Abstract: Electric wires (20) and (21) are intersected with each other at right angles such that the electric wires (20) and (21) are inclined with respect to the vibration direction of ultrasonic vibration through 45°, intersected portions (C) of the electric wires (20) and (21) are set between a horn-side chip (11) and an anvil-side chip (12) in a pressurized state, and ultrasonic vibration is input to the intersected portions (C), thereby bonding the electric wires (20) and (21) to each other.

Abstract: An electrical junction box for a vehicle has a connector circuit having bus bars fixed on an insulation substrate to connect to electrical connectors, a fuse circuit having bus bars fixed on an insulation substrate to connect to fuses, and a relay circuit having third bus bars fixed on an insulation substrate to connect to relays in use. In assembling the box, in order to avoid generation of stress and allow for dislocation of the circuits, the method includes the steps of: (i) joining upstanding welding portions of bus bars of the connector circuit and the fuse or relay circuit by arranging them adjacent each other and welding them together; and (ii) after step (i), joining laterally projecting welding portions of bus bars of the connector circuit and the fuse or relay circuits by welding them together when superimposed one on the other.

Abstract: A method of welding two work pieces that define a connecting zone between them is described. A friction pin is fed at a starting point into the connecting zone and into opposite regions of the work pieces on both sides of the connecting zone. The friction pin is moved in a welding direction along the connecting zone resulting in the work pieces being welded. The friction pin is led out of the connecting zone after welding the work pieces. The friction pin is fed into a sacrificial element while lifting the friction pin.

Abstract: A method for attaching an electronic die to a substrate is disclosed. Preferably, the method includes depositing a pad of low temperature die attachment material within a die attachment area on the substrate, positioning the die over the pad of low temperature die attachment material, and compressing the die against the substrate to expel air trapped within the pad of low temperature die attachment material. Further, a bead of containment material is deposited onto the substrate to define the die attachment area. In this manner, the die attachment material is contained on the substrate. Thus, the method of the present invention improves the reliability of the electronic die.

Abstract: The quantity of supply heat of heated gas is controlled so that a supply heat quantity of the heated gas when no heat treatment of solder or the like is needed is made smaller than a supply heat quantity of the heated gas when heat treatment of solder or the like is needed, reducing consumption power when no heat treatment is needed for a board.

Abstract: Forming solder bumps each having a constant height by surely supplying onto each of electrode pads a solder ball corresponding to a predetermined volume while omitting Au plating performed on the electrode pads onto which the solder bumps are to be formed. For achieving the forming of the solder bumps, the adhesive film is formed instead of the Au plating, the adhesive film being used as an oxidation-preventing film and as film for temporarily fixing each of the solder balls, the solder balls being supplied by stencil mask or the vacuum adsorbing mask.

Abstract: An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.

Abstract: The invention relates to a lead-free solder paste comprising a solder paste flux and solder alloy particles that are substantially lead-free wherein the solder paste flux comprises resin dissolved in a solvent and also includes undissolved resin particles less than 25 &mgr;m in size homogenously dispersed therein to provide improved solder alloy powder coalescence and substrate surface wetting while maintaining appropriate solder paste rheology for use in printed circuit board assembly processes.

Abstract: Laser machining is often carried out using special machines or apparatus, with the workpieces having to be finished afterwards using appropriately equipped cutting machine tools. According to the invention, a laser beam (5) is supplied on the head-stock (17) of a machine tool (13), by means of a beam control tube (12). Said beam radiates into a focussing lens (35) at an articulation point (D). Said articulation point (D) is precisely guided and held in place in a centring cone (36) with its focussing lens (35) located underneath. The laser-machining head can be removed from the headstock (17) by means of a swivel mechanism and the machine (13) can carry out cutting operations in the usual way. The laser-machining operations are carried out before the cutting work in the processing cycle, a zero-offset being provided between the laser machining and the cutting work, correcting any system errors with the help of a computer.

Abstract: There is provided a secondary battery comprising an electrode group comprising a positive electrode, a negative electrode having a negative electrode collector and a negative electrode layer held to the collector, and a separator interposed between the positive electrode and the negative electrode layer, a nonaqueous electrolyte held by the electrode group, and a jacket housing the electrode group and having a thickness of not more than 0.3 mm, wherein the positive electrode, the negative electrode and the separator are formed integral, and the peeling strength between the negative electrode layer and the separator is lower than the peeling strength between the negative electrode layer and the negative electrode collector.

Abstract: During manufacture of certain hollow profiles suitable for use in car body construction the welded profiles are subjected to a further deformation process, namely hydroforming. At present the corresponding welding machines are charged manually. The invention relates to a method and a device for transferring hollow-profile blanks, characterized in that during transfer the positioned fusion faces of the blanks are pressed against each other at least in the area of the weld.

Abstract: A laser repair apparatus comprises a stage for a wafer to be mounted on, a laser beam source for emitting a laser beam, focus adjusting means for adjusting a focus of the laser beam, and focal point measuring means for measuring a focal point of the laser beam with respect to the wafer on the stage, and a system controller for controlling an overall operation of the laser repair apparatus. The focus adjusting means adjusts a focus with respect to each part to be repair-processed. The system controller sets a focal point at a prescribed position in the required part to be repair-processed as a reference focal point. In performing the repair processing at another position, a focal point is detected by the focal point measuring means. The system controller interrupts the repair processing when the focal point is outside an allowable range from the reference focal point.

Abstract: In a friction agitation joining method for joining two plate-shaped joining members butted against each other with a level difference formed at upper surface sides thereof by a joining tool having a probe rotatable about a rotation axis thereof, the butted joining members are arranged so as to be inclined to a horizontal plane with one of the joining members having a higher upper surface level positioned at a lower side and the other at a higher side. Then, the rotating probe is inserted into a butted portion of the joining members or the vicinity thereof in a state that the rotation axis is parallel to a vertical plane extending along the butted portion. Then, the probe is moved relative to the joining members along the butted portion with the probe inserted into the butted portion or the vicinity thereof.

Abstract: Disclosed herein is a lead bonding method for SMD packages. The lead bonding method includes the step of placing a package body with its lead-positioning surface facing upward. A lead with solder is arranged on the lead-positioning surface of the package body using vision system. The lead is spot-welded onto the package body to fix the lead to the package body. The package body spot-welded together with the lead is arranged in a positioning depression of a jig with the lead facing downward. The solder formed on the lead are melted to bond the lead to the package body.

Abstract: The invention provides an apparatus for reducing, or eliminating, ambient air in connection with an excimer laser annealing process. Nozzles are provided to direct a flow of gas, preferably helium, neon, argon or nitrogen, at a region overlying the target area of an amorphous silicon layer deposited on an LCD substrate. The nozzles direct a flow of gas at sufficient pressure and flow rate to remove ambient air from the region overlying the target area. With the ambient air, especially oxygen, removed, the laser can anneal the amorphous silicon to produce polycrystalline silicon with less oxygen contamination. In a preferred embodiment, an exhaust system is also provided to remove the gas.

Abstract: A laser apparatus which operates to mark specified information on a rubber or plastic product, such as a hose. The information is marked using a laser whose energy density per unit time is controlled. The information can.be an alphanumeric information, or a graphic, and can be written while the hose is in motion on a conveyor.

Abstract: An apparatus and method for generating a laser trimming program without causing errors due to development by human hands in a time that does not depend on experiences etc. of a person who generates a program, as well as a recording medium on which a program for execution of such a method is recorded and a laser trimming apparatus using such a program. Fuse coordinate calculation programs are stored in advance in a coordinate calculation program database on a memory core basis and a common portion of an LT program is stored in advance in a common program database. At the time of generating an LT program, type information of a memory core incorporated in a target IC chip is input and a corresponding fuse coordinate calculation program is selected from the fuse coordinate calculation programs stored in the coordinate calculation program database and then loaded.

Abstract: To provide a seam welding apparatus and a seam welding method that may operate at a low pressure to obtain a suitable overlapped alignment amount. In the seam welding apparatus, a trailing plate clamp moving means is provided with link mechanisms for overlapping and aligning a leading end of a trailing plate with a trailing end of a leading plate and a link drive source for operating the link mechanisms under an extended condition. The link mechanisms are arranged in parallel along both side edges of the trailing plate. The pair of link mechanisms are connected to a link drive source to form a parallel link mechanism assembled through a coupling link. Also, a movable portion of the leading plate clamp means has a tilt pivot. This tilt pivot is adapted to be movable so that the overlapped alignment amount may be adjusted.

Abstract: Fastening an attaching eye to the base of a dashpot by welding. The object is to simplify tooling and position the parts more accurately. The eye (3) is fabricated from strip, preferably by rolling or bending, prior to welding and is provided with an outward-tapering V-shaped abutment (4). The base (1) is provided with a transverse W-shaped groove comprising two rounded depressions (5 & 6), their depths and middle elevations (7) dimensioned to ensure that the eye will come into contact with the lateral edges (8 & 9) of the groove. The abutment is more or less in alignment with the groove's elevation.

Abstract: The invention relates to a brazing sheet product comprising a core sheet made of an aluminum alloy, an aluminum clad layer cladding at least one of the surfaces of said core sheet, and a layer comprising nickel on the outersurface of one or both said clad layer or layers, and wherein the brazing sheet product is devoid of a layer comprising zinc or tin as a bonding layer between said outersurface of said aluminum clad layer or layers and said layer comprising nickel, and wherein the aluminum clad alloy layer comprises, in weight percent: Si 2 to 18, Mg up to 8.0, Zn up to 5.0, Cu up to 5.0, Mn up to 0.30, In up to 0.30, Fe up to 0.80, Sr up to 0.20, at least one element selected from the group consisting of: (Bi 0.01 to 1.0, Pb 0.01 to 1.0, Li 0.01 to 1.0, Sb 0.01 to 1.0), impurities each up to 0.05, total up to 0.20, balance aluminum.