Patents Examined by L. Edmondson
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Patent number: 6639176Abstract: For the manufacture of composite panels (16) it is proposed that they be held essentially upright by means of holding devices (17) and that welding by means of a laser welding plant (11, 13) be performed in this position. This affords a considerable space saving compared with the conventional horizontal arrangement in which the composite panels are processed and handled.Type: GrantFiled: May 14, 2001Date of Patent: October 28, 2003Assignee: Elpatronic AGInventor: Werner Urech
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Patent number: 6635843Abstract: To provide a strip connecting apparatus and a method therefor which are less costly, short in welding time and high in welding quality. A strip connecting apparatus is provided with: a surface coating removing device for removing insulative surface coating of end portions, to be welded, of a leading strip and a trailing strip before cutting the strips; a cutting device for cutting the end portions, to be welded, of the leading strip and the trailing strip; and a welding device for overlapping the cut end portions of the leading strip and the trailing strip and seam welding the cut end portions with each other.Type: GrantFiled: May 25, 2000Date of Patent: October 21, 2003Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Akimichi Takeda, Keiji Sodeno, Masaru Yoshida
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Patent number: 6634541Abstract: A method of manufacturing a container formed of five rectangular metal panels including a bottom panel, opposed side panels and opposed end panels, each panel having peripheral edges there around, including the steps of forming spaced apart notches leaving interpositioned tab portions in peripheral edges of the panels, positioning the bottom panel horizontally, positioning the two side panels and two end panels vertically around the periphery edges of the bottom panel forming four vertical and four horizontal panel intersections with tab portions aligned with mating notches at each of the panel intersections and welding the four vertical and four horizontal panel intersections to physically interconnect the five panels to provide an open top rectangular container.Type: GrantFiled: March 22, 2001Date of Patent: October 21, 2003Inventors: James D. Hankey, Ray J. Hankey
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Patent number: 6631838Abstract: A method for fabricating a printed circuit board includes the steps of: fabricating a printed circuit board having at least one collapsed portion; depositing a first solder resist in the collapsed portion; exposing the first solder resist-coated printed circuit board at a pressure lower than atmospheric pressure for a predetermined time; coating a second solder resist on the entire surface of the printed circuit board; and drying and hardening the first and the second solder resists. With this method, when a solder resist is coated, since an air space does not remain in a blind via hole, the reliability of the attachment between a printed circuit board and the solder resist layer is increased.Type: GrantFiled: April 11, 2001Date of Patent: October 14, 2003Assignee: LG Electronics Inc.Inventors: Nam-Jin Kim, Young-Cheol Ahn, Won-Jae Kim
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Patent number: 6629631Abstract: A pressure gauge or monitor is attached to a soldering iron so that the pressure with which the iron is being applied can be precisely monitored. Such a pressure monitor on a soldering iron can be used to monitor the pressure applied with the soldering iron when forming a solder electrode on an anti-reflective film of a cathode ray tube. This allows such electrodes to be consistently and optimally formed for grounding the anti-reflective film.Type: GrantFiled: June 4, 2001Date of Patent: October 7, 2003Assignees: Sony Corporation, Sony Electronics, Inc.Inventor: David Allen Murtishaw
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Patent number: 6629632Abstract: An apparatus and method for welding a shaft having an open seam defined between opposed longitudinal edges. The method comprising passing the shaft along its longitudinal axis through an array of pressure rollers which contact the surface of the shaft at a plurality of discrete points and compress the shaft by applying inwardly directed radial forces to the shaft. An electrical resistance welding assembly welds the seam while closed by the pressure rollers.Type: GrantFiled: November 3, 2000Date of Patent: October 7, 2003Assignee: IUSRD (Ireland) LimitedInventors: Robert G. J. Jack, Geoffrey Brook
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Patent number: 6626350Abstract: A method is available for repairing metallic components such as gas turbines, which have mechanically weight-carrying grooves, where the longitudinal edges of the grooves which exist on the component surface are largely in a plane and their actual contour deviates, at least locally, due to removal and/or displacement the component material from the desired contour. The method begins with abrasive blasting of the groove surfaces, followed by closing of the open groove ends by build-up welding, and subsequent filling of the grooves with soldering powder. The soldering powder is heated to liquefaction, then cooled and solidified in a vacuum, and the desired contour of the groove is then machined.Type: GrantFiled: June 25, 2001Date of Patent: September 30, 2003Assignee: MTU Aero Engines GmbHInventor: Reinhold Meier
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Patent number: 6626351Abstract: By utilizing a roll bonding process and appropriately forming steps, a load bearing structure is created which is capable of handling and appropriately transferring loads. One preferred method includes the combination of roll bonding and hydroforming to efficiently create structural components. While various product configurations are possible, one version includes a waffle-type structure produced by appropriate roll bonding of material sheets. This waffle-type structure can also undergo additional forming steps to create several structural components capable of handling and carrying loads in a very efficient and effective manner. More significantly, this process enables the use of structural aluminum for load bearing components which are efficiently and cost effective when manufactured.Type: GrantFiled: May 4, 2001Date of Patent: September 30, 2003Assignee: Tower Automotive Technology Products, Inc.Inventors: Lawrence M. Dziadosz, Clarence W. Fulton
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Patent number: 6627840Abstract: A method and machine for deburring the burr which is formed when wires are butt welded is disclosed. The machine comprises a deburring head which has a pair of opposed deburring rollers mounted thereon. Each of the rollers has a milled surface formed therein. A linkage is connected to the rollers to cause the rollers to rotate when the linkage is moved between first and second positions. When the linkage is in its first position, the milled surfaces of the rollers face one another to enable the wires and burr to be positioned therebetween. As the linkage moves to its second position, the circumferences of the rollers engage the burr to roll out the same, thereby providing a substantially smooth, cylindrical surface where the burr was located. The method of deburring is also disclosed.Type: GrantFiled: March 9, 2001Date of Patent: September 30, 2003Assignee: Revelation Technologies, LLCInventor: Jimmie C. Raley
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Patent number: 6627841Abstract: A method for designing a weld fixture. The method includes modeling a set of distortions produced by applied mechanical forces on a material to be welded, modeling a set of distortions produced by applied thermal forces on the material to be welded, determining a set of reaction forces at a series of locations on a simulated weld fixture as a function of the modeled distortions, and designing a weld fixture as a function of the set of reaction forces.Type: GrantFiled: May 9, 2001Date of Patent: September 30, 2003Assignee: Caterpillar Inc.Inventors: Xiao Chen, Yi Dong, Edward T. Martin, Zhishang Yang, Wayne Tanner
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Patent number: 6624382Abstract: Economical production of configured, laser-drilled, high-precision, ultra-miniature multiple-via-hole patterns is accomplished by multiplexing the homogenized, shaped, nearly-collimated output of one or more high-power excimer lasers into a set of beamlines, differently configured at different depths through the thickness of the substrate. A substrate delivery subsystem provides a continuous supply of film substrate strips or segments, which may be blanks or intermediates. Various stencils in a mask provide a cup-shaped partial hole, which is subsequently provided with a mating stem hole. Each stem portion of each hole is laser-drilled into the bottom of the cup portion from either above or below to form a via-hole with a desired configuration, such as stem-glass (or cup/funnel), as desired for multi-micro-via-hole arrays for filtering or for forming clog-resistant aerosol nozzles.Type: GrantFiled: June 16, 2001Date of Patent: September 23, 2003Assignee: Anvik CorporationInventor: Carl C. Kling
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Patent number: 6622905Abstract: An apparatus, comprising a substrate having a surface, comprising one or more solder pads, each having a center and connected to a via, each via having a center; positioned relative to the surface such that at least one of the one or more solder pad centers is offset from the connecting via center and an area of the at least one of the one or more solder pads overlaps an area of the connecting via.Type: GrantFiled: December 29, 2000Date of Patent: September 23, 2003Assignee: Intel CorporationInventors: Daniel E. Shier, Phil Geng, Scott N. Dixon
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Patent number: 6621037Abstract: A welding material assembly is constructed and arranged to position a welding material in electrically conductive relation between exterior surface portions of first and second weldable members at a location where the first and second weldable members are to be joined. The welding material assembly includes at least one welding material member mounted on a flexible carrier sheet in a predetermined arrangement with each welding material member being constructed of an electrically conductive metallic welding material capable of melting when heated by application of an electrical current. Each welding material member is mounted on the sheet such that when the sheet is placed between the exterior surfaces of the first and second weldable members to be welded, each welding material member is electrically conductively disposed therebetween.Type: GrantFiled: January 11, 2002Date of Patent: September 16, 2003Assignee: Magna International Inc.Inventors: Gianfranco Gabbianelli, Richard D. Ashley, Ralph Miller
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Patent number: 6620548Abstract: A sealed type alkaline storage battery in which the entire surface of a positive electrode plate is opposed to a negative electrode plate through a separator, wherein a discharge capacity ratio of the negative electrode plate to the positive electrode plate is determined to be more than or equal to 1.9, an area ratio of the negative electrode plate to the positive electrode plate is determined to be less than or equal to 1.4, and the thickness of the positive electrode plate is determined to be less than or equal to 0.Type: GrantFiled: March 30, 2000Date of Patent: September 16, 2003Assignee: Sanyo Electric Co., Ltd.Inventors: Kousuke Satoguchi, Masao Takee
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Patent number: 6621034Abstract: The method includes the steps of preparing a die main body; performing batch supply hole machining with respect to one principal plane of the die main body to form batch supply holes; using a cutting apparatus to perform slit machining with respect to the other principal plane of the die main body to form slits; without removing the cutting apparatus from the die main body, continuously performing lateral hole machining to form the batch bold portions, which are arranged at least at intersecting portions in the die main body between the batch supply holes and the slits and are arranged corresponding to the slits; and there after removing the cutting apparatus from the die main body to thereby form an integral die. Alternatively, the above slit machining and continuously performing lacteral hole machining steps can be performed first and followed by performing the batch supply hole machining step.Type: GrantFiled: December 8, 2000Date of Patent: September 16, 2003Assignee: NGK Insulators, Ltd.Inventors: Yukinari Shibagaki, Yoshimasa Kondo, Takeyuki Ishii
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Patent number: 6620265Abstract: A method for manufacturing an aluminum alloy fin material brazing comprises forming an ingot sheet by casting a molten liquid of an aluminum alloy by a continuous casting rolling method, and cold-rolling the ingot sheet to prepare a fin material. The aluminum alloy contains prescribed amounts of Mn, Fe, and Si, with the balance being Al and inevitable impurities. The continuous cast-rolling is applied under each a prescribed condition of a molten liquid temperature, a roll press load, a casting speed, and a thickness of the ingot sheet. Two or more intermediate annealings are applied midway in the cold-rolling process, with intermediate annealing including final intermediate annealing with a heating furnace in prescribed temperature range, thereby adjusting the prescribed rolling ratio in the cold-rolling, after the final intermediate annealing.Type: GrantFiled: May 20, 2002Date of Patent: September 16, 2003Assignee: The Furukawa Electric Co., Ltd.Inventors: Akira Kawahara, Takeyoshi Doko
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Patent number: 6619530Abstract: A tension mechanism that applies a back tension to a wire in a bonding apparatus including: a first nozzle which has a through-hole through which the wire passes, second and third nozzles which have diameters that are larger than the diameter of the through-hole of the first nozzle and which are disposed above and below the first nozzle, a first air passage formed in the joining surfaces of the first nozzle and second nozzle, and a second air passage formed in the joining surfaces of the second nozzle and third nozzle. A compressed air supply device is connected to the tension mechanism and supplies compressed air to the first air passage from an air supply source, and a vacuum suction device is also connected to the tension mechanism and applies vacuum suction to the second air passage from a vacuum supply source.Type: GrantFiled: September 7, 2001Date of Patent: September 16, 2003Assignee: Kabushiki Kaisha ShinkawaInventors: Hiroshi Ushiki, Tooru Mochida
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Patent number: 6619537Abstract: A sputter target assembly including a high purity copper sputter target diffusion bonded to a backing plate, preferably composed of either aluminum, aluminum alloy, aluminum matrix composite materials, copper, or copper alloy, and a Ni-alloy interlayer, preferably composed of Ni—V, Ni—Ti, Ni—Cr, or Ni—Si, located between and joining the target and backing plate, and a method for making the assembly. The method of making involves depositing (e.g., electroplating, sputtering, plasma spraying) the interlayer on a mating surface of either the sputter target or backing plate and pressing, such as hot isostatically pressing, the sputter target and backing plate together along mating surfaces so as to form a diffusion bonded sputter target assembly.Type: GrantFiled: June 12, 2001Date of Patent: September 16, 2003Assignee: Tosoh SMD, Inc.Inventors: Hao Zhang, Jeff Hart, Ann Bolcavage
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Patent number: 6619538Abstract: A flexible plating method by continuously controlling the hydrogen concentration of the plating bath by adding controlled amounts of hydrogen gas. The control of the hydrogen concentration is provided by selected distribution and number of nozzles and size of orifices; and predetermined pressure and duration of hydrogen gas flowing through the nozzles, wherein pressure and duration may be variable with time. The control of the hydrogen concentration is selected to provide a ramp-up phase, needed for a rapid plating start, followed by a saturation phase, for consistent plating stability. With metal layer plating under control, a robust, reliable and low-cost metal structure enabling electrical wire connections to the interconnecting copper metallization of ICs is formed. The structure comprises a layer of barrier metal, preferably nickel, that resists copper diffusion, deposited on the non-oxidized copper surface.Type: GrantFiled: May 2, 2002Date of Patent: September 16, 2003Assignee: Texas Instruments IncorporatedInventors: Howard R. Test, Homer B. Klonis
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Patent number: 6616032Abstract: A refractory braze composition and process for assembling alumina-containing parts to another alumina-based material, metal or a metal alloy by reactive or non-reactive refractory brazing using a braze composition provide assemblies entirely of alumina or containing alumina and a metal or metal alloy. The braze composition is non-reactive with alumina or a reactive composition, whose reactivity with alumina is controlled, and it is formed of aluminium, of titanium, and of a matrix made up either of palladium, or of nickel, or of a nickel and palladium alloy.Type: GrantFiled: June 22, 2001Date of Patent: September 9, 2003Assignee: Commissariat a l'Energie AtomiqueInventors: Adrien Gasse, Nicolas Eustathopoulos