, a wire clamp assembly, and a support. The wire clamp assembly includes a first member, a second member, a first contact member, and a second contact member. The first member includes a first body and a first tilting member. The second member includes a second body and a second tilting member. The first contact member is coupled to an inner surface of the first tilting member and extends in an extending direction of the first tilting member. The second contact member is coupled to an inner surface of the second tilting member and extends in an extending direction of the second tilting member. The second member is movable in the second direction.

Abstract: A method of adjusting a clamping of a semiconductor element against a support structure on a wire bonding machine is provided. The method includes: (a) detecting an indicia of floating of the semiconductor element with respect to the support structure at a plurality of locations of the semiconductor element; and (b) adjusting the clamping of the semiconductor element against the support structure based on the results of step (a).

Abstract: Disclosed are ball jumping apparatuses and ball absorption methods using the same. The ball jumping apparatus comprises a fixing part, a moving part spaced apart from the fixing part, and a resilient member that connects the fixing part and the moving part to each other. The resilient member extends upwardly from the fixing part and has a connection with the moving part. The fixing part includes a fixing plate that spreads in a horizontal direction. The moving part includes an oscillating vessel that has a ball receiving space in which a ball is received, and an oscillator coupled to the oscillating vessel. A bottom surface of the oscillating vessel is upwardly spaced apart from a top surface of the fixing plate.

Abstract: A reflow soldering system comprising one or a plurality of individually heatable soldering process zones. The reflow soldering system is configured to supply heat to a workpiece selectively through condensation or through convection or as a combination of convection and condensation.

Abstract: A robotic wire termination system for efficiently and accurately connecting a plurality of wires to an electrical connector having a plurality of connector pins with corresponding wire receptacles. The system generally includes a housing, a removable alignment plate, a robotic positioner, a heating device, a touch responsive display, and a control unit. The alignment plate removably holds a selected electrical connector in a specific position and orientation with the connector pins exposed in the housing and the wire receptacles exposed outside. The display provides a visual representation of the connector pins and selections of the connector pins. The control unit receives inputs indicating the pin selections and controls the robotic positioner to sequentially move the heating device along three orthogonal longitudinal axes to a series of heating positions relative to the selected connector pins to provide heat for melting solder to connect wires to the wire receptacles.

Abstract: Disclosed is a method for forming a hollow pipe-sandwiching metal plate and applications thereof. The hollow pipe-sandwiching metal plate comprises a first panel, a second panel, and multiple hollow pipes between the first panel and the second panel; gaps are arranged among the hollow pipes, and the hollow pipes are connected to the first panel and the second panel by brazing. The present disclosure further includes the applications of the hollow pipe-sandwiching metal plate. The hollow pipe-sandwiching metal plate has advantages, such as light weight, high strength, low stress, high temperature resistance, pressure bearing, thermal insulation and vibration isolation. The metal plate will not deform due to thermal difference, thereby providing permanent service life of the metal plate.

Abstract: A method for brazing a first ceramic component and a second metal alloy component, to make a structural or external timepiece element, a zirconia-based ceramic is chosen for the first component and a titanium alloy for the second component, a first recess is made inside the first component, set back from a first surface in a junction area with a second surface of the second component, braze material is deposited on this first surface and inside each recess, the second surface is positioned in alignment with the first surface to form an assembly, this assembly is heated in a controlled atmosphere to above the melting temperature of the braze material, in order to form the braze in the junction area.

Abstract: A welding mechanism for welding different blank sections includes a welding device and a carrier. The carrier has a base, two opposite positioning members, an operating set disposed between the positioning members and driven by a power source, and a holding member and a pushing member which are respectively disposed relative to the positioning members. The blank sections, including a front section and a rear section, are separately placed on the operating set. The front section is restricted by the holding member. The pushing member pushes the rear section, so the two sections meet at a joint. When the two sections rotate synchronously along with the rotation of the operating set, the welding device welds the two sections at the joint circumferentially to produce a bi-compositional screw, thereby preventing the generation of air and pores inside the joint after welding, increasing processing quality, and reducing processing costs.

Abstract: The invention relates to a laser brazing system, comprising a braze tool having a laser configured to emit a laser beam along a radiation path, and a braze wire tool being configured to guide a braze wire along a wire path intersecting the laser beam. The system comprises a jig comprising a first alignment surface and a first blocking surface, wherein the first alignment surface is configured to be in contact with the braze wire while the first blocking surface blocks at least a first part of the emitted laser beam, and a detector arranged in the radiation path and configured to detect the emitted light of the laser beam passing the jig.

Abstract: A gas powered tool (70) comprising a housing (73) and a soldering tool element (72) releasably coupled to the housing (73). A latching element (105) pivotally mounted on a pivot pin (106) in the housing (73) is retained in a non-latching state (FIG. 26) by an abutment element (102) which is urgeable into the housing (73) by the soldering tool element (72) when the soldering tool element (72) is coupled to the housing (73). The latching element (105) is spring biased in the direction of the arrow E from the non-latching state to a latching state (FIG. 27) for latching a switching element (89) in a first state to in turn retain an isolating valve (86), which supplies fuel gas from a reservoir (78) in the housing (73) to the soldering tool element (72), in the isolating state. On decoupling of the soldering tool element (72) from the housing (73), the abutment element (102) is spring urged outwardly and disengages the latching element (105).

Abstract: The present invention concerns an ultrasonic welding installation comprising an ultrasonic vibration unit having a sonotrode and a converter, wherein the sonotrode and the converter are arranged in mutually adjacent relationship along a longitudinal axis and the ultrasonic vibration unit can be caused to resonate with an ultrasonic vibration in the direction of the longitudinal axis with a wavelength ?.

Abstract: A ball disposition system includes a ball adsorption device, and a ball guide plate providing a ball guide hole. The ball adsorption device includes an adsorption plate providing an adsorption hole extending in a first direction, and a pin extending in the first direction, a portion of the pin inserted in the adsorption hole. The ball guide plate is located beyond the adsorption plate in the first direction.

Abstract: A method and system for heat bonding a chip to a substrate by means of heat bonding material disposed there between. At least the substrate is preheated from an initial temperature to an elevated temperature below a damage temperature of the substrate. A light pulse applied to the chip momentarily increases the chip temperature to a pulsed peak temperature below a peak damage temperature of the chip. The momentarily increased pulsed peak temperature of the chip causes a flow of conducted heat from the chip to the bonding material, causing the bonding material to form a bond.

Abstract: The present disclosure relates to a method of manufacturing a semiconductor device package. The method includes: (a) disposing a support structure on a first substrate; (b) electrically connecting a first electronic component on the first substrate, wherein a portion of the first electronic component is separated from the first substrate by the support structure; (c) heating the semiconductor device package; and (d) removing the support structure.

Abstract: An oven for assisting in conductive joint formation related to a workpiece is provided. The oven includes (a) a chamber, the chamber being at least partially defined by (i) an oven plate and (ii) a cover; (b) a material handling system for moving the workpiece through the oven in connection with a conductive joint formation process; and (c) at least one vacuum chamber within the chamber. The oven provides a stepped temperature profile including a plurality of temperature zones along the oven plate.