Abstract: The invention provides a silicone-modified epoxy resin composition comprising a silicone-modified epoxy resin having at least two epoxy groups, obtained from hydrosilylation reaction of an alkenyl-containing epoxy compound with an organopolysiloxane, a silicone-modified phenolic resin having at least two phenolic hydroxyl groups, obtained from hydrosilylation reaction of an alkenyl-containing phenol compound with an organopolysiloxane, black pigment, and an inorganic filler. Because of excellent tracking resistance, the epoxy resin composition is suited for encapsulating semiconductor devices.

Abstract: There is provided an epoxy resin composition containing an epoxy compound, which has a low viscosity and a low dielectric constant, and when added to a general-purpose epoxy resin composition, can lower a viscosity of the composition and can sufficiently lower a dielectric constant of an epoxy resin cured product obtained from the composition. An epoxy resin composition comprising: (a) an epoxy component containing at least an epoxy compound of formula [1]; and (b) a curing agent: wherein R1 to R3 each independently are a hydrogen atom or methyl group, and L1 to L3 each independently are pentamethylene group, hexamethylene group or heptamethylene group.

Abstract: Embodiments of the present disclosure are directed to a composition and composite for protecting a transmission/reception device. The composite can include a reinforcing material and a cured epoxy composition impregnating the reinforcing material. The cured epoxy composition can contain reaction constituents including less than 50% stoichiometric amount of an anhydride curing agent to an epoxy resin. The composite can exhibit synergistic improvements in mechanical strength, weatherability, and signal transmission properties.

Abstract: An aqueous copolymer dispersion is formed by emulsion polymerization of a monomer mixture comprising (a) 20 to 80 wt. % of one or more (meth)acrylic acid esters A, whose homopolymer(s) have a Tg>25° C. and at least one has a biorenewable carbon content of at least 50 wt. % of the total carbon content of the ester; (b) 19 to 79 wt. % of one or more (meth)acrylic acid esters B whose homopolymer(s) have a Tg<25° C.; (c) 0.5 to 10 wt. % of at least one monomer selected from unsaturated sulfonic, phosphoric and phosphonic acids, and unsaturated carboxylic acids, anhydrides and amides thereof; (d) up to 10% by weight of one or more functional monomers selected from hydrolysable silane compounds, epoxy-containing compounds, ureido-containing compounds and carbonyl-containing compounds, and (e) less than 5 wt. % of one or more further monomers, wherein the total percentages of comonomers (a) to (e) equals 100%.

Abstract: Disclosed are an adhesive composition for polarizing plates, a polarizing plate using the same, a method for preparing the same, and an optical member including the same. The adhesive composition includes (A) a (meth)acrylic radical compound, (B) a cationic epoxy compound, (C) a phenoxy resin, and (D) a photoinitiator.

Abstract: Thermally reworkable epoxy resins prepared through a Diels-Alder reaction are described herein. A maleimide component is reacted with an electron donating component having a furan ring attached to an epoxy ether to produce the epoxy resins. The epoxy component generated by this method can be cured with different diamines lo form a robust network of epoxy material. The robust epoxy material is used as a reversible thermoset and as an adhesive. The robust epoxy network is heated at 90° C. temperature in a retro Diels-Alder fashion to produce colorless starting materials of the maleimide component and the furan component.

Abstract: The present invention relates to a low-viscosity liquid epoxy resin composition and a pressure vessel manufactured using the same, and, more particularly, to a low-viscosity liquid epoxy resin composition, which has good workability due to low viscosity of the epoxy resin composition and exhibits both excellent elongation and an excellent glass transition temperature, and thus is applicable to pressure vessels for compressed natural gas and pressure vessels for compressed hydrogen gas, and a pressure vessel having excellent pressure-resistant characteristics manufactured using the same.

Abstract: An epoxy resin composition for sealing a semiconductor device, of the present invention, contains an inorganic filler, and the inorganic filler contains a nanomaterial containing silicon (Si) and aluminium (Al).

Abstract: The present disclosure relates to a B-stageable adhesive composition and an article prepared by the same. In the present disclosure, the adhesive composition comprises the following components in solid content percentage: (A) 10% to 50% by weight of a first epoxy resin with a weight average molecular weight Mw of 8,000 g/mol or more; (B) 5% to 20% by weight of a second epoxy resin with a weight average molecular weight Mw of 200 to 6,000 g/mol; (C) 30% to 80% by weight of a hydroxyl terminated polyester or derivates thereof; (D) 0.1% to 2.5% by weight of a first curing agent capable of reacting with epoxy group; and (E) 0.1% to 2.5% by weight of a second curing agent capable of reacting with hydroxyl group; the sum of components of the composition is equal to 100% by weight. The coating obtained from the adhesive composition of the present disclosure shows high adhesive strength, excellent heat resistance and flame retardance.

Abstract: The present invention discloses a halogen-free epoxy resin composition having low dielectric loss, comprises: (A) 100 parts by weight of an epoxy resin; (B) 10-30 parts by weight of a DOPO modified curing agent; (C) 1-10 parts by weight of benzoxazine resin; (D) 60-90 parts by weight of an active ester compound; (E) 20-50 parts by weight of a flame retardant; and (F) 0.5-10 parts by weight of a curing accelerator. The halogen-free epoxy resin composition uses active ester as a curing agent of the epoxy resin to ensure that the hardening product has characteristics such as low dielectric constant (Dk), low dielectric loss (Df), high heat resistance, low water absorption, flame retardant and halogen-free. The halogen-free epoxy resin composition of the present invention is used for manufacturing semi-cured prepregs or resin-coated films, and is applied toward manufacturing metal clad laminates and printed circuit boards.

Abstract: Coating compositions suitable for machined cementitious substrates are provided. The coating compositions provide adhesion to the machined cementitious substrate while maintaining high mechanical film strength. The coating compositions are also compatible with industrial implementation, and exhibit good pot life.

Abstract: A coating composition including a blend of at least two or more epoxy resins, wherein at least one of the epoxy resins comprises (i) a CHDM epoxy resin having less than about 2 wt % total chlorine content; and wherein at least one of the epoxy resins comprises (ii) at least one other epoxy resin other than the epoxy resin in component (i); a curable coating composition including (a) the above blend of epoxy resins and (b) at least one amine curing agent; a thermoset coating product prepared from the above curable composition; and a process for preparing the above compositions and a coating therefrom.

Abstract: Provided are an epoxy resin composition including hexagonal boron nitride particles having an aspect ratio of 2 or more, a liquid crystalline epoxy monomer, and a curing agent, and the epoxy resin composition being capable of forming a resin matrix having a smectic domain by reacting the liquid crystalline epoxy monomer with the curing agent, and a thermally-conductive material precursor, a B-stage sheet, a prepreg, a heat dissipation material, a laminate, a metal substrate, and a printed circuit board, which use the epoxy resin composition.

Abstract: Provided herein is a conductive adhesive composition containing: a thermosetting resin having a functional group reactive with an epoxy group; an epoxy resin; a conductive filler; and urethane resin particles having a mean particle diameter of 4 ?m or more and 13 ?m or less and a hardness of 55 or more and 90 or less measured by a type A durometer in conformity with JIS K6253.

Abstract: Aspects described herein generally describe epoxy resins and methods of epoxy resin formation. In some embodiments, a resin includes the reaction product of one or more polythiols, one or more polyepoxides, one or more fillers and one or more amine catalysts. Polythiols have between two and about ten thiol moieties. Polyepoxides have between two and about ten epoxy moieties. One or more amine catalysts of the formula NR1R2R3, wherein each of R1, R2, and R3 is independently linear or branched C1-20 alkyl or two or more of R1, R2, and R3 combine to form cycloalkyl. The resin has a compressive strength of at least 14 ksi at 2% offset at 70° F. and at least 8 ksi at 2% offset at 190° F.

Abstract: A composition for an antifogging coating includes isosorbide epoxy represented by Formula 1 below, a hardener, a hardening accelerator, and a silane coupling agent, wherein n is 0.2 to 7.

Abstract: A two part, curable, epoxy composition useful for potting or sealing electrical devices for use in hazardous locations. Cured reaction products of the epoxy composition meet most or all UL 674 requirements and are useful to seal apertures in electrical equipment. Equipment sealed with the disclosed compositions can meet the UL 674 requirement.

Abstract: Random copolymers, crosslinked thin films of the random copolymers and cell culture substrates comprising the crosslinked thin films are provided. Also provided are methods of making and using the copolymers, thin films and substrates. The copolymers are polymerized from glycidyl methacrylate monomers and vinyl azlactone monomers. The crosslinked thin films are substrate independent, in that they need not be covalently bound to a substrate to form a stable film on the substrate surface.

Abstract: A touch device, a method for manufacturing a touch device and a resin composition used in the method are discussed. The touch device includes a substrate including a surface roughness of less than 1.2 nm, a touch sensor formed on a surface of the substrate, and a flexible printed circuit board attached to the substrate.

Abstract: Provided are aqueous resin solutions having unique rheologies and products incorporating the same. The water-based materials provided herein are thermo-thickening, and the materials increase dramatically in viscosity (at least 100 times) in a desired temperature range increase (20 C to <100 C) at ambient pressure. Suitable resins comprising a hydrophobic group and a hydrophilic group may be selected from an epoxy resin, a phenol-formaldehyde resin, a polyurethane resin, an acrylic resin, a polyester resin, an acrylic-urethane resin, a melamine resin, a melamine-formaldehyde resin, an amino resin, and combinations thereof. A specific epoxy functional resin/polymer suitable for the resin solutions are prepared by reacting (A) an epoxy pre-polymer of (1) one or more polyols and (2) one or more epoxy functional materials with (B) a di- or polyamine, thereby forming the aqueous thermo-thickening resin solution. The resin solutions are substantially free of cross-linking agents.