Patents Examined by Michael Jung
  • Patent number: 11404663
    Abstract: A flexible display panel structure and fabricating method thereof. The flexible display panel structure includes a cover plate, a touch panel, an organic light-emitting diode device, and a backplate disposed, which are sequentially disposed, wherein a first optical clear resin fluid glue layer is disposed between the cover plate and the touch panel, and the first optical clear resin fluid glue layer bonds the cover plate to the touch panel, which is beneficial to reduce risk of panel cracking and peeling.
    Type: Grant
    Filed: November 5, 2019
    Date of Patent: August 2, 2022
    Assignee: WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
    Inventors: Fang Wang, Zhuo Zhang, Wen Han
  • Patent number: 11404654
    Abstract: Provided is a compound of Chemical Formula 1: wherein: among X1 to X4, one of X1 and X2, X2 and X3, or X3 and X4 are linked with * in the following Chemical Formula 2, and of the remaining two, one is hydrogen, and the other is R3: R1 and R2 are each independently hydrogen, deuterium, halogen, cyano, amino, a substituted or unsubstituted C1-60 alkyl, a substituted or unsubstituted C1-60 haloalkyl, a substituted or unsubstituted C1-60 alkoxy, a substituted or unsubstituted C1-60 haloalkoxy, a substituted or unsubstituted C3-60 cycloalkyl, a substituted or unsubstituted C2-60 alkenyl, a substituted or unsubstituted C6-60 aryl, a substituted or unsubstituted C6-60 aryloxy, or a substituted or unsubstituted C2-60 heterocyclic group containing one or more heteroatoms selected from the group consisting of N, O and S; one of R3 is hydrogen, and the other is —Si(R4)(R5)(R6), R4 to R6 are each independently hydrogen, deuterium, cyano, a substituted or unsubstituted C1-60 alkyl, a substituted or unsubst
    Type: Grant
    Filed: November 19, 2018
    Date of Patent: August 2, 2022
    Assignee: LG CHEM, LTD.
    Inventors: Seoyeon Kim, Tae Yoon Park, Sang Young Jeon, Dong Hoon Lee, Jungha Lee, Hyeon Soo Jeon
  • Patent number: 11404668
    Abstract: An organic light emitting diode (OLED) display panel and a method of manufacturing the same are provided. The OLED display panel includes a base substrate, a thin film transistor layer, an OLED device layer and a packaging layer sequentially disposed. The packaging layer includes a first inorganic packaging layer, a first organic layer and a second inorganic packaging layer sequentially disposed. The first inorganic packaging layer is formed with a first groove and the first organic packaging layer is formed with a second groove.
    Type: Grant
    Filed: October 18, 2019
    Date of Patent: August 2, 2022
    Assignee: Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
    Inventor: Zhao Li
  • Patent number: 11398617
    Abstract: A packaging cover plate and a manufacturing method thereof, a display panel, and a display device are provided. The packaging cover plate includes: a packaging sheet including a first surface and a second surface opposite to each other. The first surface of the packaging sheet is provided with at least one first channel, the second surface of the packaging sheet is provided with at least one second channel, and an extension direction of the first channel is parallel to an extension direction of the second channel. An orthographic projection of the at least one first channel on the packaging sheet and an orthographic projection of the at least one second channel on the packaging sheet are arranged alternately, and a sum of a depth of the first channel and a depth of the second channel is not less than a thickness of the packaging sheet.
    Type: Grant
    Filed: January 10, 2019
    Date of Patent: July 26, 2022
    Assignees: HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Tianfeng Pan, Lihao Zhao, Biao Tian, Jianhui Zhang, Jieshu Wu, Tao Jin, Shihlun Chen
  • Patent number: 11393747
    Abstract: A substrate structure and a method for manufacturing the same are provided. The substrate structure includes a first conductive layer, a dielectric layer, a second conductive layer and a connection layer. The dielectric layer is disposed on the first conductive layer. The dielectric layer defines an opening exposing the first conductive layer. The second conductive layer is disposed on the dielectric layer. The connection layer extends from an upper surface of the first conductive layer to a lateral surface of the second conductive layer. A surface roughness of an upper surface of the second conductive layer ranges from about 0.5 ?m to about 1.25 ?m.
    Type: Grant
    Filed: August 31, 2020
    Date of Patent: July 19, 2022
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventor: Wen Hung Huang
  • Patent number: 11380739
    Abstract: A method of manufacturing a display device includes forming a display unit including a main display area and a sensor area over a substrate, the main display area including a main pixel, and the sensor area including an auxiliary pixel and a transmission portion, the forming of the display unit including preparing a hard substrate defining an empty space corresponding to a location of the transmission portion, forming a soft substrate on the hard substrate, forming the main display area and the sensor area on the soft substrate, forming a thin-film encapsulation layer covering the main display area and the sensor area, and forming a transmission hole in the empty space by removing the hard substrate, the transmission hole passing through from the soft substrate to the thin-film encapsulation layer, and arranging a component on one side of the substrate, the component for communicating a signal through the transmission portion.
    Type: Grant
    Filed: March 20, 2020
    Date of Patent: July 5, 2022
    Assignee: Samsung Display Co., Ltd.
    Inventors: Hyunsang Seo, Kihyun Kim, Younggil Park
  • Patent number: 11380878
    Abstract: A method for manufacturing the display device includes preparing a display panel on which a folding area folded with reference to a virtual folding axis and first and second non-folding areas, which are adjacent to both sides of the folding area, are defined and which displays an image, providing a resin on a first surface of the display panel, primarily hardening the resin, and secondarily hardening first and second resin areas of the resin, which respectively correspond to the first non-folding area and the second non-folding area of the display panel.
    Type: Grant
    Filed: May 5, 2020
    Date of Patent: July 5, 2022
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Wonwoo Choi, Woo Yong Sung
  • Patent number: 11374193
    Abstract: A display device according to an embodiment may include a base substrate, a circuit layer, a light emitting element layer, and a module hole. The light emitting element layer may include a first electrode, a light emitting layer, and a second electrode. The second electrode may include a first portion that is not overlapped with the module hole and has a first thickness and a second portion between the module hole and the first portion and having a thickness that gradually increases in a direction toward the first portion. Thus, the display device may improve in durability in a hot and humid environment.
    Type: Grant
    Filed: May 1, 2020
    Date of Patent: June 28, 2022
    Assignee: Samsung Display Co., Ltd.
    Inventors: Yunjung Choi, Sangyeol Kim, Sokwon Noh, HyungSik Kim, Suhyun Oh
  • Patent number: 11372460
    Abstract: According to one general aspect, an apparatus may include a memory storage device. The memory storage device may include a plurality of memory cells configured to store data. The memory storage device may include a first temperature sensor configured to detect a temperature of the memory cells. The memory storage device may include an artificial intelligence system configured to dynamically determine a thermal management setting to be employed by the memory storage device, based, at least in part, upon the first temperature sensor and a workload of the memory storage device. The memory storage device may dynamically changes a set of operational parameters in response to the thermal management setting determined by the artificial intelligence system.
    Type: Grant
    Filed: April 30, 2018
    Date of Patent: June 28, 2022
    Inventor: John Ping
  • Patent number: 11367855
    Abstract: A display panel and a method of manufacturing the same, a display device are provided. The display panel includes a first substrate and a second substrate disposed oppositely to each other, and a sealant, spacers and a solidification inhibiting layer arranged between the first substrate and the second substrate, the solidification inhibiting layer being provided between the sealant and the spacers, and configured to inhibit the spreading of the sealant to the spacer.
    Type: Grant
    Filed: July 4, 2019
    Date of Patent: June 21, 2022
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventor: Donghui Yu
  • Patent number: 11362142
    Abstract: Methods for forming microelectronic devices include forming lower and upper stack structures, each comprising vertically alternating sequences of insulative and other structures arranged in tiers. Lower and upper pillar structures are formed to extend through the lower and upper stack structures, respectively. An opening is formed through the upper stack structure, and at least a portion of the other structures of the upper stack are replaced by (e.g., chemically converted into) conductive structures, which may be configured as select gate structures. Subsequently, a slit is formed, extending through both the upper and lower stack structures, and at least a portion of the other structures of the lower stack structure are replaced by a conductive material within a liner to form additional conductive structures, which may be configured as access lines (e.g., word lines). Microelectronic devices and structures and related electronic systems are also disclosed.
    Type: Grant
    Filed: May 18, 2020
    Date of Patent: June 14, 2022
    Assignee: Micron Technology, Inc.
    Inventor: Yi Hu
  • Patent number: 11362313
    Abstract: The present disclosure provides a manufacturing method and a processing device for a display substrate. The display substrate includes a light emitting device. The manufacturing method includes: applying an electrical signal to the display substrate to generate aging current flowing through the light emitting device; and applying a magnetic field to the display substrate for at least part of a time, during which the electrical signal is applied to the display substrate. The magnetic field is used to increase the aging current.
    Type: Grant
    Filed: March 27, 2019
    Date of Patent: June 14, 2022
    Assignees: Chengdu BOE Optoelectronics Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventor: De Yuan
  • Patent number: 11355372
    Abstract: Described herein is a technique capable of optimizing a timing of a maintenance process. According to one aspect of the technique of the present disclosure, there is provided a method of manufacturing a semiconductor device including: (a) transferring a substrate from a storage container storing one or more substrates including the substrate to a process chamber, and performing a substrate processing; (b) receiving maintenance reservation information of the process chamber; and (c) continuously performing the substrate processing after the maintenance reservation information is received in (b) until the substrate processing in the process chamber related to the maintenance reservation information is completed, and setting the process chamber to a maintenance enable state after the substrate processing is completed by stopping the one or more substrates from being transferred into the process chamber.
    Type: Grant
    Filed: February 21, 2020
    Date of Patent: June 7, 2022
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Yasuhiro Mizuguchi, Naofumi Ohashi, Tadashi Takasaki, Shun Matsui
  • Patent number: 11355444
    Abstract: To provide a semiconductor device further reduced in size. A semiconductor device including: a multilayer wiring board one surface of which is provided with an external connection terminal; and a plurality of active components that are provided to be stacked inside the multilayer wiring board and are connected to the external connection terminal via a connection via. The plurality of active components include a first active component provided on another surface side that is opposite to the one surface, and a second active component that is provided closer to the one surface than the first active component is and has a smaller planar area than the first active component.
    Type: Grant
    Filed: January 20, 2017
    Date of Patent: June 7, 2022
    Assignee: SONY CORPORATION
    Inventor: Hirohisa Yasukawa
  • Patent number: 11355545
    Abstract: Disclosed is a method of fabricating a semiconductor image sensor device. The method includes providing a substrate having a pixel region, a periphery region, and a bonding pad region. The substrate further has a first side and a second side opposite the first side. The pixel region contains radiation-sensing regions. The method further includes forming a bonding pad in the bonding pad region; and forming light-blocking structures over the second side of the substrate, at least in the pixel region, after the bonding pad has been formed.
    Type: Grant
    Filed: September 4, 2020
    Date of Patent: June 7, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chiu-Jung Chen, Chun-Hao Chou, Hsin-Chi Chen, Kuo-Cheng Lee, Volume Chien, Yung-Lung Hsu, Yun-Wei Cheng
  • Patent number: 11355733
    Abstract: The present application relates to an optical film, a method for preparing an optical film, and a method for manufacturing an organic light emitting electronic device.
    Type: Grant
    Filed: October 23, 2018
    Date of Patent: June 7, 2022
    Assignee: LG CHEM, LTD.
    Inventors: Jeong Min Choi, Jeehyon Min, Hee Song, Yoonkyung Kwon
  • Patent number: 11348864
    Abstract: Disclosed are redistribution substrates and semiconductor packages including the same. For example, a redistribution substrate including a dielectric pattern, and a first redistribution pattern in the dielectric pattern is provided. The first redistribution pattern may include: a first via part having a first via seed pattern and a first via conductive pattern on the first via seed pattern, and a first wiring part having a first wiring seed pattern and a first wiring conductive pattern, the first wiring part being disposed on the first via part and having a horizontal width that is different from a horizontal width of the first via part. Additionally, the first wiring seed pattern may cover a bottom surface and a sidewall surface of the first wiring conductive pattern, and the first via conductive pattern is directly connected to the first wiring conductive pattern.
    Type: Grant
    Filed: May 28, 2020
    Date of Patent: May 31, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seokhyun Lee, Gwangjae Jeon
  • Patent number: 11342212
    Abstract: Described herein is a technique capable of optimizing a timing of a maintenance process. According to one aspect of the technique of the present disclosure, there is provided a method of manufacturing a semiconductor device including: (a) transferring a substrate from a storage container storing one or more substrates including the substrate to a process chamber, and performing a substrate processing; (b) receiving maintenance reservation information of the process chamber; and (c) continuously performing the substrate processing after the maintenance reservation information is received in (b) until the substrate processing in the process chamber related to the maintenance reservation information is completed, and setting the process chamber to a maintenance enable state after the substrate processing is completed by stopping the one or more substrates from being transferred into the process chamber.
    Type: Grant
    Filed: February 26, 2020
    Date of Patent: May 24, 2022
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Yasuhiro Mizuguchi, Naofumi Ohashi, Tadashi Takasaki, Shun Matsui
  • Patent number: 11340154
    Abstract: A system and method that determines whether a heat exchanger within a complex networked system is fouling is provided. The system and method includes training classifiers indicative of a plurality of fouling conditions associated with the heat exchanger and testing the classifiers with optimal sensor data from optimal sensors to determine whether the fouling is being experienced by the heat exchanger.
    Type: Grant
    Filed: September 16, 2020
    Date of Patent: May 24, 2022
    Assignee: THE UNIVERSITY OF CONNECTICUT
    Inventors: Nayeff A. Najjar, Shalabh Gupta, James Z. Hare, Gregory R. Leaper, Paul M. D'Orlando, Rhonda Walthall, Krishna Pattipati
  • Patent number: 11335885
    Abstract: The display device includes a substrate including a first resin layer, a second resin layer overlapping the first resin layer, and a first inorganic insulating layer between the first resin layer and the second resin layer, and having flexibility, a display region provided on the substrate, a terminal region arranged outside the display region on the substrate, and a bending region arranged between the display region and the terminal region. A thickness of the second resin layer is larger than a thickness of the first resin layer. The substrate includes a first region and a second region. The first resin layer, the first inorganic insulating layer, and the second resin layer are laminated in the first region. The first resin layer and the second resin layer are laminated in the second region and the first inorganic insulating layer is not laminated in the second region.
    Type: Grant
    Filed: July 7, 2020
    Date of Patent: May 17, 2022
    Assignee: Japan Display Inc.
    Inventor: Satoshi Maruyama