Abstract: According to one embodiment, a liquid distribution system includes a main liquid supply and return unit, a mounting rail that extends along at least a portion of a height of the electronic rack, and a connecting unit that is slidably coupled to the mounting rail and is coupled to the main liquid supply and return unit via a flexible supply line and a flexible return line, the connecting unit is arranged to couple to a piece of information technology (IT) equipment to circulate coolant from the main liquid supply and return unit through the piece of IT equipment to create a heat-transfer loop that transfers thermal energy away from the piece of IT equipment and into the coolant.

Abstract: A cooling assembly according to various aspects of the present disclosure includes a housing, an electronic component, a dielectric coolant, and a cover. The housing includes an interior compartment having a basin region in which the electronic component and the coolant are disposed. The coolant undergoes phase change between a liquid state and a gas state. The coolant is in direct contact with the electronic component in the liquid state. The cover component extends transversely through the interior compartment and is coupled to the body. The cover component is disposed in a direction with respect to the basin region. The cover component at least partially defines a port in fluid communication with the basin region. The cover component is configured to permit flow therethrough of the dielectric coolant in the gas state in at least the direction.

Abstract: In one example, an electronic device is described, which may include an enclosure having at least two openings, and at least two air flow devices disposed in the enclosure and corresponding to the at least two openings. The at least two air flow devices may be movable between a retracted position and an extended position. The at least two air flow devices can be within the enclosure in the retracted position and can be at least partially outside the enclosure through the at least two openings in the extended position.

Abstract: A display device includes a display panel to display an image; a heat radiating member at a side portion of the display panel and including a first adhesive layer, a second adhesive layer, and a heat radiating layer between the first adhesive layer and the second adhesive layer; and a heat generating member overlapping the display panel and the heat radiating member when viewed in a plan view, and the heat radiating member includes a first area overlapping the heat generating member and a second area adjacent to the first area when viewed in a plan view, the first adhesive layer and the second adhesive layer are connected to each other through a plurality of through holes defined through the heat radiating layer, and the plurality of through holes includes a through hole in the second area.

Abstract: Racks and rack systems to support a plurality of sleds are disclosed herein. A rack comprises an elongated support post and a plurality of support chassis. The elongated support post extends vertically. The plurality of support chassis are coupled to the elongated support post. Each support chassis of the plurality of support chassis is sized to house a corresponding sled of the plurality of sleds.

Abstract: An electronic display has a housing with different regions and a display panel with a display surface. A cooling module flows internal coolant through the cooling module and the regions. The cooling module has a crossflow heat-exchanger and side walls. The regions and cooling module have an coolant inlet and outlet. The coolant inlets of the regions communicate with the coolant outlet of the cooling module. The coolant outlets of the regions communicate with the coolant inlet of the cooling module. The regions have their own circulating loop of coolant, with flow of coolant being deflected from the outlet of the cooling module towards the coolant inlets of the regions, and flow of coolant from the coolant outlets of the regions being deflected towards the coolant inlet of the cooling module. The coolant flows in parallel over both front and back of the display panel.

Abstract: An apparatus includes a tray, a shaft connected to the tray, a bracket that secures the tray to a networking device such that the tray is distanced from a surface of the networking device, and a support post coupled to the tray via the shaft, the support post including: a rotating pin having a cylindrical passage through which the shaft passes, the rotating pin being coupled to the support post to allow the support post to rotate about the rotating pin and about the shaft, and a locking pin having a latch that is configured to engage with a corresponding opening on the tray to secure the support post to the tray.

Abstract: A heat-insulation device and an electronic product, the heat-insulation device is of a closed hollow structure, and includes a first cover body and a second cover body arranged opposite to each other; a vacuum cavity is formed in the heat-insulation device; the first cover body is made of a heat-conducting material; and a heat-conducting element is provided in the vacuum cavity, and a first end of the heat-conducting element is in contact with an inner wall surface of the first cover body.

Abstract: An electronic assembly with phase-change material for thermal performance comprises a substrate and a semiconductor device mounted on the substrate. A sealed first thermal channel comprises a first evaporator section, a first fluid transport section, and a first condenser section. A phase-change material is contained in the sealed first thermal channel. The first evaporator section overlies the semiconductor device. The first fluid transport section extends between the first evaporator section and the first condenser section. The first evaporator section is spaced apart from the first condenser section. The first condenser section is in thermal communication with the heat sink.

Abstract: A system includes a tray, where the tray includes a rail and a bracket that secures the rail to a networking device such that the rail is distanced from a surface of the networking device. A support post is removably coupled to the rail. The support post includes a first support member and a second support member vertically displaced from the first support member, where each of the first and second support members includes a support structure that supports a cable connected with a port at the surface of the networking device and routes the cable away from the networking device to another location distanced from the networking device. The cable supported by the first support member is separated and segregated from the cable supported by the second support member. With minimal touch, a support post can be moved from one location to another along the rail.

Abstract: Embodiments disclosed herein describe a manifold microchannel heat sink having a target surface, a microchannel structure and an insert disposed over the microchannel structure. The microchannel structure includes a plurality of fins extending in a normal direction from the target surface and defining a plurality of microchannels. The individual fins are shaped as rectangular plates and the individual microchannels comprise gaps between the individual fins. The plurality of fins are distributed on the target surface such that at least a thickness of the individual fins or a width of the gaps comprising the individual microchannels is varied along a plane of the target surface. The insert disposed over the microchannel structure has a plurality of inlet dividers and a plurality of outlet dividers. The individual inlet dividers define an inlet channel and the individual outlet dividers define an outlet channel.

Abstract: An automotive power module has a plurality of power cards stacked to form an inverter module, and a DC-link capacitor mounted against the inverter module. Each of the power cards includes a top cover having opposite sides. One of the sides has extended therefrom a first matrix of pins. Each of the power cards also includes a plurality of integrated circuits defining transistors of an inverter mounted on the other of the sides, terminals extending from a perimeter of the top cover and in electrical communication with the integrated circuits, and a bottom cover having extended therefrom a second matrix of pins.

Abstract: A case adapted to be selectively connected to a first interface module, a second interface module and a third interface module is provided. The case includes a substrate. The substrate includes a first connection area and a second connection area. The first connection area is adjacent to the second connection area. The first connection area includes a first post. The second connection area includes a second post and a third post. In a first state, the first interface module is disposed in the first connection area. The second interface module is disposed in the second connection area. In a second state, the third interface module is disposed in the first connection area and the second connection area. The case is adapted to be selectively connected to different types of storage units.

Abstract: A semiconductor module comprises a semiconductor apparatus and a cooling apparatus. The semiconductor apparatus includes a semiconductor chip and a circuit board. The cooling apparatus includes: a top plate; a side wall; a bottom plate; a coolant flow portion for causing a coolant to flow defined by the plates and the wall, where a cross section of the portion parallel to a principal surface of the top plate have a substantially rectangular shape with longer sides and shorter sides; an inlet associated with one direction along the shorter sides for letting a coolant into the portion; an outlet associated with another direction along the shorter sides for letting a coolant out of the portion; and a cooling pin fin arranged in the portion, extending between the top plate and the bottom plate, and having a substantially rhombic shape longer along the shorter sides than along the longer sides.

Abstract: A data center cooling system includes an outer container that defines a first volume; an inner container that defines a second volume and is positioned within the first volume, the inner container including an air outlet that includes an airflow path between the first and second volumes; a liquid seal to fluidly isolate a liquid phase of a non-conductive coolant that fills at least a portion of the first and second volumes from an ambient environment; and at least one server tray assembly. The server tray assembly includes a plurality of electronic heat-generating devices immersed in the liquid phase of the non-conductive coolant; and an immersion cooling system mounted to and in conductive thermal contact with one or more of the plurality of electronic heat-generating devices. The immersion cooling system includes a working fluid in thermal communication with the one or more electronic heat-generating devices and the non-conductive coolant.

Abstract: In one embodiment, a data center cooling system includes one or more information technology (IT) rooms having multiple electronic racks that generate heat. An external cooling unit is positioned above the IT rooms and is configured to provide cooling fluid and to exchange heat carried by the cooling fluid. The external cooling unit has a supply line to distribute cooling fluid downwardly to the IT rooms. As the cooling fluid cools the electronic racks, the cooling fluid heats up and at least partially turns to vapor which rises due to convection. The external cooling unit also has a return line to return the rising vapor to the external cooling unit, which cools the vapor. The vapor changes phase to liquid and is recirculated to the IT rooms.

Abstract: A cooling module system for a heat producing information handling system component comprising a dual opposite outlet blower system comprising a power source and a blower fan motor for rotating a blower fan having a plurality of blades and a fan diameter for rotation of the blower fan in a rotational plane, a dual opposite outlet blower system housing including first surface having an fan inlet aperture, a second surface oppositely disposed of the first surface on which the blower fan is operatively coupled inside the dual opposite outlet blower system housing.

Abstract: A portable data storage device includes at least one component that generates heat, an enclosure wall made of a first material and having a thermal conductivity and an exterior layer. The enclosure wall surrounds the at least one computer component and includes outer and inner boundaries. The exterior layer is made of a second material and has a thermal conductivity that is less than the thermal conductivity of the first material. The exterior layer is covers the outer boundary of the enclosure wall and includes an outer surface and an inner boundary. The outer boundary of the enclosure wall interfaces with the inner boundary of the exterior layer so that the outer surface of the exterior layer is in direct contact with the environment and the outer boundary of the enclosure wall is not. Heat is transferred to the environment at the outer surface of the exterior layer.

Abstract: A heat dissipating assembly, adapted to be disposed at an M.2 expansion card and configured onto a main board with the M.2 expansion card, is provided. The heat dissipating assembly includes a first heat dissipating member and a first double-end screwing member. The first heat dissipating member is adapted to be disposed on the main board, located between the main board and the M.2 expansion card, and has at least one first through hole. The first double-end screwing member includes a first thread and a first nut having a first screw hole. The first thread passes through one of the at least one first through hole of the first heat dissipating member and is detachably fixed to the main board. The first nut presses against the first heat dissipating member.

Abstract: Techniques involve providing a chassis and for manufacturing the same. The chassis includes a housing and a partition. The partition is disposed within the housing and adapted to partition a space inside the housing into a first accommodating portion and a second accommodating portion. The partition is configured to be detachably mounted within the housing and a position of the partition in the housing is adjustable, to change respective volumes of the first accommodating portion and the second accommodating portion. In this way, a common chassis for different functional configuration demands is implemented, thereby avoiding the waste of space of the chassis due to changes in the volumes of internal electronic components.