Abstract: The invention relates to a curing agent for thermosetting epoxy resins comprising (a) at least one aromatic amine containing at least two amino groups, and (b) at least one clathrate compound obtained by reacting a tetrakisphenol of the formula (1), or a 9,9-Bis(4-hydroxyphenyl)fluorene of formula (2), as the host molecule, and an imidazole or an imidazolium derivative as the guest molecule, wherein the substituents are as defined in the description, and n is the number 0, 1, 2 or 3, which can advantageously be used for the curing of epoxy resins. In addition, the invention also relates to a process for the preparation of a cured article, a process for the preparation of insulation systems for electrical engineering and a cured article obtained by the processes.

Abstract: A hybrid article comprises a disintegrable metal comprising one or more of the following: Mg; Al; Zn; Mn; an alloy thereof; or a composite thereof; and a disintegrable polymer comprising one or more of the following: an epoxy polymer derived from an epoxy base and a curing agent having cleavable bonds; a cured cyanate ester; or a poly(hexahydrotriazine).

Abstract: Provided is a molded article that has such a shape as to offer a light condensing or light diffusing effect, has excellent mechanical strengths and heat resistance, and has a high thickness deviation ratio. This molded article includes a cured product of a curable composition containing an epoxy compound (A). The cured product has a flexural modulus of 2.5 GPa or more as measured in conformity with JIS K 7171:2008, except for performing measurement on a test specimen having a length of 20 mm, a width of 2.5 mm, and a thickness of 0.5 mm and at a span between specimen supports of 16 mm. The molded article has a thickness deviation ratio (thickest portion thickness to thinnest portion thickness ratio) of 5 or more and offers a light condensing or light diffusing effect. The molded article preferably has a thinnest portion thickness of 0.2 mm or less. The curable composition is preferably a photocurable composition.

Abstract: An epoxy resin composition produces a cured product having improved elastic modulus and improved nominal strain at compressive fracture. The epoxy resin composition is a fiber-reinforced composite material having excellent compression strength and interlayer toughness. The epoxy resin composition contains at least the following constituent components [A], [B] and [C]. [A] A specific ortho type epoxy resin. [B] At least one component selected from the group consisting of: thermoplastic resins that are compatible with the epoxy resin [A]; and core-shell type polymers. [C] An amine curing agent.

Abstract: This invention relates to a tire with a tread of a rubber composition for promoting a combination of beneficial wet traction and reduced rolling resistance, while limiting any loss of winter traction at low temperatures. The tread rubber composition contains a combination of high and lower glass transition temperature (Tg) elastomers. Its reinforcing filler is primarily precipitated silica. The high Tg elastomer is comprised of synthetic high vinyl polybutadiene rubber and the lower Tg elastomer is comprised of at least one of natural and synthetic cis 1,4-polyisoprene rubber. The tread rubber composition may contain at least one of vegetable oil based rubber processing aid and traction promoting resin. The tread rubber composition is intended to be exclusive of styrene-containing elastomers.

Abstract: A resin composition is provided, which includes an oligomer formed by reacting bisphenol epoxy resin monomer, aliphatic diglycidyl ether, anhydride compound, and catalyst, wherein the molar ratio of epoxy groups of the bisphenol epoxy resin monomer and aliphatic diglycidyl ether to anhydride groups of the anhydride compound is between 3.5:1 and 8.8:1. The bisphenol epoxy resin monomer and aliphatic diglycidyl ether have a molar ratio of 0.3:1 to 1.3:1, and the viscosity of the resin composition is 20 Pa·s to 80 Pa·s at 25° C.

Abstract: A coated article comprises an article comprising a surface and a galvanic barrier coating disposed on the surface. The galvanic barrier coating is formed from a galvanic barrier coating composition comprising (a) a thermoplastic resin, (b) an epoxy-based resin, (c) a curing agent, and (d) non-compressible, non-marring microsphere particles. Methods of preparing and using the coated article are also disclosed.

Abstract: The present invention disclosed novel epoxy novolac composite comprising environmentally friendly toughening agents based on bio-derived chemicals namely, Difunctional glycidyl ether epoxy resin (Cardolite NC-514) and Polyglycidyl ether of an alkenyl phenol formaldehyde novolac resin (Cardolite NC-547) used for the toughening of epoxy novolac resin namely Poly[(phenyl glycidyl ether)-co-formaldehyde] [PPGEF].

Abstract: This invention relates to a composite material comprising a core comprising an organosilica such as a polyhedral oligomeric silsesquioxane (POSS) and a functionalized elastomeric polymer such as poly(n-butyl acrylate) bonded onto said core. The elastomer is preferably functionalised with an amine moiety. The present invention also relates to a polymer comprising a resin such as Bisphenol A diglycidylether (DGEBA) and the aforementioned composite material, and a method for making the composite material. The composite material can improve both the material strength and material toughness of the polymer into which it is mixed.

Abstract: The present invention is a resin composition characterized by being able to undergo elastic deformation, having little residual strain rate and exhibiting stress relaxation properties. More specifically, the present invention relates to a resin composition wherein the stress relaxation rate (R) and the residual strain rate (?), as measured in a prescribed extension-restoration test, are as follows: 20%?R?95% and 0%???3%.

Abstract: A method of production of a polyether rubber containing unit expressed by the following general formula (1) in 0.1 mol % or more and less than 30 mol % obtained by reacting a polyether rubber containing epihalohydrin monomer unit in 0.1 mol % or more and a nitrogen atom-containing aromatic heterocyclic compound by kneading in the presence of an acid acceptor containing at least a hydrotalcite having a nitrogen adsorption specific surface area as measured by a BET method of 10 m2/g or more is provided. wherein, in the above general formula (1), A+ is a group containing a cationic nitrogen-containing aromatic heterocyclic ring, and is bonded with a carbon atom at the “2” position shown in the above general formula (1) through a nitrogen atom constituting the cationic nitrogen-containing aromatic heterocyclic ring, and X? is any counter anion.

Abstract: A decorative sheet decorates a molded-article body in which a fiber-reinforced part, which constitutes a molded article with the molded-article body and contains a matrix resin having fibers and an epoxy group, is exposed to a surface. The decorative sheet includes an adhesive layer containing an amino-group-containing compound, the adhesive layer having an amino group that reacts with the matrix resin when bonding with the fiber-reinforced part. The decorative sheet also includes a decorative layer disposed on the adhesive layer and for decorating the surface of the molded-article body. The decorative sheet also includes a base film that is disposed on the decorative layer and has a polycarbonate-resin layer containing a polycarbonate resin and an inner-side acrylic-resin layer containing an acrylic resin. The inner-side acrylic-resin layer is disposed on the decorative layer, and the polycarbonate-resin layer is disposed on the inner-side acrylic-resin layer.

Abstract: A Formula of a phosphorous fire-retardant hardener having fire-retardant and heat-resistant properties as well as a low-dielectric constant. With a preparation of glass-fiber laminated board, the hardener meets UL-94V fire-retardant requirements and has a dielectric constant 5 of 4.0 (1 GHz).

Abstract: Disclosed are an epoxy resin composition and an article made therefrom, the epoxy resin composition comprising an epoxy resin and a co-hardener, wherein: relative to the epoxy resin having a total equivalent of epoxy group of 1, the co-hardener comprises: (A) an acid anhydride having a total equivalent of acid anhydride group of 0.044-0.183; (B) a polyester having a total equivalent of ester group of 0.120-0.550; (C) a first phenolic resin having an equivalent of hydroxyl group of 0.092-0.550; and (D) a second phenolic resin having an equivalent of hydroxyl group of 0.143-0.592; and a sum of equivalent of functional groups of the co-hardener is 0.84-1.11.

Abstract: A resin composition containing: an epoxy resin (A) represented by the following formula (1); and a cyanate compound (B), wherein Ar represents a polycyclic aromatic group, R represents a hydrogen atom or a methyl group, G represents a glycidyl group, and n represents an integer of 0 to 15.

Abstract: Disclosed is a curable composition with enhanced curing time at ambient temperatures, the curable composition including (a) a resin, e.g., 4,4?-isopropylidenediphenol-epichlorohydrin copolymer and (b) one or more curing agents, wherein a ratio of a weight percentage of the resin to a weight percentage of the curing agent or curing agents is from about 12:1 to about 15:1. Also disclosed is a method of curing a cured-in-place liner, wherein the cured-in-place liner contains the above curable composition.

Abstract: In developing epoxy resin compositions used as an adhesive for structure (structural adhesive) required to have adhesive properties, if each component is increased to further enhance the adhesive properties such as shear bond strength and peel strength, this causes problems, for example, as follows. The viscosity becomes so high that the workability deteriorates. Hence, the added amount has to be limited. Moreover, the cured product becomes excessively flexible, so that the shear bond strength deteriorates. An epoxy resin composition contains the following components (A) to (E), where the component (A) does not include the component (C): the component (A): an epoxy resin; the component (B): a blocked urethane resin; the component (C): a rubber-modified epoxy resin; the component (D): rubber particles; and the component (E): a latent curing agent.

Abstract: The present invention relates to composition and an article prepared by applying the composition to paper. The composition comprises an aqueous dispersion of acrylic or styrene acrylic polymer particles having a hard phase and a soft phase, wherein both phases comprise structural units of an specific acid monomer. The composition further includes sub-stoichiometric levels of a Zn++ or Zr++++ with respect to the carboxylic acid groups. The composition is useful as imparting block and tack resistance as a coating on paper.

Abstract: Provided is a powder coating latent curing agent; and an epoxy powder coating composition having the same, and more specifically, to a powder coating latent curing agent, which is prepared by hot blending of a product of an addition reaction of imidazole, an amino alcohol and an epoxy resin with a phenolic curing agent resin, is capable of securing latency by inhibiting the reactivity of a phenolic curing agent, is capable of providing an improved coating film appearance and bending resistance when applied as a curing agent to a powder coating, and is capable of improving the workability of a coating preparation; and an epoxy powder coating composition having the same.

Abstract: The invention provides a silicone-modified epoxy resin composition comprising a silicone-modified epoxy resin having at least two epoxy groups, obtained from hydrosilylation reaction of an alkenyl-containing epoxy compound with an organopolysiloxane, a silicone-modified phenolic resin having at least two phenolic hydroxyl groups, obtained from hydrosilylation reaction of an alkenyl-containing phenol compound with an organopolysiloxane, black pigment, and an inorganic filler. Because of excellent tracking resistance, the epoxy resin composition is suited for encapsulating semiconductor devices.