Abstract: An active thermal management system for electronic devices comprises: a heat spreader having an internal channel; a thermally conductive body moveably positioned in the internal channel; and two or more electronic devices in thermal contact with a back surface of the heat spreader and positioned adjacent to the internal channel. A location of the thermally conductive body within the internal channel determines a path for heat flow from the back surface to a front surface of the heat spreader. The location of the thermally conductive body within the internal channel may be selected to minimize a temperature differential (?T) between the electronic devices.

Abstract: An electronic device includes a packaged device and a thermal dissipater. The packaged device includes a component that generates thermal energy, a package that encapsulates the component, and an interconnect that forms a portion of a high thermal conduction between the component and a circuit card. The thermal dissipater obtains the thermal energy using the circuit card and radiates the thermal energy.

Abstract: A composite heat dissipation member and an electronic device comprising the composite heat dissipation member. The composite head dissipation member may include a first heat dissipation sheet disposed to be overlapped with an antenna module, and a second heat dissipation sheet disposed adjacent to the first heat dissipation sheet without an overlap with the first heat dissipation sheet, thermally connected to the first heat dissipation sheet, and having a higher thermal conductivity than the first heat dissipation sheet.

Abstract: An electronic assembly includes a plurality of circuit boards each comprising engagement grooves spaced around an outer wall. The assembly includes a plurality of spacers with alignment elements. The alignment elements comprise a first tab and a first tab receiver extending in a first axial direction. The alignment elements further comprising a second tab extending in a second axial direction opposite the first and a second tab receiver extending in the second axial direction. A first spacer is disposed between a first circuit board and a second circuit board. The first tab of the first spacer is disposed within a first engagement groove of the first circuit board. The second circuit board is disposed between the first spacer and a second spacer. A second tab of the first spacer is received in a second engagement groove of the second circuit board and a first tab receiver of the second spacer.

Abstract: A dissipating interconnection module for an M.2 form factor expansion card, includes a heat sink, which includes an enclosure including an upper wall for being in thermal contact with the first heat exchange surface of the expansion card and two tabs, each tab for being in thermal contact with the upper wall of the heat sink and for being in thermal contact with the fluid cooling system of the first electronic board, and the upper wall and the two tabs of the enclosure being arranged to form a space in which the expansion card can be received; a mechanical attachment system for removably mechanically attaching the expansion card to the heat sink; an interconnection electronic board including the second M.2 connector, a third electrical connector to be connected to a fourth electrical connector of the first electronic board.

Abstract: An electronic rack liquid cooling system includes a rack manifold having a rack liquid supply line or channel and a rack liquid return line or channel. The liquid supply line is to receive first cooling liquid from a cooling liquid source and the liquid return line is to return first warmer liquid carrying the exchanged heat back to the cooling liquid source. The electronic rack further includes an array of server blades arranged in a stack therein. Each server blade includes one or more liquid cold plates associated with one or more information technology (IT) components. The electronic rack further includes a set of one or more liquid distribution units (LDUs) coupled between the rack liquid supply and return lines and the server blades. Each LDU includes a liquid supply port, a liquid return port, one or more pairs of supply sub-ports and return sub-ports, and a plate heat exchanger.

Abstract: Shelf designs for battery modules are disclosed. A liquid cooling method for battery thermal management is also introduced using the shelf design. A backup battery system shelf comprises a cooling frame and a thermal conductive pad disposed on one or more surfaces of the shelf. The cooling frame can house a backup battery unit (BBU) or module. The cooling frame is configured to circulate a cooling liquid in and out of the cooling frame. The thermal conductive pad is configured to transfer heat from a BBU module to the cooling frame and liquid circulating within the cooling frame. The BBU module can also include a cooling frame circulating a cooling liquid to transfer heat away from the BBU module.

Abstract: A vertical column assembly including an intermediate distribution frame enclosure with an internal structure. The vertical column assembly also includes side panels, door assemblies, and a top cover assembly. The internal structure is hidden by the side panels, the door assemblies, and the top cover assembly. The vertical column assembly encases the network equipment installed within the internal structure.

Abstract: A portable information handling system rejects excess thermal energy from within a housing by blowing a cooling airflow with a cooling fan across first and second sets of cooling fins and out an exhaust. The cooling fins have an interleaved position with higher impedance and a separated position with a lower impedance that can increase cooling airflow. In one example embodiment, a central processing unit couples to a first circuit board and the first set of cooling fins and a graphics processor couples to a second circuit board and the second set of cooling fins so that movement of the circuit boards moves the cooling fins between the interleaved and separated positions.

Abstract: Systems, apparatuses, and methods described herein provide heat sinks that can be incorporated into chassis, yet be compatible with edge devices that contain many different combinations of hardware that can be arranged in many different ways on circuit boards. In one example, a pattern of fittings on an interior-facing side of the heat sink are configured to mate with fittings on a first side of an adapter pedestal. A second side of the adapter pedestal is configured to thermally couple with an electronic component housed within the chassis when the heat sink is fully seated and the pedestal is properly coupled to the heat sink.

Abstract: A portable information handling system manages thermal conditions of an external surface based upon context that indicates user presence versus use in a standalone mode, such as based upon movements sensed by an accelerometer, touches sensed by a capacitive sensor, and the rotational orientation of the system housing. In one embodiment, a motorized hinge varies a time to close the housing so that the housing external surface cools sufficiently for an end user touch. A color coded light illuminates that the housing to provide the end user a visual indication of the housing temperature.

Abstract: A magnet mount assembly is provided for quickly mounting and releasing the portable electronic device to various objects, including stands, clamps and/or holders (i.e., support mount) to support the portable electronic device in elevated positions at a variety of angles. The magnet mount assembly may attach to the back of the temperature control device or to the back of the portable devices by, for example, connecting to the universal mount. The mount may further include pong pins or other electrical connectors for supplying power to the cooling mount and/portable electronic device when the magnet mount assembly is connected to a support mount.

Abstract: Disclosed is a direct cooling-type display device having a double-sided display, the display device being configured to implement efficient heat radiation and comprising: a first display; a second display provided such that the back surface thereof faces the back surface of the first display; a housing for mounting the first display; an inlet port formed in the housing so as to form a path along which external air flows in; a first discharge port formed in a first area in which the first display is provided; a second discharge port formed in a second area in which the second display is provided; a first temperature measurement portion for measuring the temperature in the second area; a first outlet fan for discharging air in the first are through the first discharge port; a second outlet fan for discharging air in the second area through the second discharge port; a first backflow prevention portion provided in the first discharge port so as to prevent air from flowing from outside the housing into the same t

Abstract: A heat transport device is disclosed. The heat transport device includes a heat pipe and a heat spreader. The heat pipe, which is thermally connecting to a heating element, includes a heat receiving surface for receiving heat from the heating element, and a side surface intersecting with the heat receiving surface. The heat spreader, which is thermally connecting to the heat pipe, includes a first plate member having a first side surface thermally connecting to the side surface of the heat pipe, and a second plate member having a side surface thermally connecting to a second side surface of the first plate member opposite to the first side surface in contact with the heat pipe.

Abstract: A portable information handling system rejects excess thermal energy from within a housing by blowing a cooling airflow with a cooling fan across first and second sets of cooling fins and out an exhaust. The cooling fan has an upper and lower intake and moves vertically within the housing to adjust spacing at the upper intake. The cooling fan exhaust couples to one of the sets of cooling fins to exhaust across both sets of cooling fins when interleaved and the one set of cooling fins when spacing at the upper cooling fan intake increases.

Abstract: An electrical feed-through, such as a PCB connector, involves at least one positioning protrusion protruding from a main body, and may further include multiple positioning protrusions protruding in respective directions from the main body. A data storage device employing such a feed-through includes an enclosure base with which the feed-through is coupled. The base includes an annular recessed surface surrounding an aperture that is encompassed by the feed-through and is at a first level, and at least one recessed positioning surface at a higher level than the first level, and extending in a direction away from the annular recessed surface. The positioning protrusion of the electrical feed-through contacts the recessed positioning surface of the base, such that the position of the feed-through is constrained by the recessed positioning surface.

Abstract: An electronic device includes a casing, a motherboard, a battery, a fan, and a heat dissipation module. The motherboard is arranged in the casing, and defines a first space with the casing. The battery is arranged in the casing and defines a second space with the motherboard. The motherboard separates the first space and the second space. The fan is arranged in the casing and has a first airflow outlet and a second airflow outlet independent of the first airflow outlet. The first airflow outlet communicates with the first space and the second space. The heat dissipation module is arranged in the casing and transfers heat from the motherboard to the second airflow outlet.

Abstract: An M.2 fastening system has an M.2 riser card with two module-receiving sides and a plurality of adjustment positions. The M.2 fastening system further has a pair of M.2 fasteners mounted respectively on the module-receiving sides. Each M.2 fastener has a main body defined by a top surface and a bottom surface; a module attachment extending from the top surface; and a hook extending from the bottom surface along a lateral side of the main body. The hook of one of the M.2 fasteners is received through an attachment aperture of an adjustment position. The hook is pressed-fit over the top surface of the main body of another M.2 fastener. The hook secures the M.2 riser card between the pair of M.2 fasteners in a tool-less manner.

Abstract: Heat resistant RFID tags can be formed by embedding RFID tags between laminates of glass fiber meshes. The glass fiber meshes can be woven tightly. Air gaps between the glass fibers can be filled with a high temperature adhesive. Mica sheets can be used with the glass fiber meshes.

Abstract: The disclosure relates to a lighting control console (01) for controlling a lighting system, digital adjusting commands being generated in the lighting control console (01), which commands can be transmitted to the lighting devices of the lighting system via data links, said lighting control console (01) comprising at least one digital processor (16, 17) and at least one digital memory for generating, managing and storing the adjusting commands, and said digital processor (16, 17) and said digital memory being disposed in a console housing (08), and a control panel (07) having at least one control element, in particular a key button (04) and/or at least one slide control (05) and/or at least one rotary control (06), being provided at the upper side of the console housing (08), which control panel allows users to enter control commands, and said lighting control console (01) comprising at least one screen (02), and said lighting control console (01) comprising at least one cooling device (13), with the aid of