Patents Examined by L. Edmondson
  • Friction stir welding method
    Patent number: 6715664
    Abstract: Disclosed is a friction stir welding method of welding a butted portion of work pieces relatively easily and firmly with an improved finish after the butted portion is tack-welded. In the method, a plurality of work pieces are placed to be butted, a plurality of V-shaped grooves are intermittently formed along the butted portion, each of the grooves is tack-welded by using a welding material by TIG welding or MIG welding, deposits in the tack-welded sections are cut and removed so as to be substantially coplanar with a surface of the work pieces, and then friction stir welding is continuously performed over the entire length of the butted portion, and thus, the work pieces are joined.
    Type: Grant
    Filed: November 25, 2002
    Date of Patent: April 6, 2004
    Assignee: Kawasaki Jukogyo Kabushiki Kaisha
    Inventor: Seiichiro Yamashita
  • Method for assembling sheet metals and rigid structure obtained by said method
    Patent number: 6712259
    Abstract: A method for assembling a rigid industrial food-cooking container is disclosed wherein metal sheets respective recesses and projecting elements are first assembled and then shaped to a specific predetermined geometry for receiving the industrial food and the sheets temporarily connected and assembled at right angles, and welded or brazed to cover the entire contact surface between the sheets to provide a leak proof container for the industrial cooking of the food.
    Type: Grant
    Filed: August 14, 2001
    Date of Patent: March 30, 2004
    Assignee: Armor Inox
    Inventors: Claude Dreano, Loïc Jagorel
  • Bonding method and apparatus
    Patent number: 6712111
    Abstract: A carrier tool having a protective ring with a sheet extended over an underside of the ring is used, a semiconductor wafer is made to adhere to the sheet, the semiconductor wafer, being surrounded by the protective ring, is carried from a container device to a bonding stage. Bonding is performed on the bonding stage, and the wafer is carried out to another container device, consequently damage of the wafer is avoided.
    Type: Grant
    Filed: March 11, 2002
    Date of Patent: March 30, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Tetsuya Tokunaga, Takahiro Yonezawa, Hiroyuki Kiyomura, Tatsuo Sasaoka
  • Welding material and method without carrier
    Patent number: 6713707
    Abstract: A welding material is constructed and arranged to be positioned in electrically conductive relation between exterior surface portions of first and second weldable members at a location where the first and second weldable members are to be joined. The welding material includes at least one welding material member constructed of an electrically conductive metallic welding material capable of melting when heated by application of an electrical current. Each welding material member is mounted on the exterior surface of the first weldable member and then positioned between the exterior surfaces of the first and second weldable members to be electrically conductively disposed therebetween.
    Type: Grant
    Filed: January 11, 2002
    Date of Patent: March 30, 2004
    Assignee: Magna International, Inc.
    Inventors: Gianfranco Gabbianelli, Richard D. Ashley, Victor J. Malczewski
  • Method of joining steel products, method of processing junction surfaces of steel products, and reinforcing member
    Patent number: 6711803
    Abstract: The present invention enables to firmly assemble a steel-frame structure. To form a steel-frame structure or to join two steel members being reinforcing members thereof, a slip-proof surface having one or plural concentric higher parts and grooves is formed on the joined surface of one side or both sides of the steel members, and these two steel members are clamped by a connecting member that passes through connecting holes in the state where the first and the second slip-proof surfaces are mutually engaged or not engaged. Thus, joining force between the joined surfaces is increased.
    Type: Grant
    Filed: August 23, 2000
    Date of Patent: March 30, 2004
    Assignee: Takashima Corporation
    Inventor: Kiyokazu Kobayashi
  • Method for forming solder connections on a circuitized substrate
    Patent number: 6708871
    Abstract: A method of forming solder connections on a circuitized substrate having connection pads is provided. A laser ablatable solder mask material, preferably an epoxy, is degassed and then dispensed as a liquid onto the substrate over the circuitization. The surface of the solder mask material as applied is leveled, and the solder mask material is then cured to form a solder mask. Openings are laser ablated in the solder mask material to reveal those connection pads which are to receive solder to form the solder connections. Liquid solder is dispensed under pressure in a confined space into the openings as blades move laterally on top of the solder mask to fill the openings in the solder mask. The solder material is then solidified to form domed solder bumps in the openings.
    Type: Grant
    Filed: January 8, 2002
    Date of Patent: March 23, 2004
    Assignee: International Business Machines Corporation
    Inventor: Mark Vincent Pierson
  • Forming process and system
    Patent number: 6710291
    Abstract: A process forms workpieces in a forming system with at least one forming station. The workpieces are transported from or to the at least one forming station. Outside the time period provided for the forming of a certain workpiece, a machining takes place in the forming system with a local energy feed on this workpiece.
    Type: Grant
    Filed: November 19, 1999
    Date of Patent: March 23, 2004
    Assignee: Schuler Pressen GmbH & Co., KG
    Inventors: Konrad Wegener, Hans Hofele
  • Cartridge type soldering iron with a releasable and replaceable handle
    Patent number: 6710304
    Abstract: The present invention allows a user to select a handle that is ergonomically friendly to a user's hand and replace it with the replaceable handle that is designed to fit over a soldering iron rod. There are a number of advantages to the present invention. One of the advantages is that a user can choose an individual handle with the desired shape, size, color, and material. Another advantage is that since each user has an individual handle, hygiene problems may be minimized. Still another advantage is the cost savings because as the replaceable handle wears out, only the handle needs to be replaced rather than the whole soldering iron.
    Type: Grant
    Filed: October 11, 2001
    Date of Patent: March 23, 2004
    Assignee: Hakko Corporation
    Inventor: Bungo Yokoo
  • Method for producing weld points on a substrate and guide for implementing said method
    Patent number: 6708868
    Abstract: A method for molding and soldering electrical connection pads to the electrical connection-receiving zones of electronic components or circuits includes an operation for the injection of conductive liquid alloy into a guide open at one end placed so as to face the connection-receiving zone of the component. The guide is formed by two separable parts, a mold and an injection matrix, the mold and the injection matrix including passages, with a narrowing of the guide at the level of the separation of the parts, and the parts of the guide are separated while the alloy is in the liquid state. Such a method may find particular application to, as an example, making connection pads for substrates or electronic components.
    Type: Grant
    Filed: October 26, 2001
    Date of Patent: March 23, 2004
    Assignee: Applied Utech
    Inventor: Eric Pilat
  • Laser marking techniques for bare semiconductor die
    Patent number: 6710284
    Abstract: A laser marking apparatus and method having an energy source which is not substantially transmissible through the substrate of a semiconductor chip, or the substrate of the semiconductor chip is substantially opaque to the energy source for marking the surface of a semiconductor chip, are described herein.
    Type: Grant
    Filed: February 26, 1999
    Date of Patent: March 23, 2004
    Assignee: Micron Technology, Inc.
    Inventors: Warren M. Farnworth, Alan G. Wood
  • Methods of bonding solder balls to bond pads on a substrate, and bonding frames
    Patent number: 6705513
    Abstract: In one embodiment, portions of a plurality of solder balls are placed within a frame and in registered alignment with individual bond pads over a substrate. While the ball portions are within the frame, the balls are bonded to their associated bond pads. In another embodiment, a frame is provided having a plurality of holes sized to receive individual balls. Individual balls are delivered into the holes from over the frame. The balls are placed into registered alignment with a plurality of individual bond pads over a substrate while the balls are in the holes. The balls are further bonded. In another embodiment, a frame is provided having a hole. A solder ball is provided having an outer surface. The ball is retained within the hole in an ambient processing environment which is generally uniform over the entirety of the ball's outer surface. While the ball is within the hole, the ball is bonded.
    Type: Grant
    Filed: March 14, 2000
    Date of Patent: March 16, 2004
    Assignee: Micron Technology, Inc.
    Inventors: Warren M. Farnworth, Alan G. Wood
  • Circuit board having improved soldering characteristics
    Patent number: 6707683
    Abstract: A circuit board having improved soldering characteristics having raised structure consisting of spacer pads arranged to provide for vertical distancing of electrical or electronic components from the component side planar surface of the circuit board. Such spacing is complementary to top vented soldering stations where the spacing allows solder process gases to flow unimpeded from the soldering stations through the spacing to atmosphere.
    Type: Grant
    Filed: July 27, 2001
    Date of Patent: March 16, 2004
    Assignee: Daktronics, Inc.
    Inventors: Eric S. Bravek, Randy S. Uehran
  • Use of silver-copper-palladium brazing alloys
    Patent number: 6698644
    Abstract: A single-tube Coriolis mass flow sensor includes a stainless steel sleeve having an unplated interior surface and a titanium member having a cylindrical end inserted into the stainless steel sleeve. The exterior surface of the titanium cylindrical end forms a joint with the unplated interior surface of the stainless steel sleeve. The titanium cylindrical end is brazed to the unplated interior surface of the stainless steel sleeve at the joint, and the stainless steel sleeve exerts compressive stress on the titanium cylindrical end at the joint.
    Type: Grant
    Filed: November 27, 2001
    Date of Patent: March 2, 2004
    Assignee: Endress + Hauser Flowtec AG
    Inventor: Rainer Lorenz
  • Aluminum-comprising target/backing plate structures
    Patent number: 6698647
    Abstract: The invention includes an aluminum-comprising physical vapor deposition target bonded to an aluminum-comprising backing plate to a bond strength of greater than 10,000 pounds/in2. The invention also includes a method of bonding a first aluminum-comprising mass to a second aluminum-comprising mass. The first aluminum-comprising mass has a first surface, and the second aluminum-comprising mass has a second surface. The first and second masses are pressed together to bond the first mass to the second mass. Additionally, the invention includes a method of bonding a physical vapor deposition target material to a backing plate material. The target material and backing plate material are joined in physical contact with one another. The target material and backing plate material are then compressed under a load that progresses sequentially.
    Type: Grant
    Filed: March 10, 2000
    Date of Patent: March 2, 2004
    Assignee: Honeywell International Inc.
    Inventor: Jaeyeon Kim
  • Stress relieved lower shell for sealed compressors
    Patent number: 6695201
    Abstract: A lower shell for a sealed compressor includes a shape with a plurality of intricate bends. In particular, u-shaped sections are stamped into a plainer sheet of material to form the lower shell. This stamping process can cause brittleness in the lower shell. Thus, after the stamping process, the lower shell is subjected to a heat-treating process to reduce the brittleness. After the heat-treating process a center shell is welded to the lower shell.
    Type: Grant
    Filed: August 23, 2001
    Date of Patent: February 24, 2004
    Assignee: Scroll Technologies
    Inventors: Sudarshan K. Narasipura, Gregory W. Hahn
  • Method of producing electronic part with bumps and method of producing electronic part
    Patent number: 6695200
    Abstract: Forming solder bumps each having a constant height by surely supplying onto each of electrode pads a solder ball corresponding to a predetermined volume while omitting Au plating performed on the electrode pads onto which the solder bumps are to be formed. For achieving the forming of the solder bumps, the adhesive film is formed instead of the Au plating, the adhesive film being used as an oxidation-preventing film and as film for temporarily fixing each of the solder balls, the solder balls being supplied by stencil mask or the vacuum adsorbing mask.
    Type: Grant
    Filed: October 10, 2002
    Date of Patent: February 24, 2004
    Assignee: Hitachi, Ltd.
    Inventors: Takamichi Suzuki, Yoshihide Yamaguchi, Noriyuki Oroku, Kosuke Inoue
  • Apparatus and method for welding aluminum tubes
    Patent number: 6689982
    Abstract: An apparatus and method for welding members that are formed at least in part of aluminum. A welding assembly is constructed and arranged to position a welding material in electrically conductive relation between exterior surface portions of first and second weldable members at a location where the first and second weldable members are to be joined. The welding material assembly includes at least one welding material member mounted on a flexible carrier sheet in a predetermined arrangement with each welding material member being constructed of an electrically conductive metallic welding material capable of melting when heated by application of an electrical current. A welding method includes alternatively attaching the welding material members to a weldable member without a carrier sheet, by a welding process.
    Type: Grant
    Filed: January 11, 2002
    Date of Patent: February 10, 2004
    Assignee: Magna International, Inc.
    Inventors: Gianfranco Gabbianelli, Richard D. Ashley, Victor J. Malczewski
  • Individual selective rework of defective BGA solder balls
    Patent number: 6685080
    Abstract: A method for reworking a ball grid array (BGA) of solder balls including one or more defective solder balls on an electronic component workpiece using a single-ball extractor/placer apparatus having a heatable capillary tube pickup head optionally augmented with vacuum suction. A defective solder ball is identified, extracted by the pickup head and disposed of. A nondefective solder ball is picked up by the pickup head, positioned on the vacated attachment site, and thermally softened for attachment to the workpiece. Flux may be first applied to the replacement solder ball or to the vacated attachment site. The extractor/placer apparatus may be automated to locate, extract and replace defective balls for completion of a fully operable BGA.
    Type: Grant
    Filed: October 20, 2000
    Date of Patent: February 3, 2004
    Assignee: Micron Technolgy, Inc.
    Inventors: Kwan Yew Kee, Chew Boon Ngee, Keith Wong Bing Chiang
  • Method of an apparatus for heating a substrate
    Patent number: 6686565
    Abstract: A method of uniformly or substantially uniformly heating at least one surface of a substrate, comprises the steps of supporting a substrate, generating a heated air flow, directing the heated air flow to heat a strip of a first surface of the substrate, and moving the flow path of the heated air in a direction transverse to the direction in which the heated air flow impinges on the substrate until the temperature of the whole or substantially the whole first surface of the substrate has been uniformly or substantially uniformly raised. Apparatus for performing this method is also disclosed.
    Type: Grant
    Filed: July 11, 2001
    Date of Patent: February 3, 2004
    Assignee: Planer Products, Limited
    Inventors: Paul Lakra, Stephen James Butler
  • Method and apparatus for prefabricating modular structural members
    Patent number: 6681981
    Abstract: Novel prefabricated modular structural members for use in low cost construction of relatively small residential, institutional and commercial buildings with high degrees of resistance to damage by fire, hurricanes, earthquakes, moisture, etc., are disclosed. A structural member of this class basically consists of two spaced shell panels and an intermediate core. The core is a triangulated wire frame composed of a plurality of zig-zag shaped wire trusses having their sets of top and bottom apexes anchored to associated sets of longitudinal and transverse chords and the respective proximate inside faces of the shell panels. A fixture is provided which includes posts for holding the wires before they are welded. The posts and a coupling member such as a welding gun can move with respect to each other to form the joints between the wires.
    Type: Grant
    Filed: January 12, 2001
    Date of Patent: January 27, 2004
    Assignee: IBI, Inc.
    Inventor: Richard Paroly