Abstract: A room temperature or low temperature curable epoxy formulation including a) an epoxy component including at least one epoxy resin and b) a hardener component including at least one compound of formula (I) wherein X is a divalent hydrocarbon group, which optionally contains one or more heteroatoms, and n is 0, 1, 2 or 3, preferably 0 or 1, and/or at least one epoxy-amine adduct, which is a reaction product of the compound of formula (I) and an epoxy compound selected from at least one of a monoepoxide and a polyepoxide, as a curing agent. The compounds of formula (I) and the epoxy-amine adduct are suitable as curing agents for epoxy formulations which provide good surface properties and good cure speed, even at low temperature curing. In particular, amine blushing can be avoided or reduced to a large extent, when these curing agents are used.

Abstract: Disclosed and claimed herein is a composition for forming a spin-on hard-mask, having a fullerene derivative and a crosslinking agent. Further disclosed is a process for forming a hard-mask.

Abstract: An advanced epoxy resin including a reaction product of (A) at least one epoxy resin; (B) at least one cashew nutshell liquid; and (C) at least one multifunctional carboxylic acid; a curable epoxy resin composition prepared using the above advanced epoxy resin; and the use of the above curable epoxy resin composition to prepare a coating.

Abstract: The invention relates to structural adhesive compositions and more particularly to two-component (2K) structural adhesive compositions. The two components chemically react to bond structural surfaces. N-(3-Aminopropyl)cyclohexylamine (APCHA) has been found to be an improved curing agent for use with epoxy resins in 2K adhesive compositions. APHCA exhibits favorable features including viscosity, pot life and reactivity, and adhesive and thermal performance after curing with epoxy resin. These features and its unique chemistry allow the use of APCHA in curing agent formulations for structural adhesives, in particular wind turbine blade adhesives. APCHA solves issues with viscosity build-up, working time, through-cure, compatibility and adhesive performance that cannot be addressed with the commonly used amine formulations.

Abstract: An epoxy resin composition excellent in storage stability and curability is provided. Particularly, a compound of general formula (I) and an epoxy resin composition containing the compound as a curing agent are provided. In formula (I), R1 is a hydrocarbon group optionally containing a nitrogen atom and capable of forming a cyclic structure optionally having a substituent; R2 is a hydrogen atom, an alkyl group, or an aryl group or is taken together with R1 to form an unsaturated bond; R3 is a hydrogen atom, an alkyl group, or an aryl group; and X is a dicyanamide ion or a thiocyanate ion.

Abstract: A reinforced polymer composite includes a polymer matrix and a strengthening agent. The strengthening agent includes highly crystalline cellulose nanocrystals (CNC) and a stabilizing agent. The crystalline cellulose nanocrystals (CNC) have dimensions of about 3 to 5 nm in width and about 100 to 300 nm in length and a density of about 1.6 g/cm3 and the stabilizing agent may be one of Boehmite nanoclay (Boe) and Cetyltrimethylammonium Bromide (CTAB) or a combination of both.

Abstract: An epoxy resin composition comprising a blend of at least (i) at least one epoxy group containing a polycyclic group, and (ii) at least one epoxy group that is different from the epoxy resin in component (i). As exemplary of component (i) is an epoxidized tricyclo decanedimethanol. A renewable epoxy of component (ii) is cardanol epoxy, derived from cashew nut shell oil (CNSL). Optionally, a component (iii) which is any other epoxy from that of (i) and (ii) can be included, such as Bisphenol-A/F diglycidal ether. The blend is characterized by low viscosity, making it amenable to airless spray application, high solids content and excellent solvent resistance and abrasion resistance.

Abstract: The present invention pertains to a prepreg containing reinforcing fibers and an epoxy resin composition. Said prepreg is sandwiched between dies preheated to 140.degree.C. and pressurized to MPa and held for five minutes at this temperature to obtain a cured article having a G?Tg of at least 150.degree.C. The present invention also pertains to a fiber-reinforced composite material and a method for producing same. According to this invention, it is possible to provide a prepreg which is well suited to press-molding, particularly to high-cycle press-molding. It is also possible to provide a fiber-reinforced composite material which can be heat-cured at a lower temperature and over a shorter time than conventional methods, with which it is possible to minimize excessive flow of resin in hot-press curing, and which is resistant to performance defects such as fiber meandering and defects in surface appearance. A method for producing the same can also be provided.

Abstract: The present invention relates to a polymer composition with improved long-term stability which comprises at least one thermoplastic polymer, carbon nanotubes, at least one antioxidant and also at least one additive or consists hereof. In addition, the present invention relates to molded parts which can be produced from the polymer compositions according to the invention. The invention likewise indicates possibilities for use of the polymer composition or of the molded parts.

Abstract: Provided is a flexible wiring board having high durability. The present invention provides a flexible wiring board including a flexible substrate and a conductive film formed on the flexible substrate. The conductive film contains a conductive powder and a curd product of a heat curable resin. The conductive film has pencil hardness of at least 2H, based on a pencil scratch hardness test in accordance with JIS K5600 5-4 (1999). The conductive film has adhesiveness of at least 95/100 by a 100 squares cross-cut test in accordance with JIS K5400 (1990).

Abstract: Described is a super elastic epoxy hydrogel that is easy to manufacture and can be engineered for various performance enhancements of the polymer. Also described are methods of enhancing the performance of this hydrogel and other hydrogels. Various polymer hydrogel composites, structures, and their uses are included, such as the actuator element comprising the hydrogel of the invention depicted in FIG. 2.

Abstract: Pre-impregnated composite material (prepreg) that can be cured/molded to form aerospace composite parts. The prepreg includes carbon reinforcing fibers and an uncured resin matrix. The resin matrix includes an epoxy component that is a combination of a hydrocarbon epoxy novolac resin and a trifunctional epoxy resin and a tetrafunctional epoxy resin. The resin matrix includes polyethersulfone as a toughening agent and a thermoplastic particle component that includes a mixture of polyamide particles and polyimide particles.

Abstract: A cermet tool includes from 75-95 volume % of a hard phase and from 5-25 volume % of a binder phase. The hard phase has a first hard phase with a core portion of (Ti, Nb, Mo) (C, N) and a peripheral portion of (Ti, Nb, Mo, W) (C, N) or (Ti, Nb, Mo, W, Zr) (C, N), a second hard phase with both a core portion and a peripheral portion of (Ti, Nb, Mo, W) (C, N) or (Ti, Nb, Mo, W, Zr) (C, N), and a third hard phase of (Ti, Nb, Mo) (C, N). The ratio of Nbs/Nbi is from 0.8 to 1.2, where Nbs is a maximum Nb amount in a surface region and Nbi is an internal Nb amount in an internal region. The ratio of Ws/Wi is from 1.0 to 1.5, where Ws is a maximum W amount in the surface region and Wi is an internal W amount in the internal region. The area ratios A1, A2, and A3 of the respective hard phases are from 75 to 95 area % for A1, from 4 to 24 area % for A2, and from 1 to 24 area % for A3.

Abstract: Provided are an elastomer composition including epoxy resin, acrylate resin, an organic filler, an inorganic filler, a cross linking agent, a hardener, an initiator and a solvent, and a magnetic ferrite for a wireless power transmitting and receiving device, the magnetic ferrite being coated with the elastomater composition having an elastic restoring force not to be damaged by a physical impact applied from the outside. According to embodiments of the present invention, the magnetic ferrite having improved impact resistance can be provided by being coating with the elastomer composition having the elastic restoring force, and thus an existing problem such as a reduction in magnetic property caused by damage to the ferrite resulting from an external impact can be solved.

Abstract: The invention relates to cationic water-dilutable binders comprising a water-soluble bismuth salt or chelate complex B, and a chain-extended epoxy-amine adduct EA which comprises moieties derived from epoxide compounds E2 having at least two epoxide groups per molecule, low molar mass epoxide compounds E3 having two epoxide groups per molecule, amidoamines A41 having at least one amide group and at least one amino group, made from amines A1 having at least two amino groups per molecule and a fatty acid A4, and one or more further amines A1, an amine A2 which has at least one secondary amino group per molecule, an amine A3 having at least one tertiary, and at least one primary amino group per molecule, fatty acids A4, and phenolic compounds A5 having at least two phenolic hydroxyl groups, to a process for their preparation, and to the use thereof as corrosion protection coatings.

Abstract: An adhesive composition for a polarizing plate of the present invention comprises, on the basis of 100 parts by weight of a polymerizable component: the polymerizable component comprising (A) approximately 50-90 parts by weight of an epoxy group-containing compound and (B) approximately 10-50 parts by weight of a (meth)acrylate monomer; (C) approximately 1-7 parts by weight of a photoacid generator; and (D) approximately 0.

Abstract: A thiol group-containing polymer represented by: HS—(R—Sr)n—R—SH wherein R is an organic group including a —O—CH2—O— bond and a branched alkylene group, n is an integer of from 1 to 200, r is an integer of from 1 to 5, an average value of r is 1.1 or more and lower than 1.8, and the thiol group-containing polymer is a liquid at room temperature and has a specific gravity at 23° C. of 1.20 to 1.27.

Abstract: An epoxy curing agent is disclosed that can be obtained by reacting at least one carboxylic acid with at least one polyamine. The disclosed curing agent can be obtained by preparing an amidoamine with about 0.15 to about 0.30 molar excess of carboxylic acid.

Abstract: To provide a composition which satisfies a high K1c value, a high glass transition temperature and a low viscosity simultaneously, and which is capable of forming an interlayer filler layer for a layered semiconductor device of which stable bonding is maintained even regardless of changes of environment. A composition comprising an epoxy compound (A) having a viscosity at 25° C. of at most 50 Pa·s, an amine compound (B) having a melting point or softening point of at least 80° C., and an amine compound (C) having a melting point or softening point of less than 80° C., wherein the proportion of the amine compound (C) is at least 1 part by weight and less than 40 parts by weight per 100 parts by weight of the total amount of the amine compound (B) and the amine compound (C).

Abstract: An epoxy resin exhibits a small change in volume after thermal history, is excellent in low thermal expansion and low moisture absorption, and has high heat resistance, in terms of a cured product obtained therefrom; a curable resin composition; a cured product which has all the above properties; a semiconductor encapsulating material; a semiconductor device; a prepreg; a circuit board; a buildup film; a buildup substrate; a fiber-reinforced composite material; and a molded article. The present invention is characterized by an epoxy resin, characterized by including as essential components, a cresol-naphthol co-condensed novolac type epoxy resin (A), a naphthol glycidyl ether compound (B), and one or more xanthene compounds (C) selected from the group of compounds represented by the following structural formulae (1) to (3), wherein the content of the xanthene compound(s) (C) is from 0.1% to 5.5% in terms of area ratio in a GPC measurement.