Abstract: A supporting structure of optimized volume includes at least two vertical structural elements having a front face and a rear face. Modules including electronic equipment items are fixed onto the front face of the vertical structural elements. Use in particular can be for the integration of avionics modules on aircraft.

Abstract: Provided is an electronic component (13) that can be miniaturized while including a cooling structure. The electronic component includes an electronic component main body (13a), a bus bar (31) arranged inside the electronic component main body, and a heat dissipating member (40) embedded in the electronic component main body and having one end face thermally in contact with the bus bar and the other end face exposed to an outside of the electronic component main body.

Abstract: A circuit board includes an upper surface, a lower surface, a first end surface connecting the upper surface and lower surface, and a heat dissipation block. The first end surface of the circuit board has an open slot, the open slot extending through the upper surface and lower surface, and the heat dissipation block being arranged inside the open slot. The heat dissipation block has a first surface, the first surface facing away from the lower surface of the circuit board and extending to the first end surface of the circuit board. The inside of the open slot has a stop structure, the stop structure preventing the heat dissipation block from moving toward the first end surface of the circuit board.

Abstract: A temperature regulating mount for portable electronic devices is provided that includes a temperature control unit for preventing portable electronic devices from reaching critical temperatures during operation to avoid undesired shut down of the electronic device. The mount is further accompanied by a protective perimeter casing for protecting the electronic device and allowing the device to mate with a universal mount. The perimeter casing leaves the back of the device open or exposed (e.g., through webbing) for temperature control. The protective perimeter casing includes grooves and indents for mating with guide rails and a movable clamping mechanism for securing the electronic device to the mount in a particular orientation to maximize the mount's ability to regulate the temperature of the electronic device.

Abstract: An electrical junction box includes: a circuit board on which an electronic component having a main body is mounted on a mounting surface; a frame inside of which the circuit board is accommodated; a cover portion covering the circuit board from the mounting surface side; and a heat transfer member disposed between the main body and the cover portion, and the frame includes a heat transfer member holding portion holding the heat transfer member at a position where the heat transfer member is in heat conductive contact with both the main body and the cover portion.

Abstract: A power-module assembly includes a plurality of power modules each including a power stage having a substrate and a transistor-based switching arrangement supported on the substrate. The power modules are arranged in a stack that defines coolant chambers interleaved with the power stages and defines a pair of coolant-supply manifolds disposed on opposing sides of the stack and extending along a length of the stack. For each power module, the substrate defines a network of cooling channels connecting the supply manifolds to a corresponding one of the chambers. The network includes first channels each configured to receive coolant from the pair of coolant-supply manifolds, second channels substantially parallel to the first channels and each opening into the corresponding one of the chambers, and third channels crisscrossing the first and second channels to connect the first and second channels in fluid communication.

Abstract: In an example implementation, an expansion card assembly includes a low-profile expansion card, a card cooler attached to the card to force air over the card, and an airflow guide attachable to the card to direct forced air from the card cooler out of a full-height computer enclosure.

Abstract: A cabinet is provided, including a case and a fin element. The case has at least one opening. The fin element is disposed in the case and is adjacent to the at least one opening and includes a main body and a plurality of fins, wherein the fins are disposed on the main body and face the at least one opening.

Abstract: A self-installing connector for a liquid cooling system of a datacenter component rack system. A datacenter component rack may include manifolds for conveying coolant to or from one or more datacenter electronic components for liquid cooling components of the datacenter electronic component. The self-installing connector provides a fluid connection between the manifold and a liquid cooling system of a datacenter electronic component. The self-installing connector may puncture the manifold at the time the datacenter electronic component is installed. The self-installing connector may form an opening in the manifold and secure one end of the self-installing connector into the opening upon installation of the datacenter electronic component into the datacenter component rack. The self-installing connector can separate at a dripless quick-disconnect coupling for datacenter electronic component maintenance.

Abstract: A cover window of a flexible display device includes a base substrate including an out-folding area, an in-folding area, and peripheral areas disposed on opposing sides of at least one of the out-folding area and the in-folding area, a first hard coating layer at a top surface of the base substrate, the first hard coating layer having a substantially uniform thickness, and a second hard coating layer at a bottom surface of the base substrate opposite to the top surface, the second hard coating layer having a thickness different from the thickness of the first hard coating layer. A thickness of a first area of the second hard coating layer that overlaps with the out-folding area and the in-folding area of the base substrate is less than a thickness of a second area of the second hard coating layer that overlaps with the peripheral areas of the base substrate.

Abstract: This application relates to an enclosure for a portable electronic device is described. The enclosure can include metal bands included along the enclosure and a support structure. The support structure can include a thermally conductive core that is capable of conducting thermal energy generated by the operational components and rails that are bound between the metal bands and the thermally conductive core, where the rails are characterized as having a rate of thermal conductivity that is less than a rate of thermal conductivity of the thermally conductive core so that the thermal energy generated by the operational component is directed away from the operational component and away from the metal bands.

Abstract: Apparatuses, systems, and associated methods of manufacturing are described that provide a cooling system for network connections. An example system includes a networking cage assembly that receives a networking cable and a water block that circulates water. The system includes a thermal unit that includes a thermal medium. The thermal medium defines a static end that thermally engages the water block and a dynamic end opposite the static end that is disposed within the networking cage assembly. In an operational configuration in which the networking cable is received by the networking cage assembly, a portion of the dynamic end thermally engages the networking cable so as to dissipate heat from the networking cable to the thermal medium, the thermal medium conducts the heat from the dynamic end to the static end, and the static end dissipates heat from the thermal medium via thermal engagement with the water block.

Abstract: A display-equipped controller includes a display device, a first junction configured to electrically connect the display device and a main board, a radiator disposed opposite from the display device with respect to the main board, an attaching structure attaching the main board and the radiator to the display device, a support structure disposed between the display device and the main board and configured to detachably support a control board, and a second junction configured to electrically connect the main board and the control board supported by the support structure.

Abstract: An electrical-circuit assembly includes an electrical-device and a heat-sink. The heat-sink has a base having a first-surface and a second-surface. The first-surface is in thermal communication with the electrical-device. The heat sink also has a lid having a third-surface and a fourth-surface. The third-surface faces toward the second-surface. The heat sink also has side-walls disposed between the base and the lid extending from the second-surface to the third-surface. The base, the lid, and the side-walls define a cavity. The heat sink also has a porous-structure extending from the second-surface toward the third-surface terminating a portion of the distance between the second-surface and the third-surface thereby defining a void between the porous-structure and the third-surface. The base, the side-walls, and the porous-structure are integrally formed of a common material. The porous-structure is characterized as having a contiguous-porosity network.

Abstract: A heat dissipation device comprises a generally rectangular metal cooling plate; the metal plate comprises, on its upper face, first attachment means for attaching a first printed circuit board, which means are provided for bringing at least one heat-generating zone of the first printed circuit board to bear with the upper face of the plate; the metal plate comprises, on its lower face, second attachment means for attaching a second printed circuit board, which means are provided for bringing at least one heat-generating zone of the second printed circuit board to bear with the lower face of the plate.

Abstract: A phased array antenna in which a plurality of blocks each having a plurality of transmitter modules are arrayed, includes: a front plate that includes a plurality of flow paths of a refrigerant therein; and an element feeding layer that includes a plurality of antenna elements respectively connected to the transmitter modules and that is placed in close contact with one surface of the front plate. Each of the blocks includes a heat spreader that is placed in close contact with the other surface of the front plate. The transmitter modules are mounted on the heat spreader. Heat generated in the transmitter modules is transferred to the refrigerant via the heat spreader and the front plate.

Abstract: A cooling device for surveillance system includes: an outer housing surrounding a surveillance camera; and a blower positioned on an outer surface of the outer housing and configured to generate cooling air flowing along the outer surface of the outer housing.

Abstract: A cooling mount for portable electronic devices is provided that includes a cooling unit for preventing portable electronic devices housing the cooling mount from reaching critical temperatures during operation to avoid undesired shut down of the electronic device.

Abstract: A display device includes a display panel to display an image; a heat radiating member at a side portion of the display panel and including a first adhesive layer, a second adhesive layer, and a heat radiating layer between the first adhesive layer and the second adhesive layer; and a heat generating member overlapping the display panel and the heat radiating member when viewed in a plan view, and the heat radiating member includes a first area overlapping the heat generating member and a second area adjacent to the first area when viewed in a plan view, the first adhesive layer and the second adhesive layer are connected to each other through a plurality of through holes defined through the heat radiating layer, and the plurality of through holes includes a through hole in the second area.

Abstract: In one embodiment, an apparatus includes a fan for cooling electronics within a chassis, the fan comprising a rotor with a plurality of fan blades connected thereto for generating an axial airflow during operation of the fan, a sensor for detecting failure of the fan, and an airflow blocking device positioned at an exhaust side of the fan and configured to prevent airflow through the fan upon detection of the fan failure, wherein the airflow blocking device is stowed in a position removed from a path of the axial airflow generated by the fan during operation of the fan. A method for preventing airflow recirculation at a failed fan is also disclosed herein.