Abstract: An efficient and effective process for manufacturing of hardened aluminum components is achieved by coordinating the material preparation steps with the forming steps. The resulting product is a hardened aluminum component with desirable strength characteristics. The process includes initial heating of sheet material in order to prepare it for further processing. The sheet material is then quenched to promote appropriate material conditioning. A product forming sub-process is then undertaken in a relatively short period of time following the quenching. The product forming is done while the material is in a relatively ductile condition, thus easing forming operations, and avoiding product spring-back problems. Lastly, the component is naturally aged, to provide the final hardening operations. The resulting product has very desirable strength characteristics, due to the combined forming and hardening process.

Abstract: A laser marking apparatus and method having an energy source which is not substantially transmissible through the substrate of a semiconductor chip, or the substrate of the semiconductor chip is substantially opaque to the energy source for marking the surface of a semiconductor chip, are described herein.

Abstract: A method of bonding wires between a semiconductor die and a substrate on which the die is mounted includes providing an ultrasonic transducer (1). The transducer (1) includes an ultrasonic energy generation device (2), an ultrasonic vibration amplifying device (3) coupled at one end (10) to the ultrasonic energy generation device (2), a bonding tool (5) coupled to the opposite end (12) of the ultrasonic vibration amplifying device (3), and a mounting structure (4) located between the ends (10, 12) of the ultrasonic vibration amplifying device (3). The method also includes performing a first wire bond by operating the ultrasonic transducer (1) at a first ultrasonic frequency and performing a second wire bond by operating the ultrasonic transducer (1) at a second ultrasonic frequency, the second ultrasonic frequency being different from the first ultrasonic frequency.

Abstract: A method and an arrangement for measuring the cooling rate and temperature differential between the top and bottom surfaces of a printed circuit board. The method is intended to facilitate control over the temperature differential which is encountered between the top and bottom of the printed circuit board so as to prevent warpage thereof during the formation of solder joints in a reflow solder oven.

Abstract: A method of monitoring a ball forming process in a wire bonder. A glow discharge parameter between an electrode on the wire bonder and an end of a wire mounted on the wire bonder on which the ball is being formed is monitored. The monitored parameter is compared with a reference value to determine whether the ball formed is satisfactory.

Abstract: A new soldering technique and solder alloy for wetting and joining hard-to-wet materials including titanium alloys such as nitinol uses a solder alloy containing tin and an active wetting promoting element such as aluminum in the presence of ultrasound. As shown in the Figure, molten solder alloy (10) is applied to the hard-to-wet material (18) with the application of ultrasonic energy (14) which removes coatings (20) such as tenacious surface oxides to leave the base material (18) which is readily wetted by the solder alloy (20).

Abstract: Brazed structures comprising hollow components having a closure component bonded thereto by a metallic brazing alloy for closing off an end of the hollow component are disassembled by locating a wire transport material in the hollow component and covering the open face of the hollow component with a wire fiber material. Heat is then applied to liquefy the brazing alloy which is drawn up into the metal wire fiber material by capillary affect created by the wire transport material.

Abstract: A method of wave soldering a circuit board while avoiding reflow of a solder joint on the topside of the board from heat conducted from the solder wave through at least one via in the board in heat conducting relation with the topside solder joint, comprises subjecting the circuit board to a solder wave and absorbing heat being conducted from the solder wave through the at least one via with an endothermic material in the via hole which undergoes a heat absorbing reaction. The heat absorbing reaction of the endothermic material is preferably a phase change, such as melting. The melted endothermic material is retained in the via hole during wave soldering by capillary forces and a cap on the lower end of the via hole. A disclosed method of making the circuit board includes locating the endothermic material in the via hole by inserting a preform of the endothermic material into the via hole or hot dispensing the endothermic material into the via hole.

Abstract: The present invention relates to a new and improved device adapted for mounting semiconductor components to substrates. More particularly, the device includes a housing and a first member rotatably mounted to the housing. A first interface is formed between the first member and the housing. The device also has a second member mounted in the first member and movable in an axial direction relative to the first member between a first position and a second position. The second member has an engaging mechanism at an end thereof for engaging a semiconductor component. A second interface is formed between the first and second members. The device is also provided with a supplying mechanism for supplying pressurized air to the first and second interfaces so as to form a first air bearing at the first interface and a second air bearing at the second interface.

Abstract: A rectangular alkaline storage battery includes an electrode plate which can be easily prepared and has a high packing density of active material and volumetric energy density. A connected negative electrode plate with hydrogen-absorbing alloy negative electrode plates is bent into a U-shaped form at a central portion (connecting portion). A composite positive electrode plate is then sandwiched by the hydrogen-absorbing alloy negative electrode plates with a separator made of an unwoven polypropylene fabric provided interposed therebetween to prepare an electrode plate unit. Two such electrode plate units are then laminated to form a group of electrode plates.

Abstract: In a method for partial or complete coating of surfaces of components of aluminum and its alloys with a uniform layer of homogeneously distributed solder, fluxing agent and binder for brazing of the components to one another, the solder, fluxing agent and binder are applied in powder form at high speeds up to 180 m/min onto the surfaces provided for brazing by electrostatic powder coating. The powder particles have a particle size of 5 to 30 &mgr;m. The proportion of binder relative to the total quantity of powder is smaller than 35% by weight. The uniform layer of homogeneously distributed solder, fluxing agent and binder has only a thickness of less than 50 &mgr;m. Heat is used melting this layer.

Abstract: Tombstoning susceptibility and reflow peak temperature reduction of solder alloys, in particularly lead-free solder alloys, has been found to be achieved effectively by mixing the solder alloy in the form of an alloy paste with a low melting alloy utilised in powder form, in particular a Bi-containing alloy.

Abstract: A pin standing resin substrate including a resin substrate having a substantially plate-shaped main surface and composed of one of a resin and a composite material containing a resin, and having a pin-pad exposed from the main surface; and a pin soldered to the pin-pad, wherein the pin has been thermally treated by heating so as to soften the pin. The pin has a rod-like portion composed of a copper base metal and an enlarged diameter portion made of the same material as the rod-like portion. The enlarged diameter portion has a larger diameter than the rod-like portion and is formed at one end of the rod-like portion. At least the enlarged diameter portion is soldered to the pin-pad. Also disclosed is a method of making the pin standing resin substrate, a pin for bonding with the resin substrate, and a method of making the pin.

Abstract: Components composed of aluminum or an aluminum alloy with a coating comprising an aluminum-silicon alloy deposited thereon by applying an alkali metal fluorosilicate and heating the resulting treated material. The alloy layer is effectively protected against re-oxidation by a non-corrosive, alkali metal fluoroaluminate layer (e.g. a potassium fluoroaluminate layer) which forms simultaneously.

Abstract: A structural material includes a plurality of discrete, interwoven wires disposed between and fastened to two solid face sheets. Each of the plurality of wires further includes at least two points of contact with each of the two face sheets. Methods for fabricating the aforementioned structural material include an automated methodology for fabricating a relatively inexpensive truss core sandwich panel.

Abstract: The present invention includes a mechanical joint between a die and a substrate that is reflowed by microwave energy and a method of forming such a mechanical joint by printing a solder over a substrate, placing the solder in contact with a bump over a die, reflowing the solder with microwave energy, and forming a mechanical joint from the solder and the bump.

Abstract: This invention provides an improved method of projection welding which enables the sound welding of high-carbon, and high-tension low-alloy steels. A spacer is disposed between two parts to be joined by projection welding. At least one of the parts is made of a high-carbon, or high-tension low-alloy steel. The spacer is a thin sheet, or coating formed on at least one of those parts.

Abstract: An apparatus for placing spheres at predetermined positions on a substrate. The apparatus includes a platform to support the substrate at a first sphere placement position in the apparatus, and a placement station disposed above the platform that places spheres at locations on the substrate. The placement station includes a first container having a chamber to contain spheres, and a first carrier tray having a substantially horizontal upper surface that forms a lower surface of the chamber. The upper surface has a first section and a second section, the second section having a plurality of holes formed therein to receive spheres. The first carrier tray is movable to position the second section between a fill position beneath the first container and a place position disposed over the first sphere placement position.

Abstract: An apparatus and method of supporting lead fingers during a wire bonding process and method of preventing the bonding apparatus and clamping assembly from applying force against the die. The present invention includes the use of a movable arm with a portion that is positionable under a portion of the lead fingers of a lead frame during the wire bonding process to provide increased stability of the lead fingers and prevent the bonding apparatus and clamping assembly from applying force against the die. The present invention also provides for the transfer of heat from the heat block directly to the lead fingers during the wire bonding process. The present invention includes the use of a clamp for stabilizing lead fingers during the wire bonding process.

Abstract: For a pipe joining method using shape memory alloy capable of preventing a shape memory capacity loss due to a pipe's tolerance, a shape memory alloy joint having an inner diameter greater/less than an outer diameter of pipes to be joined is installed at the outer/inner circumference of a pipe joining portion, and the pipes and the shape memory alloy joint are simultaneously enlarged/reduced. In addition, a general metal joint having an inner diameter greater/less than an outer diameter of shape memory alloy pipes to be joined is installed at the outer/inner circumference of a shape memory alloy pipe joining portion, and the shape memory alloy pipes and the general metal joint are simultaneously enlarged/reduced.