Abstract: A semiconductor module comprises a semiconductor apparatus and a cooling apparatus. The semiconductor apparatus includes a semiconductor chip and a circuit board. The cooling apparatus includes: a top plate; a side wall; a bottom plate; a coolant flow portion for causing a coolant to flow defined by the plates and the wall, where a cross section of the portion parallel to a principal surface of the top plate have a substantially rectangular shape with longer sides and shorter sides; an inlet associated with one direction along the shorter sides for letting a coolant into the portion; an outlet associated with another direction along the shorter sides for letting a coolant out of the portion; and a cooling pin fin arranged in the portion, extending between the top plate and the bottom plate, and having a substantially rhombic shape longer along the shorter sides than along the longer sides.

Abstract: A data center cooling system includes an outer container that defines a first volume; an inner container that defines a second volume and is positioned within the first volume, the inner container including an air outlet that includes an airflow path between the first and second volumes; a liquid seal to fluidly isolate a liquid phase of a non-conductive coolant that fills at least a portion of the first and second volumes from an ambient environment; and at least one server tray assembly. The server tray assembly includes a plurality of electronic heat-generating devices immersed in the liquid phase of the non-conductive coolant; and an immersion cooling system mounted to and in conductive thermal contact with one or more of the plurality of electronic heat-generating devices. The immersion cooling system includes a working fluid in thermal communication with the one or more electronic heat-generating devices and the non-conductive coolant.

Abstract: In one embodiment, a data center cooling system includes one or more information technology (IT) rooms having multiple electronic racks that generate heat. An external cooling unit is positioned above the IT rooms and is configured to provide cooling fluid and to exchange heat carried by the cooling fluid. The external cooling unit has a supply line to distribute cooling fluid downwardly to the IT rooms. As the cooling fluid cools the electronic racks, the cooling fluid heats up and at least partially turns to vapor which rises due to convection. The external cooling unit also has a return line to return the rising vapor to the external cooling unit, which cools the vapor. The vapor changes phase to liquid and is recirculated to the IT rooms.

Abstract: A cooling module system for a heat producing information handling system component comprising a dual opposite outlet blower system comprising a power source and a blower fan motor for rotating a blower fan having a plurality of blades and a fan diameter for rotation of the blower fan in a rotational plane, a dual opposite outlet blower system housing including first surface having an fan inlet aperture, a second surface oppositely disposed of the first surface on which the blower fan is operatively coupled inside the dual opposite outlet blower system housing.

Abstract: A portable data storage device includes at least one component that generates heat, an enclosure wall made of a first material and having a thermal conductivity and an exterior layer. The enclosure wall surrounds the at least one computer component and includes outer and inner boundaries. The exterior layer is made of a second material and has a thermal conductivity that is less than the thermal conductivity of the first material. The exterior layer is covers the outer boundary of the enclosure wall and includes an outer surface and an inner boundary. The outer boundary of the enclosure wall interfaces with the inner boundary of the exterior layer so that the outer surface of the exterior layer is in direct contact with the environment and the outer boundary of the enclosure wall is not. Heat is transferred to the environment at the outer surface of the exterior layer.

Abstract: A heat dissipating assembly, adapted to be disposed at an M.2 expansion card and configured onto a main board with the M.2 expansion card, is provided. The heat dissipating assembly includes a first heat dissipating member and a first double-end screwing member. The first heat dissipating member is adapted to be disposed on the main board, located between the main board and the M.2 expansion card, and has at least one first through hole. The first double-end screwing member includes a first thread and a first nut having a first screw hole. The first thread passes through one of the at least one first through hole of the first heat dissipating member and is detachably fixed to the main board. The first nut presses against the first heat dissipating member.

Abstract: Techniques involve providing a chassis and for manufacturing the same. The chassis includes a housing and a partition. The partition is disposed within the housing and adapted to partition a space inside the housing into a first accommodating portion and a second accommodating portion. The partition is configured to be detachably mounted within the housing and a position of the partition in the housing is adjustable, to change respective volumes of the first accommodating portion and the second accommodating portion. In this way, a common chassis for different functional configuration demands is implemented, thereby avoiding the waste of space of the chassis due to changes in the volumes of internal electronic components.

Abstract: Systems and method for thermally managing display assemblies are provided. A closed loop pathway for circulating gas includes a channel located behind an electronic display located at a housing. A fan unit is positioned within the rear channel. A storage area for an equipment storage device is located within or adjacent to the channel and is partitioned by a barrier. A loopback channel accepts a flow of the circulating gas and forms a pathway about the equipment storage device. The fan unit generates an area of relatively high pressure circulating gas compared to circulating gas in the storage area, which causes a portion of the circulating gas to travel through the loopback channel to cool equipment stored at the equipment storage device.

Abstract: The present specification discloses systems, devices, and methods and uses provide a mounting system which includes rail and a bracket which is selectively secured to the rail. A bracket disclosed herein selectively and/or automatically secures or locks to a rail disclosed herein when positioned on the rail by actuating or triggering a locking mechanism disclosed herein to adopted a locked configuration. In addition, a bracket disclosed herein may be selectively removed from a rail by actuating or triggering a locking mechanism disclosed herein to adopted an unlocked configuration. The disclosed mounting systems, devices, and methods enable a device to be protected from impact and moisture exposure, enable a device to be securely mounted on a base, and/or enable a device to be quickly secured and removed from a base.

Abstract: The present utility model provides an electronic device and a power module thereof. The power module of the present utility model includes: a first circuit board, a second circuit board, a radiator and a power device; where the heat dissipation surface of the power device is in thermal contact with the radiator, and the heat dissipation surface of the power device is parallel to the first surface of the first circuit board. The present utility model improves the heat dissipation efficiency of the power device by mounting the power device on the second circuit board and thermally contacting the radiating surface of the power device with the radiator, and at the same time, the arrangement of the second circuit board also makes the assembly of the entire power module more convenient.

Abstract: A computer case configured to dispose a motherboard and a graphics card therein is provided. The computer case includes an outer frame and a motherboard carrier. The outer frame includes a side surface. The motherboard carrier is connected to the outer frame and configured to dispose the motherboard thereon. A body of the motherboard carrier and the side surface form a predetermined angle of greater than 0°.

Abstract: The present specification discloses systems, devices, and methods provide a mounting system which includes rail and a bracket which is selectively secured to the rail. The bracket is selectively and/or automatically locked to the rail when positioned on the rail, and may be removed from the rail by activating one or more buttons or actuators. The disclosed mounting systems, devices, and methods enable a device to be protected from impact and moisture exposure, enable a device to be securely mounted on a base, and/or enable a device to be quickly secured and removed from a base.

Abstract: Provided are an electric device and a heat radiator capable of suppressing vibration caused by external stress of the heat radiator. The electric device includes a substrate; an electronic component attached to the substrate; and a heat radiator including at least one first fin, and a second fin facing the first fin, thermally connected to the first fin, and provided at a position closer to an attachment surface of the substrate than any of the first fins. The heat radiator is thermally connected to the electronic component, and one end of an attachment member is attached to the first fin, and another end of the attachment member is attached to the substrate. The attachment member has a height with respect to the attachment surface that is higher than a thickness of the first fin.

Abstract: An electronic apparatus includes an airflow generation device and a passive component. The passive component is a temperature sensor and includes a component body and a heat sink attached to the component body. The heat sink can absorb environmental heat which is dissipated through the air flow. The airflow generation device operates according to a sensing result by the passive component.

Abstract: Examples disclosed herein provide a computing device. One example computing device includes a heat generating component disposed within the computing device, and shape memory material (SMM) that adjusts a clearance below a bottom surface of the computing device according to a temperature of the heat generating component.

Abstract: A heatsink includes a fin-set that includes a corrugated ribbon having a first, deformable, portion and a second, convective, portion that is not deformed. A plurality of corrugated ribbons may be physically and/or thermally coupled (e.g., via mechanical fasteners, thermally conductive bonding, or reflow) to form the heatsink. A force may be applied to the heatsink sufficient to at least partially crush the first, deformable, portion to conform to an external surface of an electronic device. The heatsink may be physically affixed and thermally coupled to an external surface of the electronic device via mechanical fasteners, thermally conductive adhesives or via reflow of a low-melt temperature layer disposed on an external surface of the heatsink. The crushed portion of the first, deformable, portion conforms to the regular (e.g., planar) or irregular surface profile of the electronic device, beneficially and surprisingly improving thermal performance of the heatsink.

Abstract: Systems, apparatuses, methods, and computer-readable media are presented for managing an apparatus for thermal energy management including a first container. The first container includes a first cavity, and is configured to hold a first liquid coolant within the first cavity to at least partially surround a second container. The second container includes a second cavity configured to hold one or more heat sources, and a second liquid coolant to at least partially surround the one or more heat sources. The second container is sealed to separate the first liquid coolant from the second liquid coolant. Other embodiments may be described and/or claimed.

Abstract: Systems and methods for cooling an electronic image assembly are provided. A transparent panel forms a front portion of a housing for the electronic image assembly. The transparent panel is located forward of, and at least some distance from the electronic image assembly. An airflow pathway passes through the housing between said electronic image assembly and said transparent panel. An air circulation device forces air through the airflow pathway. At least one polarizer located at the transparent panel is configured to reduce solar energy entering said airflow pathway.

Abstract: An electronic device, according to various embodiments of the present invention, may comprise: a housing which comprises a first surface, a second surface facing the opposite direction from the first surface, and a cooling member arranged between the first surface and the second surface; a circuit board which is disposed inside the housing; at least one heating component which is mounted to the circuit board; a shield can which surrounds one portion of the at least one heating component; a conductive member which makes contact with a first surface of the at least one heating component; a first thermal conduction member which diffuses heat from the at least one heating component to a plane direction parallel with the first surface of the heating component; and a second thermal conduction member which makes contact with a first surface of the first thermal conduction member, receives the heat from the first thermal conduction member in a second direction perpendicular to the plane direction, and transfers the h

Abstract: There is provided a heat sink in which the thermal resistance from a portion where the heat sink directly or indirectly makes contact with a heat-generating device to a portion where the heat sink makes contact with a coolant is set to be a value that is different from the thermal resistance at a different position in the flowing direction of the coolant, so that it is made possible to suppress the temperature difference between the upstream end and the downstream end of the heat-generating device.