Patents Examined by Michael Matey
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Patent number: 10985088Abstract: The present invention concerns a system comprising at least one power module comprising at least one power die that is cooled by a liquid cooled system, the liquid cooled system is arranged to provide at least one electric potential to each power dies of the power module, characterized in that the liquid cooled system is composed of a first and a second current-carrying bars connected together by an electrically non-conductive pipe, the first bar is placed on the top of the power module and provides a first electric potential to the power die and the second bar is placed on the bottom of the power module and provides a second electric potential to the power dies and the liquid coolant is electrically conductive and the channels surfaces are covered by an electrical insulation layer.Type: GrantFiled: April 25, 2017Date of Patent: April 20, 2021Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Roberto Mrad, Stefan Mollov, Jeffrey Ewanchuk
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Patent number: 10980152Abstract: A data storage device includes a heat source including a memory, and an enclosure within which the heat source is installed. The data storage device also includes a heat spreader within the enclosure and surrounding the heat source. The data storage device further includes a thermal interface material within the enclosure. The thermal interface material is coupled to the heat source and to the heat spreader, thereby providing a first low thermal resistance path between the heat source and the heat spreader. A phase change material is coupled to the thermal interface material such that the thermal interface material provides a second low thermal resistance path between the heat source and the phase change material.Type: GrantFiled: November 11, 2019Date of Patent: April 13, 2021Assignee: SEAGATE TECHNOLOGY LLCInventor: Michael Morgan
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Patent number: 10980155Abstract: The present invention is a modular, energy efficient structure for housing racks of computers specifically designed for mining Bitcoin assets. The fundamental principal towards an optimized mining facility design is to decrease electricity consumption as well as effective construction budget management, ensuring only appropriate business expenditures. The side benefits including improved stability of the facility computer network and electricity supply. The design concept is carried out through a cool/hot air segregation process, which results in controllable internal facilities temperatures, dust filtration and energy savings.Type: GrantFiled: September 12, 2019Date of Patent: April 13, 2021Assignee: BITMAINTECH PTE. LTD.Inventors: Wei Yu, Jiahai Su, Linlin Zheng
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Patent number: 10973152Abstract: The present disclosure provides a cooling system. The cooling system includes: a first set of fans mounted on an inward-facing side of an air inlet on an outer shell of a case; a second set of fans mounted on an inward-facing side of an air outlet on the outer shell of the case, for generating, in cooperation with the first set of fans, a high-pressure airflow from the air inlet to the air outlet; a first heat sink connected to heat generating component in the case, for absorbing heat from the heat generating component and transferring the absorbed heat to a second heat sink; and the second heat sink mounted on an inward-facing side of the second set of fans and cooled by the high-pressure airflow.Type: GrantFiled: January 8, 2019Date of Patent: April 6, 2021Assignee: TUSIMPLE, INC.Inventor: Zhihua Ma
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Patent number: 10966353Abstract: A centralized cooling system for data center comprises at least one cabinet, a spray hydraulic device and a hydraulic working substance cooling equipment integrated outside the cabinet, and an outer liquid working substance tank, which are connected by a pipe, wherein the cabinet comprises an auxiliary cabinet, a server cabinet, a liquid inlet pipe, and a return pipe; wherein an inner liquid working substance tank, a main pipe and a pipe distributor are arranged inside the auxiliary cabinet; a server and a plurality of spraying mechanisms are arranged inside the server cabinet; the liquid working substance sprayed from the spraying mechanisms is returned to the outer liquid working substance tank through the return pipe, cooled down by means of the spray hydraulic device and the hydraulic circulating cooling device, and enters the inner liquid working substance tank, and the liquid working substance has no phase transition during the spraying process.Type: GrantFiled: February 23, 2017Date of Patent: March 30, 2021Assignee: GUANGDONG HI-1 NEW MATERIALS TECHNOLOGY RESEARCH INSTITUTE CO., LTD.Inventor: Wei Wang
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Patent number: 10966331Abstract: The present specification discloses systems, devices, and methods provide a mounting system which includes rail and a bracket which is selectively secured to the rail. The bracket is selectively and/or automatically locked to the rail when positioned on the rail, and may be removed from the rail by activating one or more buttons or actuators. The disclosed mounting systems, devices, and methods enable a device to be protected from impact and moisture exposure, enable a device to be securely mounted on a base, and/or enable a device to be quickly secured and removed from a base.Type: GrantFiled: January 22, 2020Date of Patent: March 30, 2021Assignee: Core-Arms, LLCInventor: David Roth
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Patent number: 10948951Abstract: A card/chassis coupling system includes a chassis defining a chassis housing with a chassis wall defining a card entrance to the chassis housing. The chassis wall engages a securing element on a card to secure it in the chassis housing. A card/chassis release device adjacent the card entrance includes a base in the chassis housing, and a card mover member and securing element release member that are each moveably coupled to the base and to an actuator member extending through the chassis wall. Movement of the actuator member into the chassis housing causes the securing element release member to move relative to the base to engage the securing element on the card and disengage it from the chassis wall, and causes the card mover member to move relative to the base to engage the card and move it through the card entrance and out of the chassis housing.Type: GrantFiled: January 31, 2020Date of Patent: March 16, 2021Assignee: Dell Products L.P.Inventors: Wei Dong, Haifang Zhai, Xiaoping Wu, Yujie Zhou
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Patent number: 10939581Abstract: An immersion liquid cooling tank rack for heat-generating components includes immersion liquid cooling tanks for containing a coolant liquid. Horizontal extendable slide rails are mounted on opposing side faces of each tank and on opposing side walls of the rack. The horizontal extendable slide rails are movable between a closed position and an extended open position to allow the tanks to slide horizontally in and out of the rack. Support structures are mounted to the base of each of the immersion liquid cooling tanks. Each support structure includes a wheel assembly disposed at the base of the support structure. The support structures extend from the base of the tank to a floor surface supporting the rack. The horizontal extendable slide rails and the support structures substantially support an operational immersion liquid cooling tank during a horizontal translation of the tank between the closed position and the extended open position.Type: GrantFiled: April 24, 2020Date of Patent: March 2, 2021Assignee: QUANTA COMPUTER INC.Inventors: Chao-Jung Chen, Yu-Nien Huang, Yung-Hsiang Lu
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Patent number: 10939592Abstract: A liquid cooling system is described. The liquid cooling system includes a heat sink to provide a warmed liquid. The heat sink is to receive heat generated by at least one semiconductor chip of an electronic system. The liquid cooling system includes a heat exchanger to receive the warmed liquid and to provide a cooled liquid. The liquid cooling system includes a pump. The pump is to draw the cooled liquid at the pump's input so that respective pressures of the warmed and cooled liquids' are less than atmospheric pressure.Type: GrantFiled: June 14, 2019Date of Patent: March 2, 2021Assignee: Intel CorporationInventors: Javier Avalos Garcia, Michael Berktold, Luz Karine Sandoval Granados, Adriana Lopez Iniguez
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Patent number: 10932390Abstract: An immersion tank includes a tank main body configured to store a coolant, at least one first air bag that is provided in the tank main body, that is coupled to a bottom portion of the tank main body, that is able to be inflated toward an upper portion of the tank main body, and that is able to be deflated, from an inflated state thereof, toward the bottom portion, and a guide member that is provided outside the at least one first air bag in the tank main body and that is configured to guide the at least one first air bag during the inflation and the deflation of the at least one first air bag.Type: GrantFiled: February 7, 2020Date of Patent: February 23, 2021Assignee: FUJITSU LIMITEDInventor: Masayuki Korikawa
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Patent number: 10925188Abstract: Self-contained server assemblies for housing servers or server blades and associated computing facilities are disclosed herein. In one embodiment, a server assembly includes an enclosure having an interior space housing a server blade, a dielectric coolant submerging heat producing components of the server blade, and a condenser assembly having a condenser coil in fluid communication with a vapor gap in the interior space. The condenser coil is configured to receive a coolant that removes heat from a vapor of the dielectric coolant in the vapor gap, thereby condensing the vapor into a liquid form to be returned to the server blade.Type: GrantFiled: November 11, 2019Date of Patent: February 16, 2021Assignee: Microsoft Technology Licensing, LLCInventors: Nicholas Keehn, Robert Jason Lankston, Husam Alissa
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Patent number: 10925186Abstract: Embodiments are directed to an assembly including a bay structure including a bay structure that defines a bay for receiving a pluggable module and including sides and a front plate rotatably connected to the sides, a connecting bracket coupled with the bay structure, and a heat transfer device coupled with the bay structure. The bay structure, the heat transfer device, and the connecting bracket are configured such that rotating the front plate from a first position to a second position displaces the connecting bracket in a first direction which causes the connecting bracket to displace the heat transfer device in a second direction transverse to the first direction.Type: GrantFiled: May 15, 2019Date of Patent: February 16, 2021Assignee: Hewlett Packard Enterprise Development LPInventors: David A. Selvidge, Pinche Tsai, Minh H. Nguyen
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IT container system design approach for fast deployment and high compatibility application scenarios
Patent number: 10925180Abstract: An IT enclosure and immersion cooling unit is disclosed. The unit comprises: an immersion cooling area to accommodate electronic devices that require cooling, the electronic devices being immersed in coolant; an heat exchanger; an coolant supply line to supply cooler coolant from the heat exchanger to the immersion cooling area; and an coolant return line to return warmer coolant from the immersion cooling area to the heat exchanger, wherein the cooler coolant absorbs heat from the electronic devices in the immersion cooling area and turns into the warmer coolant, wherein heat is extracted from the warmer coolant in the heat exchanger and transferred to external coolant, and wherein the heat exchanger, the coolant supply line, and the coolant return line are packaged within the immersion cooling unit.Type: GrantFiled: March 4, 2019Date of Patent: February 16, 2021Assignee: BAIDU USA LLCInventor: Tianyi Gao -
Patent number: 10917999Abstract: The present disclosure provides a power module, a power module assembly and an assembling method thereof. The power module assembly includes a housing, a resilient bracket, a circuit board, a power device and a fastening unit. The housing includes a first heat-dissipation surface. The resilient bracket is pre-fastened on the housing. The resilient bracket is located near the first heat-dissipation surface and configured with the first heat-dissipation surface to form an accommodating space. The circuit board is configured to assemble on the housing. The power device is plugged in the circuit board and accommodated in the accommodating space. The fastening unit is pre-fastened on the housing and pressing the resilient bracket. While the resilient bracket pushes against the power device, the power device is attached to the first heat-dissipation surface.Type: GrantFiled: April 13, 2018Date of Patent: February 9, 2021Assignee: DELTA ELECTRONICS (THAILAND) PUBLIC COMPANY LIMITEDInventors: Zhenrong Huang, Peiai You, Hao Sun
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Patent number: 10915153Abstract: The present invention is a docking station that consists essentially of two cradle arms and a central cradle portion including one or more temperature control units. It may include a case configured to allow heat transfer between a mobile device and the temperature control units. It may include both a heating element and a cooling element, wherein each of the elements are configured to engage at particular temperatures. It may include control units and temperature sensors. The cradle arms may include upper cradle hooks and lower cradle hooks to securely hold a mobile device. The case may be configured to securely receive the cradle hooks. The cradle arms may include upper and lower portions that are spring coupled. The docking station may include one or more locks that lock the upper and lower arm portions in their relative positions to prevent theft of a docked mobile device.Type: GrantFiled: October 31, 2018Date of Patent: February 9, 2021Inventor: Joseph Todrzak
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Patent number: 10912222Abstract: A cooling system includes: a cooling device; a pump coupled to the cooling device; and a waste heat device coupled to the cooling device, wherein the cooling device includes: a first refrigerant tank and a second refrigerant tank that each stores a first refrigerant that is output from the waste heat device and input to the waste heat device; and a liquid immersion tank sandwiched between the first refrigerant tank and the second refrigerant tank and configured to hold an electronic device in a second refrigerant that is output from the pump and input to the pump.Type: GrantFiled: September 4, 2019Date of Patent: February 2, 2021Assignee: FUJITSU LIMITEDInventors: Satoshi Inano, Hiroyuki Fukuda, Minoru Ishinabe, Yukiko Wakino
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Patent number: 10908270Abstract: An ultrasound imaging system includes a thermally conductive frame and a number of electronic components and a display that are sealed within the frame. The frame further includes a plenum extending through the frame with surfaces that are thermally coupled to the electronic components and the display. An active cooling mechanism, such as one or more fans, moves air through the plenum to remove heat generated by the electronic components and display. The plenum is environmentally sealed so that moisture, dust, air or other contaminants drawn into the plenum do not contact the sealed electronic components and display in the frame.Type: GrantFiled: January 18, 2018Date of Patent: February 2, 2021Assignee: FUJIFILM SONOSITE, INC.Inventor: Rahul Gupta
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Patent number: 10912229Abstract: A cooling system and a multi-function heat exchanger design for electronics racks has one or more liquid-to-liquid heat exchangers (or their functions) and one or more liquid-to-air heat exchangers (or their functions). Each liquid-to-liquid heat exchanger has a rack-liquid channel, and an external-liquid channel, the rack-liquid channel and the external-liquid channel being fluidly isolated from each other, and thermally coupled to each other to transfer thermal energy between rack-liquid that circulates through the rack-liquid channel and external-liquid that circulates through the external-liquid channel. The one or more liquid-to-air heat exchangers each have an air path that circulates air between the electronics racks and ambient space around the electronics racks, the air path being thermally coupled to an external-liquid channel of the liquid-to-air heat exchanger to transfer thermal energy between the air and the external-liquid.Type: GrantFiled: August 15, 2019Date of Patent: February 2, 2021Assignee: BAIDU USA LLCInventor: Tianyi Gao
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Patent number: 10893743Abstract: A portable computing tablet holster comprising a handle assembly attached to a portable computing tablet retention assembly. The portable computing tablet retention assembly is adapted to retain a portable computing tablet therein using a pair of elongated retention channels extending along opposite elongated edges of a tablet rear support panel. The tablet is retained by a lateral retention channel extending along a lateral edge and at least one flexible retention element located proximate an opposite lateral edge thereof. The handle assembly can be rigidly fixed to the rear panel or moveably assembled to the rear panel. Movement between the handle and the rear panel can include a sliding movement, a rotating movement, and/or a pivoting movement. A user input device can be integrated into the handle for controlling at least one of a light and/or a camera integrated into the holster, the tablet, and the like.Type: GrantFiled: June 12, 2018Date of Patent: January 19, 2021Inventor: Dimitri Girault
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Patent number: 10897826Abstract: A cover window of a flexible display device includes a base substrate including an out-folding area, an in-folding area, and peripheral areas disposed on opposing sides of at least one of the out-folding area and the in-folding area, a first hard coating layer at a top surface of the base substrate, the first hard coating layer having a substantially uniform thickness, and a second hard coating layer at a bottom surface of the base substrate opposite to the top surface, the second hard coating layer having a thickness different from the thickness of the first hard coating layer. A thickness of a first area of the second hard coating layer that overlaps with the out-folding area and the in-folding area of the base substrate is less than a thickness of a second area of the second hard coating layer that overlaps with the peripheral areas of the base substrate.Type: GrantFiled: July 25, 2019Date of Patent: January 19, 2021Assignee: SAMSUNG DISPLAY CO., LTD.Inventors: Jae-Hoon Jung, Jong-Whan Cho, Suk-Man Yang, Young-Sik Yoon, Jong-In Lee